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Tang Wai Chung, Matthew

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p-type material: doped with acceptor holes ( ) as majority carriers ... Gate Fringe Capacitance. COV not just from metallurgic overlap get fringing fields too ... – PowerPoint PPT presentation

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Title: Tang Wai Chung, Matthew


1
CEG3470
Digital Circuits (Spring 2009)
Lecture 7 MOS Transistor Model
Courtesy slides from DIC 2/e and EE141 notes
from Prof. Jan Rabaey
  • Tang Wai Chung, Matthew

2
NMOS Transistor Structure
  • p-type material doped with acceptor ? holes ()
    as majority carriers
  • n-type material doped with doner ? electrons (-)
    as majority carriers
  • When S G D 0V, both p-n junctions have 0V
    bias and considered off.

3
Threshold Voltage Concept
  • With positive gate bias, electrons pulled toward
    the gate
  • With large enough bias, enough electrons will be
    pulled to "invert the surface (p ? n type)
  • Voltage at which surface inverts magic
    threshold voltage VT

4
The Threshold Voltage
  • Threshold
  • Fermi Potential

2 ?F is approximately 0.6V for p-type
substrates ? is the body factor VT0 is
approximately 0.45V for 0.25 ?m process.
5
Transistor with Gate and Drain Bias
cap. per unit area (gate oxide)
electron mobility (m2/(V s))
6
Transistor with Gate and Drain Bias
VGS
VDS
ID
-

V(x)
Doing Integration, we have
where
7
Transistor in Saturation
0 lt VGS VT lt VDS
VGS
VDS gt VGS VT
ID
-

VGS VT
Replacing VDS with VGS VT
8
Saturation
  • For (VGS VT) lt VDS, the effective drain voltage
    and current saturate
  • Of course, real drain current isnt totally
    independent of VDS

approx. for channel-length modulation
9
Modes of Operation
Cutoff
VGS VT lt 0
ID 0
Linear (Resistive)
VGS VT gt VDS
Saturation
0 lt VGS VT lt VDS
10
Current-Voltage Relations Old Transistor
11
Current-Voltage Relations The Deep Sub-Micron
Transistor
12
Velocity Saturation
  • Velocity saturates due to carrier scattering
    effects

13
Velocity Saturation (Cont)
14
ID versus VGS
Long Channel (L 2.5?m)
Short Channel (L 0.25?m)
15
Including Velocity Saturation
Approximate velocity
continuity requires that
Integrating to find the current again
16
Regions of Operation
Long Channel (L 2.5?m)
Short Channel (L 0.25?m)
W/L 1.5
17
Models
  • Exact behaviour of transistor in velocity sat.
    somewhat challenging
  • If you want to analyze easily, use MODELS.
  • There are many different modelsv-sat, alpha,
    unified VT, etc.
  • Simple model for manual analysis desirable
  • Assume velocity perfectly linear until ?sat
  • Assume VDSAT constant

18
Simplified Velocity Saturation
  • Assume velocity perfectly linear until hit ?sat

19
Simplified Velocity Saturation (Cont)
  • Assume VDSAT ?cL when (VGS VT) gt ?cL

20
A Unified Model for Manual Analysis
Define VGT VGS VT for VGT 0 ID 0 for VGT
0
with
21
Simplified Model
  • Define VGT VGS VT, VD,SAT ?cL

22
Simple Model vs SPICE
23
One Last Simplification
  • If device always operates in velocity sat.
  • V_T model
  • Good for first cut, simple analysis

24
Transistor Model for Manual Analysis
25
A PMOS Transistor
All variables negative Work with absolute values
26
MOS Capacitance
27
Gate Capacitance
CO Cox xd
  • Capacitance (per area) from gate across the oxide
    is W L Cox, where Cox ?ox/tox
  • The overlap capacitance CGSO CGDO COW

28
Transistor In Cutoff
  • When the transistor is off, no carriers in
    channel to from the other side of the capacitor
  • Substrate acts as the other capacitor terminal
  • CGCB CGC WLCox

29
Transistor In Cutoff (2)
  • As VGS increases andVGSltVT, a depletion
    region is formed and act as a gate dielectric ?
    CGCB started to drop from W L Cox
  • It finally becomes 0 when VGS VT

30
Transistor In Linear Region
1/2
1/2
  • Channel is formed and acts as the other terminal
  • GGCB drops to zero (shielded by channel)
  • Model by splitting oxide cap equally between
    source and drain
  • Changing either voltage changes the channel
    charge and hence the capacitance

31
Transistor in Saturation Region
gt1/2
lt 1/2
pinch-off
  • CGCD drops as VDS increases ? drop to 0 when the
    channel pinches off.
  • CGCS gradually rises from WLCox/2 to (2/3)WLCox

32
Gate Capacitance
Cgate vs. VGS (with VDS 0)
Cgate vs. operating region
33
Average Distribution of Channel Capacitance
34
Gate Fringe Capacitance
  • COV not just from metallurgic overlap get
    fringing fields too
  • Typical value 0.2 fFW (in ?m)/edge

35
Diffusion Capacitance
  • Bottom
  • Area cap.
  • Cbottom Cj Ls W
  • Sidewalls
  • Perimeter cap.
  • Csw Cjsw (2Ls W)

Cdiff CjLsW Cjsw(2Ls W)
36
Capacitance Model Summary
  • Gate-Channel Capacitance
  • CGC ¼ 0
  • CGC CoxWLeff50 G to S, 50 G to D
  • CGC (2/3)CoxWLeff100 G to S
  • Gate Overlap Capacitance
  • GGSO CGDO CO W
  • Junction/Diffusion Capacitance
  • Cdiff Cj Ls W Cjsw(2Ls W)

(VGSltVT)
(Linear)
(Saturation)
37
MOS Capacitances
G
CGS CGCS CGSO
CGD CGCD CGDO
S
D
CDB Cdiff
CSB Cdiff
CGB CGCB
B
38
Example
  • Consider an NMOS transistor with the following
    parameters Cox 5.7 fF/?m2, L 0.24 ?m, W
    0.36 ?m, LD Ls 0.625 ?m, CO 310-3 F/m,
    Cj0 210-3 F/m2, and Cjsw0 2.7510-10 F/m.
    Determine the zero-bias value of all relevant
    capacitances

CGC WLCox 0.36? 0.24? 5.7 0.492 fF CG
0.492 0.36?(3 10-10) 0.700 fF Cdiff
Cj0LDW Cjsw0(2LD W) 210-3 x 0.625? 0.36?
2.75 10-10 (2 0.625? 0.36?) 0.450
0.442 0.892 fF
39
Capacitances in 0.25?m CMOS Process
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