Warm Electronics: Overview, Interfaces, Grounding and EMC

1
Warm Electronics Overview, Interfaces, Grounding
and EMC
PACS IHDR

• Martin von Berg

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Warm Electronics Overview
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Warm Electronics Redundany
4
PACS AVM ILT WE Set-up
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Grounding

• PACS System Grounding Concept consolidated
• PACS System Grounding Doc. PACS-ME-LI-006 via
  CR-0018 updated. Next issue to be released until
  30.11.2003 (in response to Astrium comments).
• Verification Matrix will be provided
• Spectrometer Detector chain Grounding is still
  adaptable after EQM Testing
• Photometer Detector chain was analysed (verify
  Doc. SAp-PACS-DS-0010/0011-02)

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EMC

• PACS EMC Control Plan is to 30 ready. Final
  version end of this year
• All Test Procedures and Sequences will be
  provided
• Verification Matrix will be provided
• CEA EMC Analysis triggered RfW-004 to reduce
  incident H-Field ? RfW rejected
• Some EMC testing already done (Chopper, SPU
  CE-CM, DPU DC/DC, 1355 I/F)
• Main constraint poor EMC representativity of the
  CQM ILT PACS set-up

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EMC Preparation for EQM ILT

• MPE EMC Measurements
• Set-up different to PFM and EQM PACS
• Cryostat, harness length, WU Box dimensions, PS
• External PS (DMC and BOLC), only DPU FFF
• Only Conducted Measurements feasible
• Astrium EQM EMC Measurements
• Long harness between external PS not possible
• EQM Cryo Harness longer than PFM CH
• Refurbished ISO Cryostat will be used
• EGSE environment different to S/C
• Cryostat closed (but main coupling through
  harness)