Optoelectronic Chips

1
Optoelectronic Multi-Chip Modules Donald M.
Chiarulli, Steven P. Levitan, Jason D.
Bakos University of Pittsburgh, Pittsburgh PA USA
Optoelectronic Chips
Demonstrator System
OE component bonded to FIG
Chip with 8x8 receiver shown from top
Chip layout
Wireframe view of MCM interconnect
Demonstrator system
Underside of chip die showing receivers
Alignment mark for chip alignment (through optic)
Fiber Image Guide
Receiver site
VCSEL site
Closeup of VCSELs shown through bottom of chip
64x64 VCSEL array shown through bottom of chip
Closeup of receiver shown through die
Side of optic showing fiber direction
Optic with mounted chip
Assembled OE chip bonded to PCB
Optic shown with backlight
Chip bottom
Chip top shown through PCB cavity