Next%20Generation%20Laminator

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Next Generation Laminator Sponsors David Timpe,
Geno Amalfatino Advisor Dr. James Glancey
Team 13 Doug Brunner Adam Fauer Claire
Jones Michael Klein
Problem Current laminating processes encounter
high amounts of voids between a silicone adhesive
and a circuit board. Voids will not allow for
proper heat transfer and could cause the circuit
board to overheat.
Test Plan
Arlon Arlon is the manufacturer of Thermabond,
a silicone adhesive used to laminate circuit
boards to heat sinks. Arlon wishes to expand
sales of this product by introducing an improved
method of applying Thermabond.
Design of Experiments Design of Experiments Design of Experiments
Factors Arlon Senior Design Team
Laminator Type Vacuum Bag (current method) Next Generation Laminator (new method)
Laminate Sizes 12 tests of 6 in. x 8 in. 12 tests of 6 in. x 8 in.
Laminate Sizes 12 tests of 4 in. x 4 in. 12 tests of 4 in. x 4 in.
Number of Operators 2 2
Materials 0.125 in. glass / Thermabond / 0.125 in glass 0.125 in. glass / Thermabond / 0.125 in glass
Number of Lots of Thermabond 2 2
No. of Tests 24 24
70 Voids!
Our Solution

• A double chamber vacuum box in a clamshell design
  
• Heaters and coolers in the bottom half
• Pressure applied from the top half

Project Goal Our goal is to design an automated
process that will create a void-free bond between
a silicone adhesive, a circuit board and an
aluminum plate.
Laminator Open View
Workholding Frame
Current Technology

• Frame will hold circuit board above heat sink for
  first step of vacuum
• Springs will compress and lower the frame holding
  the circuit board onto the heat sink when
  pressure from top half is applied

Expected Performance
Want/Metric Senior Design Team
lt5 void Yes
Automantion Yes
0.005 inches accuracy Yes
Reaches 400ºF Yes
Reaches 50 psia Yes
Circuit Board
Laminator with Vacuum/Pressure Operation http//ww
w.meiki-ss.co.jp/e_lineup/e_mvlp.htm
Vacuum Bagging System http//torrtech.com
Initial Validation
Key Customer Wants and Metrics Void Reduction
5 or less Alignment Accuracy 0.005
inches Ease of Use Laminate boards up to 24
inches square Speed (temperature ramp rates)
12ºF/min heating 40ºF/min
cooling Temperature and Pressure Controls
400ºF max. 50 psia max.
Prototyped workholding fixed clamp frame proves
to hold a circuit board by the edges.
Acknowledgements We sincerely appreciate everyone
who has given us the opportunity to have a
successful senior design. Special thanks to our
sponsors at Arlon for their support in this
project. Also, thank you Ann Connor, Mr. Beard,
and Dr. Glancey for your guidance and instruction.
New design for workholding mechanism will retract
clamps.