P1252108897fvCRz

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ISPL MASS PRODUCTION Packaging Portfolio
Legend C means customized package

• RoHS (Restriction of Hazardous Substances ) /
  GREEN BOM offerings

• JEDEC Standard Compliant

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ISPL MASS PRODUCTION Packaging Portfolio
Non Standard Plastic

• Transfer Molding

• Glob Top Encapsulation

• Pre-molded plastic case or packages

• Multi-Chip Modules (MCM) / Multi Chip
  Packaging (MCP)

Chip On Board (COB) w/ or w/o SMD

• Laminates FR4, BT

• Ceramic Substrate

• Deposited Dielectric Substrate

Other Partial Process Services

• Die Inspect

• Wafer form or Singulated or waffle pack

• Lead Finish

• 100 Sn

• NiPdAu

• Wafer Backgrind

• 4 to 8 inch wafer diameter, to 8 mils wafer
  thinning

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ISPL MASS PRODUCTION Packaging Portfolio
MODULES / SPECIAL PACKAGES
Non Standard Packages Customized Design

• Lead frame based Multi-Chip Modules (MCM)

• MCM-Metal Can Package

• SSR - Solid State Relay Lead frame

• SOIC Open Cavity (Exposed Die)

• DFN Open Cavity (Exposed Die)

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PACKAGE PORTFOLIO
Special Packages
Standard Packages
QFN, DFN, ThinDFn / ThinQFN / CQFN
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• ISPL Snapshots of Established Process Capability

Stacked die
Die to die wire bonding
In-board bonding
Within die wire bonding
Long Low Loop wire bonding
Stand of Stitch Bonding
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• ISPL Snapshots of Established Process Capability

ALUMINUM WIRE
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• ISPL Snapshots of Established Process Capability

ALUMINUM WIRE
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• ISPL Snapshots of Established Process Capability

Component mounted on lead frames
Multi chip mounting in CLCC
Capable of 0201 component mounting
Au or Al wire bonding in CLCC
Flex board assembly
Die coating
Spot welding