Electronics Status

1
Electronics Status

• Philippe Farthouat
• CERN
• ATLAS Plenary June 25, 2004

2
Outline

• Production of ASICs
• Production of Front-end Systems
• Production of Back-end Systems
• Production of Power Supplies
• TTC issues
• Radiation hard electronics
• Infrastructure
• EMC in ATLAS
• Next developments
• Summary

3
Production of ASICs
4
Production of ASICs (cont)
5
Production of ASICs. Comments

• All ATMEL (DMILL) wafers have been delivered
• TRT ASDBLR
• 55 parametric yield (Enough for the complete
  detector)
• Test injection capacitor failures observed
• LArg wafers
• Good yield for all the chips
• Dispute with ATMEL not yet finished but out of
  our control
• Two ASICs on the critical path
• RPC CMA which required a major redesign because
  of a change in the RPC cable lengths (input
  adjustment pipeline too short)
• Submitted now and expected end of the year
• TGC Slave Board ASIC (SLB)
• Last iteration received this summer needs a fix.
  Resubmitted and expected this month

6
Front-end Systems (1)

• All systems are either in full production or
  starting it
• PRR done for most of them
• To be noticed
• Liquid Argon Calorimeter
• 58 Front-end crates
• More than 2000 custom boards
• Very complex boards (in particular the FEB)
• Tile Calorimeter
• Production to be finished before next March
• MDT Chambers
• All the mezzanine boards produced

7
Front-End Systems (2)

• TRT
• Barrel front-end boards
• Available for all barrel modules
• 14 layers with buried vias
• fpBGA on both sides
• End-cap front-end boards
• Pre-production on-going

8
Front-End Systems (3)

• Test stand of the LArg FEB

9
Back-end Electronics (ROD)

• Pixel-SCT PRR passed
• Production to start now
• TRT full scale prototype available
• Successfully used in the test beam
• Change in the read-out granularity to be done to
  allow a complete staging of the C-Wheels
  electronics
• Double-density ROD to save money

10
Back-end Electronics (ROD)

• LARG/Tile
• PRR done
• MDT ROD
• On-going redesign based on FPGA SHARC
• Design finished
• Lay-out to be done
• Expected prototype end of this year

11
Power Supplies (1)

• Radiation hard STm Voltage regulators
• Positive and Negative versions available
• Available through CERN store
• Last negative version not yet delivered
• CERN store enquiring
• 2004 should have been the last year to order
  these components. Well still be able to order
  next year

12
Power Supplies (2)

• Pixel
• Power supplies (LV and HV) in USA15 and US15
• ST regulators at patch panel 2 level
• FDR last June
• Commercial devices
• Good candidates for LV and HV from WIENER, CAEN
  and ISEG
• SCT
• Power supplies in USA15 and US15
• Production on-going
• HV modules in Krakow (problem with a failure mode
  being fixed)
• LV modules in Prague
• TRT
• LV in UX
• Good candidates from Wiener or CAEN
• Tendering process started Market survey done
  and tender to be issued soon (by PH-ESS)
• HV in USA15
• Price enquiry out soon to about 10 companies
• Several candidates (CAEN, Dubna, ISEG)

13
Power Supplies (3)

• LArg LV
• DC-DC converters close to the calorimeter
• 280V DC input
• 250 kW total
• Production starting
• End in July 2005
• Very long development to obtain a device
  sufficiently radiation-hard
• LArg HV
• Power supplies from ISEG
• Production done
• A problem with broken capacitors being
  investigated

14
Power Supplies (4)

• Tile HV
• Bulk supply and distributor in the drawers
• Production on-going
• Tile LV
• DC-DC in the fingers
• Design finalised
• A few boxes in production
• Still some radiation tests to be done
• PRR expected late fall
• Muon System
• Same scheme for all chambers
• Commercial power supplies in UX15
• CAEN and Wiener are very good candidates
• Granularity adapted to the cost
• Several chambers/layers per power supply (both HV
  and LV)
• Tender in preparation

15
TTC Issues
TiTiSee
16
TTC issues

• TTC components in the pit
• It is the responsibility of level-1 team to
  provide (and pay for) to each system the TTC
  components from the TTCvis up to the end of the
  fibres
• TTCvi, TTCxx, Fibres, TTCoc
• It is responsibility of level-1 to provide to
  each system the pin diodes, TTCrx and QPLL. These
  devices are paid by the systems
• TTCrx, Pin diodes available (56 ChF and 9 ChF)
• TTC components for test systems
• Test beam, commissioning stands, lab set-up
• Requests through the electronics co-ordinators
• Each sub-system should have given its needs about
  a year ago
• Some needs are not yet covered
• Last order of components

