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Allen Cheng, Gary Tyson , Trevor Mudge

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Title: Allen Cheng, Gary Tyson , Trevor Mudge


1
FITS Framework-based Instruction-set Tuning
Synthesis for Embedded Application Specific
Processors
  • Allen Cheng, Gary Tyson , Trevor Mudge
  • Advanced Computer Architecture Lab
  • The University of Michigan
  • Department of Computer Science
  • Florida State University


2
Challenges Solutions
  • The constraints are growing ever-tighter
  • Performance
  • Area 5
  • Power 711
  • Cost
  • Time-to-market
  • Improving Code Density
  • Application-Specific Designs
  • General-purpose Fabrication

3
Related Work
  • Dual instruction sets (e.g. ARM/Thumb)
    12610
  • Supports both 32-bit 16-bit instruction sets
  • Dual-width instruction set (e.g. ARM/Thumb2) 3
  • One ISA combines both 32-bit 16-bit instructions

16-bit Good ! Restrictive Bad !
4
A Philosophy that FITS !
  • Single 16-bit ISA design
  • Large (unmapped) instruction set
  • Map instructions for needs of each application

5
A Theme that FITS !
Small but Powerful !!!
6
An Architecture that FITS !
  • General-purpose underlying microarchitecture
  • Full range of functional capabilities
  • Programmable decoder
  • Maps only a subset of needed insns to the 16-bit
    format
  • Why programmable decoder?
  • Decouple the µ-arch enhancements from IS encoding
  • Post-fabrication instruction set mapping
  • Match the dense coding capabilities of ASP
  • Retain fabrication advantages of a single chip

7
How FITS fits into Design Frame
Architectural Design Space

Speed Efficiency
Programmability Flexibility
ASIC
ASP
GPP
DSP
GPPExt
Applicable Range
FITS
SAVE Code Size, Power, Time to Market, Cost
8
Design Synthesis Heuristic
  • Instruction synthesis
  • Utilization-based category-partitioning
  • Instruction categories
  • Base Instruction Set (BIS) 5 instr
  • Supplemental Instruction Set (SIS) 5 instr
  • Application-Specific Instruction Set (AIS) 3-5
    instr
  • Immediate synthesis
  • Utilization-based dictionary-compression 4
  • Immediate target
  • ALU Immediates
  • Memory Immediates

9
BIS
10
BIS SIS
11
BIS SIS AIS
12
Top 16 ALU Immediates
13
Top 16 Memory Immediates
14
Code Size Benefits
50 Saving!
15
Conclusions
  • Constraints are tight
  • Improve code density
  • General purpose microarchitecture
  • Programmable decoder for post-fabrication IS
    tuning
  • Results
  • Small Area
  • Low Cost
  • Low Power
  • High Performance
  • Fast Time to Market

16
References
  • 1 ARCtangent-A5 microprocessor Technical
    Manual, ARC Cores, http//www.arccores.com.
  • 2 ARM7TDMI technical Manual. ARM Ltd.,
    http//www.arm.com.
  • 3 ARM Thumb-2 Core Technology, ARM Ltd.,
    http//www.arm.com/armtech/Thumb-2.
  • 4 C. Lefurgy, E. Piccininni, and T. Mudge,
    Reducing Code Size with Run-time Decompression,
    in Proceedings of 6th International Symposium on
    High-Performance Computer Architecture (HPCA),
    Jan. 2000, pp. 218-227.
  • 5 D. Keitel-Sculz, N. When, Embedded DRAM
    Development Technology, Physical Design, and
    Application Issues, IEEE Desisn and Test of
    Computers, vol. 18, no. 3, pp. 7-15, May/June
    2001.
  • 6 K. D. Kissell, MIPS16 High-density MIPS for
    the Embedded Market, in Proceedings of Real Time
    Systems '97 (RTS97), 1997.
  • 7 L. D. Paulson, Low-power chips for
    high-powered handhelds, Computer, vol. 36, no.
    1, pp. 21-23, Jan 2003.
  • 8 MiBench v.1.0, http//www.eecs.umich.edu/miben
    ch.
  • 9 SimpleScalar LLC, http//www.simplescalar.com.
  • 10 ST100 Technical Manual, STMicroelectronics,
    http//www.st.com.
  • 11 T. Mudge, Power A First-Class
    Architectural Design Constraint, Computer, Los
    Alamitos, vol. 34, no.4, pp. 52-58, Apr. 2001.

17
QA / Suggestions
18
BACKUP FOILS
19
Performance Benefits
High Code Density Improved Hit Rate
Performance
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