NCPs Meeting Brussels, 19 October 2006

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NCPs MeetingBrussels, 19 October 2006

• ICT Work Programme 2007-08Activities under
  Challenge 3 Erastos FilosDirectorate
  Components SystemsEuropean Commission,
  Brussels

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Presentation outline

• RD in electronics its key role for Europes
  competitiveness
• Challenge 3 rationale
• Foreseen activities under Call 1
• Foreseen activities under Call 2
• Joint Technology Initiatives a way to implement
  ETP Strategic Research Agendas

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The pervasiveness of electronics
Electronics underpins everybusiness sector
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Electronics Key to intelligent products

• Smarter products
• Electronic safety
• Driver customisation
• Resource-efficient products
• Fuel efficiency
• Info-mobility traffic management
• ICT-enabled disposal
• Value-adding services
• Active safety features
• Remote diagnostics assistance
• Infotainment travelguidance

By 2010, electronics software in cars will
account for up to 40 of their value
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Europe - losing the game ?

• Europe a net importer of electronics
• Aggressive global competition Asia 2/3 of world
  semiconductor market 3/4 share in investment
• A typical semiconductor fabrication facility
  costs 2.5 billion

Source European Semiconductor Industry
Association, 2005
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European microelectronics achievements

• World top-10 list of semiconductor companies
• 1990 1 European company
• 2004 3 European companies
• 2006 ?
• Equipment
• Wafer processing
• 5 European SMEs on top 10 list
• Europes big 2 (ASML and ASM Intl)on top 10
• Assembly equipment
• 2 European companies on top 10 list
• Consensus building in nanoelectronics
• Strategic public-private partnership

VLSI Research 2003
www.eniac.eu
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Challenge 3Components, Systems, Engineering
To enable Europes industry to stay at the
forefront of electronics developments
applications through chip making, integration
embedded systems capabilities
www.eniac.eu
www.artemis-office.org
www.photonics21.de
www.smart-systems-integration.org
RD objectives are in line with Strategic
Research Agendas of European Technology Platforms
support international co-operation under the
Intelligent Manufacturing Systems initiative
cordis.europa.eu/ims
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Foreseen activities under Call 1
3.3.1.1 Next-Generation Nanoelectronics
Components Electronics Integration 3.3.1.2
Organic Large-Area Electronics Display
Systems 3.3.1.3 Embedded Systems
Design 3.3.1.4 Computing Systems
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Next-Generation Nanoelectronics Components
Electronics Integration

• Smaller, higher performance, lower cost
• More Moore
• Beyond CMOS
• Integration diversification
• SoC Systems-on-Chip
• SiP Systems-in-Package

Technology materials, processes, metrology,
interconnects, modelling, packaging, architectures
Design increased complexity, changed performance,
heterogeneity in SiP SoC, productivity
Design for Manufacturing
Manufacturing Cost-efficient, flexible production
for silicon lt 45 nm for SoC SiP 450 mm wafer
size small batch/fast cycle time equipment
assessment
Call 1 86 mn CP, NoE, CSA
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Organic Large-Area Electronics Display
Systems

• Organic large-area technologies
• Large-area low-cost manufacturing
• Advanced modelling, simulation circuit design
  characterisation
• Enabling functions
• logic, memory, e-paper, systems-on-tags, RFIDs,
  lab-on-chip, lighting, signage, energy
  scavenging/storage power management
• Advanced display systems
• Visualisation systems supporting
• Multi-viewer unaided, unrestricted 3D-viewing
  natural interaction
• Signal acquisition, processing representation
  for 3D-systems
• Portable display systems
• Zero-power displays, ruggedised displays
• Flexible/transparent devices
• Energy-efficient micro-projectors
• Lightweight high-resolution vision glasses

Call 1 63 mnCP, NoE, CSA
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Embedded Systems Design
Call 1 40 mn CP, NoE, CSA

• Target outcomes
• Theory methods for embedded systems design
• Key issues heterogeneity, composability,
  predictability adaptivity
• International cooperation is encouraged
• Suites of interoperable design tools for rapid
  design prototyping
• Research will contribute to interoperability of
  tools from SME vendors consolidating tool
  developers joint RD work pen tool frameworks
• Expected impact
• Increase system development productivity (at
  least 1 order of magnitude)
• Stimulate growth of European high-tech companies
  in the field
• Reinforce ST leadership in complex systems
  engineering

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Computing systems
Call 1 25 mn CP (STREP), NoE