17
QPLL Problems (1)

• Because of the protocol used by the TTC, the
  extracted clock at the receiving end (TTCrx) has
  some jitter
• 30 100 ps rms depending on traffic on the
  B-Channel
• This jitter is too high for the Gbit link
  serialisers or some LVDS serialisers
• QPLL is a PLL driven by a crystal oscillator and
  it filters the jitter on the clock delivered by
  the TTCrx
• Jitter less than 100 ps peak-to-peak
• It recently appeared that in about 25 of the
  cases a huge jitter (3 ns) appears at certain
  frequency and/or temperature
• Low frequency drift ? does not disturb the Gbit
  Links
• Destroys any timing measurement
• Very serious problem for the ATLAS LArg
• So far only ATLAS LArg has reported on this
  problem

18
QPLL Problems (2)
Bad one
Good one
19
QPLL Problems (3)

• On-going effort to try and understand this
  problem
• Extensive measurements made by the engineer in
  charge of the TTC with the help of Stefan Simion
  (LArg)
• Two engineers in the CERN MIC group running
  extensive simulation and trying different
  solutions
• Quite a lot of power injected in the crystal
• Addition of extra capacitance or resistance cure
  the problems but
• Addition of a sufficiently high value resistor
  increases the high frequency jitter at a level
  which could disturb the Gbit Links
• Addition of capacitors reduces the working
  frequency range (still OK for us)
• An engineer from the company which delivered the
  crystals is investigating
• No results yet and interaction a bit slow
• LArg (Nevis) has contacted another company
• Samples measured at CERN with QPLL. All (almost)
  OK (only 3 devices measured)
• Problem to be solved asap as it blocks the LArg
  front-end boards production

20
Radiation Hardness (1)
Report from Francis Anghinolfi

• Components pre-selection ? 99 achieved
• Missing
• Some Pixel and TRT PP2 electronics
• One FPGA on MDT CSM Board
• RPC Coincidence Matrix (ASIC)
• Production qualification ? 72 achieved
• Missing
• Pixel Production going on
• TRT PP2
• LArg Optolink
• MDT CSM
• EC MDT Alignment
• TGC 50 production
• RPC 50 production

Fully Completed - SCT - CSC - TILE CAL - Barrel
MDT Alignment
21
Radiation Hardness (2)

• Power Supplies
• All components pre-selection achieved
• No production phase presently started up
• LARG PS PRR done 2 pre-series units Nov04
• TILE CAL PRR Q404
• Muon LV/HV commercial devices
• Validation of the production to be organised

22
Radiation Hardness (3)

• We should be careful about qualification of Power
  Supplies (schedule)
• It appears some late electronics developments
• E.g. Pixel and TRT PP2 boxes
• Single component added at the last minute on PCB
  should be identified
• E.g. protection devices
• Verification Process during installation or
  commissioning (incl. safety/monitoring devices,
  crane control, cooling/cryogenics control, etc )
  to be defined

23
Infrastructure
Report from Georges Blanchot

• USA15. Levels 1 and 2, transformers and
  switchboards
• 250 racks are in place, ready to receive power
  and equipment
• Power distributed with CANALIS bus-bars 800A
  (500 kW) primary, 160A (170 kW) secondary
• On the critical path now
• UX15. HS structures, levels 0 to 8
• Need to specify power requirements and to update
  the EMDH database
• First round with responsibles of racks done
• Standard switchboards and cabling
• Not on the critical path now

24
Power to Racks in USA15

• The power distribution is made of
• Canalis busbars
• Carry the power to the rack
• Control bus
• Control bus to communicate with the Twido box
• Twido box
• On/Off and other monitoring functions with a
  TWIDO PLC connected to control bus
• Distribution Box
• 3 plugs for racks, mono or triphased versions,
  with remote control of the switch
• 1 auxiliary plug
• 1 plug for ventilation unit

25
USA15 Racks Room

• Where required, temporary plugs will be
  supplied ASS on level 2, DCS on level 1. General
  services plugs are already in place
• Some racks require UPS/Diesel, installed at a
  later stage. Must run on temporary plugs DCS,
  DSS, ASS

• First branch to get power level 1, 4 rows,
  including Tilecal, end october
• Once working, all other branches to be installed
• Next milestone LArg needs its racks in February
  05
• Cooling parts (turbines, deflectors, heat
  exchangers) january 2005

26
UX15 Racks

• Need to define power requirements.
• Need to form power groups of racks.
• Too little information on EMDH first round of
  enquiries done by email.

