Quantum Dot Lasers

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• Quantum Dot Lasers
• Challenges and Opportunities
• Alexey Kovsh
• Innolume Inc, Santa Clara, CA, USA
• Innolume GmbH, Dortmund, Germany

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Optoelectronic semiconductor chip

• Lasers, LEDs, photodetectors, solar cells
• Emission/absorption spectrum
• Wavelength
• Spectral width
• Shape of the spectrum
• Beam shape and intensity distribution
• Power/Absorption saturation
• Efficiency
• L-I curve
• Wall-plug efficiency

Specific example Quantum Dot Laser
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Semiconductor (nano)Heterostructures
Different structures
Different materials
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Threshold current and sales
Source Red circles Laser Market Place Seminar
2005
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Company Facts History

• Headquarter in Dortmund/Germany
• Application Support office in Santa Clara/CA
• Q4 2009 operation in St.Petersburg, Russia
• VC based total 18 Mio raised
• 500 sqm cleanroom facilities
• 23 employees

MBE growth reactor, Riber 49

• 2003 founded by N.Ledentsov, D.Tseitlin, B.Meyer
  as NSC Nanosemiconductor to commercialize Quantum
  Dot optoelectronic products
• 2005 move to new facilities, start establishing
  full fabrication line in 500sqm cleanroom
• 2006 renamed to INNOLUME, market introduction of
  first laser modules
• 2007 product portfolio diversification to
  broadly penetrate applications requiring
  1064nm-1320nm
• 2008 ISO90012000 qualification
• 2008 Expansion of industrial customer basis
• 2009 first commercial sampling of COMB-Laser

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Vertically integrated fabrication facilities

• 2 industrial level Molecular Beam Epitaxy
  machines
• all required characterization equipment for
  wafer testing (PL mapper, SurfScan, XRD, AFM)

Epitaxy MBE growth
Wafer fab Photolithography Etching Metal
deposition SEM

• Photolithography line, automatic wet processors
• Reactive Ion Etching, Enhanced Plasma Etching,
  Sputter
• Scanning Electron Microscope, e-beam writing

Chip fab Chipping Facet coating Lifetime testing

• Dual Ion Beam Optical Coating System
• ScribeBreak, Wafer Saw
• PickPlace, Die Sorters
• Lifetime tester with 144 channels

Packaging Test Bonding Fiber
coupling Characterisation

• Die Bonders, Wire Bonders
• Fiber alignment/attachment System
• all standard characterization equipment for high
  power and high frequency testing

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Strategy
2-focus strategy to ensure near-term
profitability and enable killer applications
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Mission
The

• Optical network in manycore CPU by 2018
• As seen by Hewlett-Packard

The Optical Crossbar

• 64 ?s multiplexed over 270 parallel waveguides
• data (256)
• broadcast (2)
• arbitration (12)

After Dr.Ray Beausolail
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Optical compcom competitive landscape

• VCSEL arrays
• IBM
• SUN Microsystems
• NEC
• VI Systems
• Silicon Photonics
• IBM
• Intel
• SUN Microsystems
• Luxtera
• Innolume

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WDMs Migration to Compcom
The Internet relies on Wavelength-Division
Multiplexing (WDM) telecom backbones
WDM combines many wavelengths into one
single-mode optical fiber and then separates them
De-multiplexer (DEMUX)
Multiplexer (MUX)
Bandwidth increase requires WDM migration into
server farms, computers, and chips!
But how, economically?
Comb Laser WDM !
Server Farms100s ? 1 mCopper, Optical Fiber,
WDM?
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Computer Interconnect Opportunities

• The PC mantra speed, speed, speedbuy, buy, buy!
• But Moores law is softening
• Parallelism is todays answermany cores (100s in
  a few years)
• But system performance limited by signaling
  bottlenecks
• Off-chip bandwidth must grow dramatically and
  inexpensively
• Requires a new breed of optical interconnects
• Industry consensus is need for Wavelength-Division
  Multiplexing (WDM)
• Hewlett-Packard committed to WDM interconnects in
  CPU
• Future multi-core die stack will include WDM
  communications layers
• Google et al. facing signaling bottlenecks in
  server farms
• Seeking WDM solution to counter proliferation of
  underutilized fiber
• IBM says WDM required in next-gen supercomputers
  (PW2009)
• VCSEL-driven parallel interconnects have cost and
  reliability issues
• But there is no practical WDM solution yet for
  compcom
• Requires dramatic reduction in cost, SWaP (size,
  weight, power)

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Vision

• Intels invention of silicon integrated circuit
  puts many electronic devices on a single chip
• Combining functions, achieving economies of scale
• Built a multi-billion company on this invention
• Innolumes invention of integrated comb laser
  puts many lasers in a single waveguide cavity
• Multiplying lasers, achieving economies of scale
• Will build a multi-billion company on this
  invention!

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Future of WDM Comb Laser Transceiver
Conventional approach Multi-laser WDM
Transmission
?-locker
DFB
Mod
?-locker
DFB
Mod
MUX
?-locker
DFB
Mod
?-locker
DFB
Mod
?-locker
DFB
Mod
?-locker
DFB
Mod
After RWTH Aachen
Comb-Laser Transceiver
Micro-ring resonator technology compatible to
CMOS process is the best candidate to fully
utilize all advantages of comb-laser
Intels integrated and bonded WDM source proposal
25 bonded lasers
Ring Resonator Principle
Ring Resonator SEM picture
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City of Dortmund

• 70th 80th Collapse of main Industry Sectors in
  Ruhrgebiet Area
• Steel, Coal, Beer brewing
• Late 90th Structural change to European Center
  of Micro Nanotechnology
• Dortmund focusses on Micro Nanotechnology
  industry as future main industry and employment
  factor
• Numerous projects and institutions provide
  support in establishment of hightech companies
• Today Dortmund is accepted as the most succesfull
  and prosperous city in the region

Story of Recovery and Success
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MST.factory Nucleus for MicroNanotechnology
Companies

• Incubator to support start-up companies in field
  of micro nanotechnology
• Seed of new technology park PHÖNIX WEST to
  recultivate area of former Steel Coke Plant of
  Krupp-Hösch
• 50M investment in building, infrastructure and
  fabrication equipment
• 2500sqm cleanroom and laboratory space
• 1000sqm offices
• Co-financing Northrhine-Westphalia European
  Union
• Infrastructure and business services on leasing
  model to enable access to cost intensive
  equipment without CapEx spending
• Home of 20 companies, 100 employees

Innolume
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Innolume OOO

• St.Petersburg
• Initiate operation in Q4 2009
• Prepare ramp up of high volume packaging line for
  high power lasers
• Kick off projects with medical centers on
• Photodynamic therapy of cancer (1270 nm)
• Fat burning lasers (1210 nm)