DSSD update

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DSSD update
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Outline

• DSSD design in Vienna How it is done
• First test batch of SVD DSSDs
• Status of the purchase
• Responses from the vendors
• Construction of a prototype ladder
• Status of the trapezoidal DSSD design

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DSSD design in Vienna

• ICstudio by Mentor Graphics Inc. commercial
  software for design of integrated circuits.
• ICstudio can be steered by a script program
  written in AMPLE to draw a design automatically.

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DSSD design in Vienna

• The sensor design is defined by a list of
  parameters, which are used by the AMPLE program
  at runtime.
• This way, one can account for the design rules of
  the vendor quickly by changing the parameter in
  question and rerun the program.

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Status of test batch purchase

• Two commercial vendors have been selected to
  produce one DSSD test batch each
• (Norway)
• (UK)
• Due to KEK rules, purchase requires official
  bidding procedure carried out in Japan
• Both vendors can be contacted via
• Micron prefers

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Comparison of vendors
SINTEF Micron
Commencing 6 months
Wafer Procurement 10 weeks -
Completion 30 weeks7.5 months 9 months
Contingency /- 1 month /- 1 month
Masks, Testing 8.0 M 5.1 M
Administration 1.6 M -
Processing 13 M (23 pcs) 2.5 M (first 10 pcs.) 5 M (next 20pcs.)
Total Sum 22.5 M (178 k) 15 M (120 k)
Sensors received 23 30
Cost per sensor 1 M (8k ) 0.5 M (4k )
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Status of test batch purchase

• While official purchase procedure is ongoing and
  carried out by KEK (Tsuboyama-san knows more), we
  started the technical discussion with the
  companies.
• They each got a preliminary DSSD design as basis
  for discussion of design rules
• rectangular sensor for layer
  3 122.8x38.4mm² active area, 160/50µm pitch
• rectangular sensor for layer
  4 122.8x57.6mm² active area, 240/75µm pitch

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Response from

• Contact person Colin Wilburn (Boss)
• Few answers to technical questions
• Lower bias resistor value will improve tolerance
  control.
• Proposes as japanese agency, KEK has
  already worked with them.
• Manufacturing could take 6-12 months, maybe even
  longer.

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Response from

• Contact person Thor-Erik Hansen (Chief
  scientist)
• Technical discussion started, we already received
  valuable hints
• We need two additional masks for inclusion of
  silicon nitride in the polysilicon resistors
• Strip numbering, labels and alignment markers
  have to be mirrored on the backplane to appear
  correctly on the device
• The vias have to be larger to avoid the risk of
  spiking
• Thor-Erik Hansen is on vacation from July 13
  until beginning of August.

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Construction of a prototype ladder

• Prototype of ladder 4
• including Origami modules
• including trapezoidal sensor
• Plan for the purchase
• Order rectangular sensors at
• Order wedge sensors at
• Little time left, design of wedge sensors has
  started.

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Construction of a prototype ladder
Layer Ladders Rect. Sensors 50µm Rect. Sensors 75µm Wedge Sensors APVs
6 17 0 68 17 850
5 14 0 42 14 560
4 10 0 20 10 300
3 8 16 0 0 192
Sum 49 16 130 41 1902
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Status of the trapezoidal design

• The existing AMPLE script used for sensor design
  is not capable of drawing wedge-shaped sensors.
• Rewriting necessary, started two weeks ago.
• Status
• AC strips of frontplane ready
• AC strips of backplane including p-stop ready
• To do
• Implement bias ring, guard ring, edge ring
• Implement labels, strip numbering, alignment
  markers

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Status of the trapezoidal design
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Status of the trapezoidal design
Frontplane p strips in n bulk material (p-side,
junction side)
Note This is not a sensor design, its just a
proof of concept!
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Status of the trapezoidal design
Backplane n strips in n bulk material
surrounded by p-stop atolls (n-side, ohmic side)
Note This is not a sensor design, its just a
proof of concept!
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Restart of production at Hamamatsu

• Good news (Japan) will
  restart the production of 6 DSSDs.
• But the first testable devices will be available
  in one year minimum. So they are not eligible for
  the production of a test batch.
• However, they could be back in the game for the
  final production.

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Summary

• Both companies and
  have been contacted to start the
  discussion, even without official quotation.
• Rectangular sensor design ready for discussion,
  wedge design under construction.
• What are the next steps?
• Will KEK request quotations directly from the
  vendors?
• Do we have to wait for the official bidding to
  take place?

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The End