27
Summary Infrastructure

• Electrical distribution to USA15 in progress
• Power is delivered on the basis of data available
  in EMDH
• ? System must make sure this is up to date
• Tilecal to get power by end october
• ? Others by end november
• Cooling parts ordered and to be delivered (and
  installed) in January 05
• Confirm power needs for racks in UX15
• Rack configuration in EMDH too
• ? Systems must fill in the Rack Wizard database
  here also
• Preliminary data available

28
ATLAS EMC Policy
Reference document is available
at https//edms.cern.ch/file/476490/1/ATLAS-EMC-P
OLICY.pdf Additional Information is available
at http//atlas.web.cern.ch/Atlas/GROUPS/FRONTEND
/EMC/

• EMC Procedures in ATLAS
• Safety and Installation Report.? The setup must
  in all cases comply with the CERN safety rules.
• EMC Report.? The required noise performance must
  be achieved.? The system must not be a
  disturbance for other systems.
• Commissioning.? Insure that installlation is
  done as defined in steps 1 and 2.

29
EMC Issues Specific to ATLAS

• Grounding
• Large dimensions of the experiment ? long
  grounding wires
• Ground wire is a safety requirement
• Difficult to insure equipotentiality between
  detectors and their racks located 100 meter away
• Common mode noise
• Results from the long cables and limited ground
  equipotentiality
• Common mode noise radiates more than 103 times
  than differential mode noise
• Noise coupling mainly caused by CM emissions of
  cables
• Power cables to switched mode power supplies and
  other power equipment (motors, pumps)
• Digital transmission (fast transients) copper
  links, such as fieldbuses, serial buses, relays
• Near field
• Couplings mostly to happen in the near field
  region inside cable trays
• Distinguish electric (capacitive) and magnetic
  (induction) near field couplings
• Type of coupling conditions the type of shielding
  requirement
• Long Conductors
• Results in CM/DM conversions along the cable
  (multiconductor transmission lines analysis)
• Results in noise amplification and attenuation
  for given frequencies.
• Capacitive couplings between systems
• Electrically isolated detectors share large
  surface gaps capacitive coupling used by CM
  currents.

30
Measurements CM Emissions
31
Measurements Immunity
32
EMC Summary

• ATLAS EMC Policy
• Quality and risk management issue
• Establishes methods and procedures to insure the
  systems electromagnetic compatibility in the
  experiment environment
• Compliance requirements specific to the ATLAS and
  CERN environments
• Procedures
• Clear description of the setup
• To insure compliance with safety rules
• First document from LArg in approval process
• To define the valid configuration for EMC
  measurements
• EMC Measurements
• Specific for each system
• Started this summer (MDT in H8, Tile Cal)
• To understand how noise couples into a system and
  affects its performance, within the established
  compatibility limit
• Guidelines
• On grounding configurations, coupling modes,
  cable shields, shield terminations routing
  paths, test methods, tools

33
Future developments

• Although still very early, future developments
  for LHC upgrades have to be considered
• Main points to be looked at
• Which technology(ies) could be used
• Power management
• Does not aim at being a complete study of the
  situation but at pointing potential problems
  which may influence our working habits
• Most of the material presented from Sandro
  Marchioro

34
Technologies

• One of the possibilities is to continue very good
  relations with DSM vendors and to start looking
  at CMOS very deep sub-micron technologies
• 130 or 90 nm
• First evaluation of 130 nm shows that the
  radiation hardness is very good
• Linear transistors look very promising with minor
  weaknesses
• No guard-ring needed
• Sensitive charge smaller, higher SEU sensitivity
• NB without enclosed transistors, error rates can
  be considerably higher than for present 0.25mm
  designs
• Latch-up not observed and not expected to be a
  issue
• However there are difficulties

35
Cost

• We clearly cannot afford hundreds of
  developments and prototypes

36
Developments in 0.25µ
37
Cost comparison
From Sandro Marchioro
Assuming one iteration and ABCD type chip

• Clearly points towards
• Very few different designs produced in large
  quantity
• A single iteration

38
Power

• These technologies leak
• Without careful design the power will not
  decreased
• Nor the current (Vdd is going down)

39
Future Developments

• Cost of the new technologies will force us to
  co-ordinate the efforts
• Whatever the choice is, the power and the way of
  getting it inside the detector volume is a major
  problem which requires RD
• Not mentioned was the complexity (and cost) of
  the design tools
• Requires training and practice
• The existing expertise among the different
  institutes must be maintained

40
Summary

• Front-end ASICs
• All are produced except
• Pixel FEI which is still in production (no
  problems)
• CMA from the RPC which has just been submitted
• SLB from TGC which needed a fix
• Front-end systems
• All in production
• Several systems have started the
  production/procurement of power supplies
• Solutions exist for the others (Pixels, TRT,
  Muons)
• Radiation hardness validation not to be forgotten
• Radiation hard electronics
• Be careful that nothing is forgotten during
  installation
• EMC policy (Grounding and shielding) to be applied