PowerThermal Impact of Network Computing Cisco Router Technology Symposium

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Power/Thermal Impact of Network ComputingCisco
Router Technology Symposium

• Evaldo Miranda Laurence McGarry

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Data Flow Power / Thermal Flow
Source Intel 2003 Spring IDF
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Moores Law on Processor Power
Source Intel Technology Journal, Vol 6, Issue 2
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Source Kenneth Goodson, Stanford University
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The Power Supply Chain
100
-5
-20 (Cooling)
Generation Source
Transmission
Data Center
55 - Electrical Pwr 30 - Processing Pwr
-10 DC-DC
-10 AC/DC
Application Load Processor, DSP, Memory Graphics
Line Card
Shelf/Rack System
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Total Cost of Ownership
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Trends for Power Power Delivery Utilization
for Analog Processing
Pipeline ADC
Digital calibration removes D/A and linear gain
error by adjusting digital weights Karanicolas,
1993
Redundancy (RSD arithmetic) helps tolerate large
sub A/D errors Lewis, 1987

• ADC bottleneck fast highly linear gain
  element.
• 50-70 of total pipeline ADC power is consumed by
  interstage amplifiers

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Trends for Power Power Delivery Utilization
for Analog Processing
Open loop

• Lower Noise
• Increased Signal Range
• Lower Power
• Faster
• Nonlinear
• Signal Processing used to linearize!

Murmann 03 Open-Loop Amplification
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Trends for Power Power Delivery Utilization
for Analog Processing
Iroga/Murmann Digital Nonlinearity
Compensation
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Trends for Power Power Delivery Utilization
for Analog Processing
Stage1 Power Breakdown
16X
4X
Iroga/Murmann 05 12-b, 75-MS/s ADC
implemented in 0.35um CMOS
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Trends for Power

• Moores Law is different for Analog and Digital

• The area of digital is cut in half with every new
  generation
• The area of analog is reduced by 2030 with
  every new generation
• The cost of digital is cut in half every 23
  years
• The cost of analog is cut in half every 48 years

Ref Anton Bakker - Analog Devices Inc.
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Layout comparison in 0.25um CMOS
Trends for Power
Bondpad ESD
12-bit ADC
10pF
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Buck Converter I
Supply
Computing Load
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Buck Converter II
V
V
V
T
T
T
Supply
T
Computing Load
REF
Fault / OK
Monitor - Control - Adapt
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Smart Power Chain Block Diagram
SMBus / SST / PMBus
Switch Bridge
Rectifier
LC Filter
OrFET
Rectifier PFC
Drivers
PFC Ctrl
PWM
Delivering Power Through Information
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Summary and Conclusions

• Proliferation of computing/networking/communicatio
  ns applications resulting in extreme and bounded
  power density demands on supporting
  devices/systems
• Falling cost of digital technology allows
  availability of digital techniques to
  optimize/improve system functions
• Adaptable/reconfigurable regulators for efficient
  energy transfer
• Utilize information about the source load
• Use System level management

USE YOUR BUCK CONVERTER EFFICIENTLY
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Presented ByEvaldo Martins MirandaPower
Thermal Design ManagerLaurence McGarryPower
Thermal Marketing Manager
Analog Devices, Inc. 3550 North First St San Jose
CA 95134 evaldo.miranda_at_analog.com Laurence.mc
garry_at_analog.com
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Back-up
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Power/Thermal Impact of Network Computing

• Growth of fixed and mobile devices linked by a
  network processing voice, data and video.
• Moores law on Power and Thermals from processors
  to buildings for data centers
• Demand for power and cooling capacity on existing
  data centers and server farms.
• Power Management in Processors
• Fab processes (eg strained silicon and low
  leakage oxides)
• Device structure (eg 3D devices)
• Circuit designs (eg voltage, frequency and body
  switching)
• Architecture (eg multi-core and intelligent
  timing/scheduling/multi-tasking)
• Power Management for Computing Platforms (HW
  Board level and Systems)
• Increase efficiency of passive devices and their
  use Drivers, FETs, Inductors (coupled)
• Improve Thermal solutions bigger heat sinks,
  fans, heatpipes and liquid cooling
• Use Multi-phase Voltage Regulator up to 130A per
  processor w/ up to 20kW per rack
• Multiple power rails
• Power Management Opportunities (Platform Systems
  Solutions)
• Remote Monitoring/Control of networked systems
• Balancing computing load data handling traffic
• Security Virtualization

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Digital Cost Trends
Ref Y Borodovsky Intel SPIE Microlithography 2006
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Trends for Power Power Delivery Utilization
for Digital Processing
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Trends for Power Power Delivery Utilization
for Analog Processing
1
ref
/V
out
V
0
0
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5
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7
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10
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t
t/
Iroga/Murmann 05 Incomplete Settling
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(No Transcript)
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(No Transcript)
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Pentium 4 Thermal Solution
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VCR 35dBA
DVD 29dBA
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Redundant Server Power Supply 12V_at_50A (600W)
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Buck Converter I
Supply
Computing Load
PWM
REF
Fault / OK