About%20the%20Basic%20Stamp

1
Microcontroller Interfacing Projects
2
Microcontroller Interfacing
3
Microcontroller Interfacing
4
Microcontroller Interfacing
5
Microcontroller Interfacing
6
Microcontroller Interfacing
7
Microcontroller Interfacing
8
Student Project PERIPHERALS AND MOTHERBOARD FOR
THE BASIC STAMP
9
PURPOSE

• The purpose of this project is to design a set of
  motherboard core and peripheral modules for
  high-throughput applications to be implemented in
  grades 7 12 and in senior electrical
  engineering laboratories.

10
Teaching OBJECTIVE

• 1. ELECTRICAL COMPONENT BEHAVIOR
• 2. ELECTRICAL ENGINEERING DESIGN STRATEGIES
• 3. TECHNICAL SKILLS

GOALS

• TO DEVELOP AN EFFICIENT ENVIRONMENT THAT WILL
  PRODUCE
• UNDERSTANDING OF ELECTRICAL CIRCUIT BEHAVIOR
• WORKING PROTOTYPES FOR A LARGE VARIETY OF PROJECTS

11
Requirements

• Modularity
• Manufacturing
• Physical Packaging
• Reliability

12
Design Strategy

• Use Stamp as Foundation Controller for multiple
  peripheral modules
• Use communication between Stamps to increase
  complexity of a project
• Create condensed packaged Motherboard/Module
  demos

13
Foundation Controller

• Output Current for I/O pins for Stamp I/II
• DOS based application to interface BSI
• Programming Languages
• Memory Size
• I/O pins
• Port interface between PC/Basic Stamp

14
Stamp Communication

• Serin program command
• Hardware implemented for communication process

15
Packaging

• Transport Circuit Design to PC Board
• Package multiple demos into one overall storage
  unit

16
7-Segment Module
17
LED Module
18
Dipswitch Module
19
MotherBoard/Module Demos

• FOUNDATION
• BASIC STAMP II MICROCONTROLLER
• PERIPHERALS

DISPLAYS TRANSDUCERS STEPPER
MOTORS SERVOMOTORS THERMISTORS
LEDS
20
Stamp/Module Costs

• Source Hosfelt Electronics, Inc
  888-264-6464
• or
  800-524-6464
• Catalog 99R customer 397M12
• page stock item ea
  quan tot
• 47 51-393 DIP switch w/rocker actuator
  .85 20 17.00
• 82 42-104 Solderless breadboard
  10.95 10 109.50
• 105 13-398 Minature speaker
  .99 20 19.80
• 117 25-350 3mm Red LED
  .12 200 24.00
• Tot
  170.30

21
Continued Cost Analysis

• HOSFELT ELECTRONICS, INC Catalog 99B
  Cust 397M12 (MSU-ECE)
• Page Part no quan item
  ea tot
• 28 80-243 2 pkt 65 carbide drills
  3.25 6.50
• 28 80-247 2 pkt 53 carbide drills
  3.25 6.50
• 47 51-334 20 mercury tilt
  switch .75 15.00
• 67 7406 50 Hex inverter
  .39 19.50
• 72 42-194 8 4"X6" PC board
  5.99 47.92
• 86 21-267 100 16-pin DIP socket
  .08 8.00
• Total
  103.42

22
Continued Cost Analysis

• page stock item
  ea quan
• 62 AO2047-ND 9-pin D-sub connector,
  female 2.15 25 53.75
• 62 AO245-ND 25-pin D-sub connector,
  male 3.02 25 75.50
• 224 ZHB6718CT-ND H-bridge
  3.76 20 75.16
• 384 KC003T-ND Minature thermistor
  2.43 20 48.64
• Tot
  253.05

23
Continued Cost Analysis

• page cat item
  size ea quan tot
• /cclad-s.htm S1-36G 1/16" FR4 glass epoxy
• with 1 oz copper foil
  3x6 12.20 10pkg 122.00
• /chemphot.htm
• KD-1G type-S Develop soln
  1Gal 32.90 1 32.90
• PRSK-1G type-S Stripper
  1Gal 92.45 1 92.45
• /chemetch.htmFerric Chloride
• E-1G Ferric Chloride
  1Gal 20.80 1 20.80
• FSB-500 Scotchbrite pad
  12x24 21.00 1 21.00
• /chemplat.htm
• ITP-1QT Immersion Tin plate
  1qt 23.80 2 47.60
• tot
  336.75

24
Continued Cost Analysis

• BS1-IC BASIC stamp 1 _at_30.60 ea quan 15
• tot 459, SH not included.

