CMOS Temperature Sensor with Ring Oscillator for Mobile DRAM Selfrefresh Control - PowerPoint PPT Presentation

1 / 14
About This Presentation
Title:

CMOS Temperature Sensor with Ring Oscillator for Mobile DRAM Selfrefresh Control

Description:

Usually, the leakage characteristic of a DRAM cell becomes worse at high ... That is, the period can be set long at low temperature and short at high temperature. ... – PowerPoint PPT presentation

Number of Views:257
Avg rating:3.0/5.0
Slides: 15
Provided by: Sup80
Category:

less

Transcript and Presenter's Notes

Title: CMOS Temperature Sensor with Ring Oscillator for Mobile DRAM Selfrefresh Control


1
CMOS Temperature Sensor with Ring Oscillatorfor
Mobile DRAM Self-refresh Control
  • IEEE International Symposium on Circuits and
    Systems, 2008.
  • Chan-Kyung Kim Bai-Sun Kong Chil-Gee Lee
    Young-Hyun Jun
  • ???? ??? ??
  • ?? ????
  • ?? 96662010
  • ?? ???

2
outline
  • INTRODUCTION
  • PROPOSED TEMPERATURE SENSOR WITH RING OSCILLATORS
  • MEASUREMENT RESULTS
  • CONCLUSION

3
INTRODUCTION
  • As mobile devices are required to provide very
    low power consumption, schemes such as monitoring
    the internal temperature of a chip and adjusting
    its power consumption based on this temperature
    are popularly used.
  • A low-power mobile DRAM can adjust its
    self-refresh period according to internal
    temperature to minimize data retention current
    during power-down mode . Usually, the leakage
    characteristic of a DRAM cell becomes worse at
    high temperature than at low temperature.
  • If a local clock signal to determine the
    self-refresh interval is generated by a ring
    oscillator as conventional DRAMs do, the wasted
    data retention current tends to be further
    increased at low temperature because the
    oscillation frequency of the oscillator increases
    as temperature decreases.

4
  • On the other hand, if we can measure the
    temperature using a temperature sensor, the
    self-refresh period can be adjusted adaptively
    based on this measured temperature. That is, the
    period can be set long at low temperature and
    short at high temperature.

5
  • After input signal Refresh_EN becomes active,
    oscillator output SELF_OSC starts oscillation
    with a period decided by the latencies of
    inverter stages.
  • For setting a proper oscillation frequency of the
    oscillator under a given temperature, control
    signals P4P0 and N4N0 from the temperature
    sensor adjust the conductive distance between the
    power supply and the active devices. SELF_OSC is
    then fed into the counter to generate command
    signal SELF_REF for periodically invoking
    self-refresh operations in the DRAM core.
  • With this configuration, the circuit can
    effectively change the timing period between
    consecutive self-refresh operations to reliably
    retain DRAM cell data based on on-chip
    temperature.

6
PROPOSED TEMPERATURE SENSOR WITH RING OSCILLATORS
  • Usually, the oscillation frequency of a ring
    oscillator controlled by a temperature sensitive
    bias current can be effectively utilized as a
    means to monitor the temperature of a chip.
  • The CMOS temperature sensor proposed in this
    paper utilizes the temperature dependency of poly
    resistance to generate a temperature dependent
    bias current, and a set of ring oscillators to
    convert this bias current to a digital code.

7
  • The bias current generator in the upper part
    provides the ring oscillator with a proper bias
    current to allow its oscillation period to be
    proportional to temperature.
  • The bias current generator in the lower part
    provides its oscillator with a bias current to
    make the oscillation period relatively constant
    regardless of temperature variation.
  • The divide-by-4 circuit is used to decrease the
    frequency of the temperature -dependent clock by
    4 times, and allows a low frequency clock to be
    generated by the ring oscillator having a small
    number of inverter stages.
  • The pulse generator selects one-cycle pulse from
    the low-frequency temperature dependent clock,
    while the 10-bit counter counts the number of
    high-frequency temperature-independent clock
    cycles during the period of the one-cycle pulse
    to generate an equivalent digital code.

8
  • The rise and fall delays of a single inverter
    stage in the oscillator is determined by the
    inverter bias current Isource (Isink), the load
    capacitance Cload, and the inverter trip voltage
    Vtrp.
  • The above equation indicates that the oscillation
    frequency of the ring oscillator is linearly
    dependent on the inverter bias current.

9
  • The temperature-dependent bias current is
    generated by the circuit shown in Fig.
    5(a).Because the temperature coefficient of poly
    resistor Rs is positive, the voltage drop across
    the resistor gets larger as the temperature goes
    up. Then, the bias current through transistor P1
    becomes smaller since the gate-source voltage of
    P1 is decreased.
  • A temperature-independent bias current is
    generated by the circuit shown in Fig. 5(b). In
    the circuit, transistors N1 and N2 are operated
    in the weak inversion region, while transistor N4
    is operated in the linear region.

10
  • When the start signal triggers the measurement
    process, the temperature related oscillator is
    activated. After enlarging the period of the
    clock and selecting a single pulse, the width of
    the resulting single pulse takes on the
    temperature of the chip.
  • This ring oscillator is only activated during the
    high period of the pulse, and the 10-bit counter
    counts the number of clock cycles during this
    period. Once the width of the pulse is measured,
    the counter keeps the measured digital value with
    both ring oscillators deactivated until a new
    start signal is entered.

11
MEASUREMENT RESULTS
  • The bias current generators are placed at the
    vicinity of the associated ring oscillators to
    minimize device mismatches.
  • The oscillation period of the upper ring
    oscillator varies about 2.20uS.
  • The variation of the oscillation period of the
    lower ring oscillator for the same temperature
    range is less than 0.04uS, which is very small
    compared to that of the upper ring oscillator.

12
  • The proposed temperature sensor achieves area
    reduction of 73 with improved resolution.

13
CONCLUSION
  • A new CMOS temperature sensor with ring
    oscillators is proposed and implemented in a DRAM
    process.
  • The proposed temperature sensor occupies smaller
    silicon area with higher resolution than the
    conventional temperature sensor based on bandgap
    reference.
  • With the proposed temperature sensor, the
    self-refresh period of a mobile DRAM can be
    effectively controlled to improve power
    efficiency during power-down mode.

14
Thank you for your attention !
Write a Comment
User Comments (0)
About PowerShow.com