Reliability of Embedded Active Assemblies-FY07

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Reliability of Embedded Active Assemblies-FY07
PCK-3
Photograph of OpAmp

• FY07 Plans
• Task 1
• JPL will use the assembly process developed
  previously at Auburn to embed single devices
  within flexible LCP. This will be performed to
  ensure the transferability of this technology.
• JPL will thermal cycle the assemblies from -55 to
  125C until failure or project end date,
  whichever occurs first. FA will be performed in
  an attempt to discover failure mechanisms
• Task 2
• JPL will design the multi-chip module and provide
  the devices.
• Auburn will advance the current single chip
  embedding operation to include the embedding of
  multiple devices within a single flexible
  membrane to form the multichip module.
• Upon receipt, JPL will thermal cycle the embedded
  assemblies from -55 to 125C until failure or
  project end date.
• Task 3
• Finally, the team will continue thermal cycling
  embedded daisy chain, embedded OpAmp and embedded
  RF amplifier from the previous two years of this
  task.

Description Task 1 Ensure the reliability
of the embedded active assembly process following
transfer of the technology from university to
industry. Task 2 Evaluate the reliability of
multi-chip modules embedded within membrane
polymers. Task 3 Evaluate previously embedded
devices to failure.
Low and high magnification photographs of
embedded OpAmp assemblies

• Deliverables
• Final Report describing the results obtained
  throughout the embedded actives project
• Partners
• PI Dr. Linda Del Castillo, JPL
• Co-Is Mr. Toshiro Hatake at JPL, Drs. Alina
  Moussessian and Yuan Chen at JPL, Prof. R. Wayne
  Johnson at Auburn University, and Prof. Benjamin
  J. Blalock at University of Tennessee.
• NASA and Non-NASA Organizations/Procurements
• 34K Subcontract for Auburn University

• Schedule/Costs