Laser-assisted Silicon Substrate Cleaning for UHV Systems

1
Laser-assisted Silicon Substrate Cleaning for UHV
Systems
A. Assmuth, J. Bock, U. Abelein, T. Sulima, I.
Eisele

• The question
• Low tempterature (LT) wafer cleaning processes?
• Removement of organic impurities and silicon
  oxide at T lt 700C
• The answer
• Removement of organics at room temperature and
• Significant reduction of SiO2 at T lt 450 C
• By laser-assisted chemical processing with
  reactive gases.