Interconnect Estimation without Packing via ACG Floorplans

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Interconnect Estimation without Packing via ACG
Floorplans

• Jia Wang and Hai Zhou
• Electrical Computer Engineering
• Northwestern University
• U.S.A.

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Floorplan and Constraint Graph

• Horizontal and vertical constraint graphs
• At least one relation between any pair of
  modules. (1)
• There is redundancy in constraint graphs.
• Transitive edges. (2)
• Over-specification more than one relation
  between two modules. (3)
• (1)
  (2)
  (3)

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Reduce the Redundancy

• Remove all the transitive edges and allow exactly
  one relation between any pair of modules.
• Remaining edges form a total order on vertices.
• Quadratic number of edges are still possible