• Target outcomes
• Novel architectures for multi-core computing
  systems
• Architectures system software for scalable
  customisable on-chip computing systems
  incorporating multiple networked, symmetric or
  heterogeneous, fixed or reconfigurable processing
  elements
• Key issues power performance versatility
  reliability availability
• Reference architectures for generic embedded
  platforms
• Key issues composability, networking,
  robustness/security, diagnosis/maintainability,
  resource management, evolvability
  self-organisation
• Expected impact
• Inexpensive generic platforms with high European
  added value enabling European supplier companies
  to increase market share
• Develop European competences in the use of
  high-end computing for the development of new
  applications
• European excellence in computing architectures,
  system software platforms

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Foreseen activities under Call 2
3.3.2.1 Photonic components subsystems
3.3.2.2 Micro/Nanosystems 3.3.2.3 Networked
Embedded Control Systems
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Photonic Components Subsystems
Components Subsystems
Application specific
Core


- Lasers solid-state sources - Image
sensors - New sensors

• Broadband core networks
• Broadband access LAN
• Medical diagnosis prevention
• Sensors for environment, safety security
  applications

Call 2 90 mnCP, NoE, CSA
Underlying technologies
Integration
Manufacturing
Design methodology tools
Complementary measures
Assessment of prototypes
Networking, integration structuring
Support measures
Consensus building RD strategies, int
cooperation
Access Expertise centres foundries
Education Young people graduates
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Micro/Nanosystems

• Next generation smart systems Sensor-
  actuator-based systems
• Nano-Bio-ICTechnologies convergence Biosensors,
  lab-on-a-chip, bioMEMS, autonomous implants
• Smart fabrics and interactive textiles
  Integration of intelligence in textile materials
• From smart systems to viable products
  Microsystems manufacturing technologies
• Innovative memory systems Emerging technologies
  for high density mass storage capacity
• Support actionsTechnology access, education and
  training, coordination dissemination at EU
  level

Call 2 83 mn CP, NoE, CSA
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Networked Embedded Control Systems

• Target outcomes
• Middleware platforms for embedded systems
• Key issues composability, minimum power
  consumption, openness
• Emphasis programmability, reconfiguration,
  privacy trust
• Cooperating objects and Wireless Sensor Networks
• Spontaneous cooperation of objects in spatial
  proximity
• Emphasis on new methods algorithms,
  hardware/software platforms for distributed
  execution programming tools for
  self-organising systems
• Control of large-scale complex distributed
  systems
• Key issues efficiency, robustness, safety,
  security
• Applications manufacturing plants,
  infrastructures
• Expected impact
• Enable entirely new services applications
• Make large infrastructures more efficient,
  flexible productive
• 100 plant availability, reduce maintenance
  accidents

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European Technology Platforms
A spiral model of innovation capitalising on the
multiple reciprocal relationships between public
private stakeholders at various knowledge
stages
30 European Technology Platforms launched so far

• Addressing major technological challenges in
  specific domains
• Aiming to leverage public private investment
  for RD innovation
• Involving key RD stakeholders
• eg industry, the research community public
  authorities
• Bundling fragmented RD efforts towards agreed
  goals
• Vision 2020 document Strategic Research Agenda

cordis.europa.eu/technology-platforms
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Joint Technology InitiativesA way to implement
a Strategic Research Agenda

• Emergence setting up
• Bottom-up process with key stakeholders in a
  specific domain
• Key deliverable Strategic vision document
• Definition of a Strategic Research Agenda
• Co-ordinated by an Advisory Council
• Consensus-based
• Deployment strategy
• Implementation of the Strategic Research Agenda
• Through collaborative research in FP7 with
  other resources, or
• Through a Joint Technology Initiative (JTI) which
  integrates funding sources, eg Framework
  Programme, transnational natl research
  programmes, industrial funding, 3rd party private
  finance

Commission Staff Working Paper, SEC(2005)800 of
10 June 2005 Status Report 2 of May
2006cordis.europa.eu/technology-platforms/further
_en.html
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For more information

• European research on the web
• http//cordis.europa.eu
• http//cordis.europa.eu/fp7
• http//ec.europa.eu/comm/research/future/
• Information Society and Media
• http//ec.europa.eu/information_society/
• http//cordis.europa.eu/ist
• Directorate G
• http//cordis.europa.eu/ist/directorate_g
• Contact
• erastos.filos_at_ec.europa.eu