Status Report on Silicon Strip Detectors (SSD) for PHENIX Experiment

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Status Report on Silicon Strip Detectors (SSD)
for PHENIX ExperimentWafers/Sensors Testing
at BNL
Rachid Nouicer (BNL) Matt Nguyen (SBU), Hua Pei
(ISU) and Kieran Boyle (SBU)
Vertex Meeting 08/24/2005
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Outline

• Documentations
• Current Status of the Wafers Testing Before
  Dicing
• Current Status of the Wafers Testing After Dicing
• Manpower
• Conclusions and Perspectives

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Documentations

• http//www4.rcf.bnl.gov/nouicer/Phenix_Vertex_but
  ton/index.html

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Current Status Wafers Testing Before Dicing

• The high priority is to finish testing of the
  wafers with new design labeled B2W

Wafer ID Thickness Diode Test Single Strip Test Guard Ring (New) Test QA Test
B2W02 625 Done Done Done Done
B2W03 625 Done Done Done Done
B2W11 625 Done Done Done Done
B2W14 500 Done Done Done In progress
B2W15 500
B2W23 500 Done Done Done Done
B1W02 625 Done Done Done Not done
B1W03 625 Done Done Done Not done
B1W04 625 Done Done Done Not done
B1W10 500 Done Done Done Not done
at UNM
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Test Results for Wafer B2W02/Before Dicing
Diode
Capacitance (F)
Single Strip
Guard Ring
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Test Results for Wafer B2W03/Before Dicing
Diode
Guard Ring
7
QA Tests B2W03/Sensor1/U2R/Before Dicing

at UNM
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Current Status Wafers/Sensors After Dicing
Wafer ID Sensor Diode Test Single Strip Test Guard Ring QA Test Acceptance
S1 Done Done Done Ok
B2W02 (625) S2 Done Done Done Bad
S3 Done Done Done Good
S1 Done Done Done Done Very Good
B2W03 (625) S2 In progress In progress In progress In progress In progress
S3 In progress In progress In progress In progress In progress
B2W11 (625) 500 ready ready ready ready ready
B2W23 (500) 500 ready ready ready ready ready
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Bad Dicing B2w02/Sensor1/X2R
at UNM
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Dicing Procedures

• Procedure 1 Sensor1 ulltrasonic cleaning
  oven for 1h at 125 degree and ½ h cool down
• Procedure 2 Sensor2 cleaning just with
  distilled water N2 pressure for drying
• Procedure 3 Sensor3 cleaning just with
  distilled water oven for 1h at 125 degree and ½
  h cool down

at UNM
The results of procedure 1 is done and the
results from sensor1 testing are very good.
See documentation
on the web.
We have already one procedure which works for
dicing
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Before Dicing B2W03Sensor1/U2R
at UNM
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Good Dicing using Procedure 1
B2W03Sensor1/U2R
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Manpower

• Actual Manpower Matt and Rachid
• Hua after QM, he went to China to make his Visa
• Kieran is in Japan for pp analysis

at UNM
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Conclusions and Perspectives

• It seems we found the right procedure for
  dicing.
• We have to finish checking the other procedures
  2 and 3 and to find the cause of the bad
  dicing which happened in wafer B2W02
• Next week, we will dice wafers B2W11, B2W23 and
  (B2W14)

at UNM