2x2 module

1
2x2 module stave layouts
2
2 options

• Small chip
• Big chip
• Boundary between small and big is determined
  by the 6 sensor wafer layout that must be
  compatible with bump bonding (will become clear
  later)
• Small chip has also a more natural number of
  rows columns, but this is probably a minor
  issue for chip design.

3
Parameters
Normal col. width x row height 250um x 50um
cols total rows total ganged rows long cols Long col width
Small chip 64 324 0 0 0
Small 2x2 tile 128 654 6 4 450um
Small active edge 1x1 tile 64 324 0 2 450um
big chip 70 348 0 0 0
big 2x2 tile 140 702 6 4 450um
big active edge 1x1 tile 70 348 0 2 450um
4
Small 4-chip module
34.8
37.5
Flex down to chip w-bonds
0.2
Active 32.8 x 32.8
34.8
Pixel orientation
15.0
Flex pigtail (connector plugs into page)
10.0
(vertical inter-chip gap 0.1mm)
5
Big 4-chip module
37.1
39.9
Flex down to chip w-bonds
0.2
Active 35.8 x 35.1
37.8
Pixel orientation
15.0
Flex pigtail (connector plugs into page)
10.0
(vertical inter-chip gap 0.1mm)
6
Loaded module
stiffener
flex
1.0 mm
connector
sensor
chips
glue
Reduced scale
20 position connector would be used. Replace
10.22 dimension by 6.52
7
Small module outer stave
Module on back
38.4
26.8
34.8

986mm
End of stave card serving 8 modules (half a
stave) along Z Can serve one face only (top or
bottom) gt 4 cards per stave Or can be a
wrap-around end of stave card and serve both
faces gt 2 cards per stave. This way identical
staves (including bus cable) design can be used
over a wide radial range 4 cards/stave at lower
radius and 2 wrap-around cards per stave at
higher radius
8
Big module outer stave
Module on back
39.9
29.8
37.8

946mm
End of stave card serving 7 modules (half a
stave) along Z (or 8 modules for 1082mm active
length) Can serve one face only (top or bottom)
gt 4 cards per stave Or can be a wrap-around end
of stave card and serve both faces gt 2 cards per
stave. This way identical staves (including bus
cable) design can be used over a wide radial
range 4 cards/stave at lower radius and 2
wrap-around cards per stave at higher radius
9
Small sensor 6 inch wafer

• Active area 7508 mm2
• Sensor tiles shown with darker line
• Wafer scale flip chip compatible. Chips shown
  with lighter line.
• The name small 2x2 tile comes from the wafer
  layout.
• A slightly larger chip and therefore larger 2x2
  tile is possible, but only 6 such large 2x2
  tiles will fit on a 6 wafer.

10
Big sensor 6 inch wafer

• Active area 7539 mm2
• Sensor tiles shown with darker line
• Wafer scale flip chip compatible. Chips shown
  with lighter line.
• OPTION to make 4 6-chip modules per wafer instead
  of 6 4-chip modules.

11
Small single chip module

• Using same chip as 4-chip module (hence small)
• Active edge sensor
• 2-side abuttable format

active
16.4
16.2
18.7
16.2
12
Big single chip module

• Using same chip as 4-chip module (hence small)
• Active edge sensor
• 2-side abuttable format

active
17.9
17.4
19.9
17.7