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Fast voltage monitoring system. March 11: Conditioned the ... March 12: First day of main XP - Inductive discharge development that had reduced CS pre-charge ... – PowerPoint PPT presentation

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Title: Supported by


1

Supported by
XP817 Transient CHI Solenoid free Plasma
Startup and Coupling to Induction
R. Raman, B.A. Nelson, D. Mueller, T.R. Jarboe,
M.G. Bell et al., University of
Washington Princeton Plasma Physics Laboratory
College WM Colorado Sch Mines Columbia
U Comp-X General Atomics INEL Johns Hopkins
U LANL LLNL Lodestar MIT Nova Photonics New York
U Old Dominion U ORNL PPPL PSI Princeton
U SNL Think Tank, Inc. UC Davis UC
Irvine UCLA UCSD U Colorado U Maryland U
Rochester U Washington U Wisconsin
Culham Sci Ctr U St. Andrews York U Chubu U Fukui
U Hiroshima U Hyogo U Kyoto U Kyushu U Kyushu
Tokai U NIFS Niigata U U Tokyo JAEA Hebrew
U Ioffe Inst RRC Kurchatov Inst TRINITI KBSI KAIST
POSTECH ASIPP ENEA, Frascati CEA, Cadarache IPP,
Jülich IPP, Garching ASCR, Czech Rep U Quebec
NSTX FY08 Results Review August 6-7, 2008 (PPPL)
2
Transient CHI Axisymmetric reconnection leads to
formation of closed flux surfaces
  • Demonstration of closed flux current generation
  • Aided by gas and EC-Pi injection from below
    divertor plate region
  • Demonstration of coupling to induction (2008)
  • Aided by staged capacitor bank capability

3
FY08 Result Proof-of-Principle Demonstration of
Coupling a CHI Started Discharge to Induction
  • 8 Total days 2 days commissioning
    conditioning
  • 2 days Testing without Cryo pumping
    capability
  • 4 days Full capability
  • March 10 Commissioned new CHI hardware
  • - Staged capacitor bank operation
  • - Fast voltage monitoring system
  • March 11 Conditioned the lower divertor plates
  • - Operated in stuffed injector mode
  • - Conducted first D2GDC (in recent history)
  • March 12 First day of main XP
  • - Inductive discharge development that had
    reduced CS pre-charge
  • - Started CHI discharge with some pre-charge in
    CS
  • - Reproduced good Te CHI discharges with zero CS
    pre-charge
  • - Saw first evidence for coupling to OH (good Te
    and ne signals)

4
CHI Started Discharges after Inductive Coupling
Transition into H-mode and are more reproducible
with Li Conditioning
  • March 31 Inductively coupled discharges reach
    180kA and reach Te 100eV
  • April 9 Inductively started discharges reach Ip
    600kA and Te 500eV
  • - Used position feedback control to increase
    current
  • June 2,3 Operated without Cryo Pumping and
    without Boronization
  • - Vessel base pressure 10x higher than usual (4
    x 10-7 Torr)
  • - June 2- Tested CHI discharge formation in He
    then switched to D2 plasmas, Ip 400kA in poor
    reproducibility discharges
  • - June 3 - First use of Li evaporation for CHI
  • - Discharges became reproducible and reached Ip
    600kA
  • - Tested use of HHFW for heating during the
    coupling phase to induction
  • July 8 Used Cryo pumping and 10mg/min Li
    evaporation
  • - Central electron temperature reached 1keV
  • - Ip reached 725kA, discharges transitioned into
    H-modes
  • - Discharges with 2min HeGDC 6min Li were more
    reproducible than Li-only cases

5
March 12 First Evidence of CHI Coupling to
Induction
  • Final four shots coupled to induction
  • Te and ne (from Thomson) showed plasma to be
    resting on outer vessel during inductive phase
  • Later confirmed by EFIT
  • On last shot increased vertical field moved
    plasma further inboard verifying Thomson and EFIT
    results

6
March 31 Demonstrated First Good Coupling of CHI
Produced Discharge to Induction (in NSTX)
  • Started with Final discharge from March 12
  • Used 7.5kJ of capacitor bank energy to initiate
    CHI discharge
  • Used pre-programmed PF coil currents to maintain
    equilibrium
  • Discharges gt40ms were ramping up in Ip but
    vertically unstable

7
CHI started discharge couples to induction and
transitions to an H-mode demonstrating
compatibility with high-performance plasma
operation
  • Te Ne from Thomson
  • Ti from CHERS
  • Central Te reaches 800eV
  • Central Ti gt 700eV
  • Note the broad density
  • profile during H-mode phase
  • Discharge is under full plasma equilibrium
    position control
  • Loop voltage is preprogrammed

CHERS R. Bell Thomson B. LeBlanc
8
Discharges with Li Conditioning are More
Reproducible and reach Higher Currents after
Inductive Coupling
Li makes breakdown more reproducible and the
improvements are due to reduced recycling
(similar to the effect of Ti-gettering on HIT-II)
9
Need auxiliary heating or metal divertor plates
to compensate for increased radiated power with
more capacitors
  • Low-z impurity radiation increases with more
    capacitors
  • High Te in spheromaks (500eV) obtained with metal
    electrodes
  • Test with partial metal outer divertor plates
    during FY09
  • Reverse TF polarity to make outer vessel cathode
  • Upper divertor radiation also increases with more
    capacitors
  • Need to reduce absorber arcs
  • Absorber field nulling coils to be used during
    FY09
  • Assess benefits of partial metal plates
    Absorber coils
  • Discharge clean divertor with high current DC
    power supply
  • Use 350kW ECH during FY11

Plasma Current
128400 5mF (7.6kJ) 128401 10mF (15.3kJ) 129402
15mF (22.8kJ)
10
First Demonstration of Compatibility of CHI with
High-Performance Inductive Operation in a Large ST
  • Transient CHI is a proven method to generate
    closed flux (160kA to date)
  • Startup inductive coupling at 100kA
    demonstrated on NSTX HIT-II
  • CHI initiated and inductively ramped current
    reached 700kA in H-mode
  • Peak Te 0.9keV obtained in discharges coupled to
    induction
  • Need to reduce Low-Z impurity radiation to
    increase current
  • Electrode conditioning to be improved for FY09
  • Reduce absorber arcs using Absorber PF coils
  • Use outer metal divertor plates needed for Liquid
    Li system
  • Beyond 2009
  • 350kW ECH higher power HHFW will help
    considerably
  • Results from metal outer plate tests during 2009
    will provide additional data on effect of Low-Z
    impurities
  • Higher voltage needed to increase startup current
  • Higher TF will increase current multiplication
    factor

Closed flux startup currents of about 500kA is
possible in NSTX through hardware improvements
(not a physics limitation)
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