25
Test Specification

• Size Dimensions
• Component Reliability
• Code Functionality
• Overall System Test

Test Certification

• Manufacturing of Printed Circuit Boards
• Component Choice
• Code Functionality
• System Test

26
Conclusions

• Success was achieved for project implementation
  for grades 7 12
• Shortcoming Did not construct projects of
  appropriate complexity for senior design
  electrical engineering laboratories

Future Progress

• Continued design and manufacturing of
  motherboard/peripheral module demos to be
  implemented in senior level electrical
  engineering laboratories

27
Modularity for a Robotic Locomotion System
28
Modularity of Robotic Systems
1. Electrical modules 2. Mechanical modules 3.
Software modules 4. Electrical/mechanical/software
modules a) of one type b) of few types
29
Case Study Approach
Early Stages
An exploration into the overall goal of our
project where modularity is defined providing an
overview into the mechanical structures and
communication architecture.
System Design Analysis
A detailed examination of the mechanical,
electrical, and communication components of the
electro-mechanical system.
Future Perspective
A hindsight perspective of problems encountered
while elaborating on improvements for the process
while providing an outlook upon the projects
future.
30
The Early Stages
Overall Goal
What is the point of this project?
Modularity?
What is modularity?.
An overview of the system architecture from a
high level in order to understand the integration
with lower level components.
Architecture Overview
31
Overall Goal

• Investigation of modularity
• Design of a component to act as a universal
  interface between the base unit and components
• Improved wheel modular unit and base
• Implementation of an efficient bus system with
  expansion capabilities with hardware

32
What is Modularity?

• Modular/ Modularity (adjective)
• Designed with standardized units or dimensions,
  as for easy assembly and repair or flexible
  arrangement and use.
• Application to Robotics
• Easily attachable and detachable modules
• Each module contains the necessary mechanical and
  electrical components (I.e. motors,
  microprocessors, etc.)

33
Architecture Overview
Servo Motor 1
FT Chip
Exploded View
Slave Processor
Slave Processor
Servo Motor 2
Master Processor

• Consists of single master processor where all
  program instructions originate.
• Independent slave processor allow for device
  independent calibrations.
• Instructions passed from master-gtslave-gtFT639
  (drives servo motors directly)

Slave Processor
Slave Processor
34
System and Design Analysis
An exploration of the mechanical design of body,
universal insert module, and servo motor housing.
Mechanical Design
An exploration of PCB design, master module, and
the slave module.
Electrical System
Communication Controls
An explanation of the communication of the
overall integration system.
35
Design Criteria
36
Body Design
Design 2
Design 1

• Components
• made entirely of plexiglass
• sides are individual pieces
• Problems
• slightly lighter
• many parts

• Components
• made entirely of plexiglass
• each side is one single piece
• Problems
• heavy
• a lot of manufacturing

37
Body Design
Final Design

• Components
• 2 sheets of 6x10x0.25 plexiglass
  Manufactured using CNC machine
• 12 Aluminum threaded Round Standoffs ¼ OD,
  1-1/2 length
• Advantages
• Light weight
• less manufacturing (standoffs are off the shelf
  products
• a total of 8 slots for modules

38
Universal Insert Module
Initial Design Two part component
39
Universal Insert Module

• Final Conception
• One piece component made of plastic or aluminum.
  
• Easily manufactured with the use of the machine
  from Mechanical Engineering Dept at PSU.

40
Servo Motor Housing

• Problem
• Resulting moments on servo horns
• Deformation of servo horns

Original Design
41
Servo Motor Housing

• Solution
• Redirect moment onto a shaft made of stronger
  material
• shafts connected to servo motors with use of
  gears and chains

Lower Servo Unit (Driving)
Upper Servo Unit (Steering)

• 6-32 set screws
• connects to insert module

Steering Shaft connection
Steering Shaft
Driving Shaft
Ball Bearing slot

• 6-32 set screws
• set steering shaft to lower unit

42
Assembled Module

• Spacers
• 4 pieces
• ¼ OD, 1/8 lenght

• Upper servo unit
• made of ABS 1.25x3x1
• manufactured using CNC machine

• Insert Module
• made of ABS
• manufactured using FDM machine

Servo Motors

• Shafts
• Drill Rods
• Shafts from toy car

• Lower servo unit
• made of ABS 1.25x3x1
• manufactured using CNC machine

• Wheel
• taken from toy car

43
Final Assembly
Complete assembly of robot with four wheel
modules inserted into the body
44
Master Module

• 2 individual bus systems for sending and
  receiving data to avoid data collisions
• Primary Program sequence contained within

45
Slave Module Schematic

• Each slave module unit is independent unit
  containing FT639 servo controller chip, 1 Basic
  Stamp II microcontroller
• 2 dedicated 5V lines (servo motors chips)
• 180 degree and 360 degree servo motor on board

Courtesy of Kapil and Darnel

• Each slave module unit is independent unit
  containing FT639 servo controller chip, 1 Basic
  Stamp II microcontroller
• 2 dedicated 5V lines (servo motors chips)

46
PCB Circuit Board

• Generated circuit board to be inserted into each
  module unit to allow for processing on the slave
  as opposed to master
• Generated custom-designed PCB schematic sending
  NC and drill files for production
• 2 layers Top layer (red) and Bottom layer (blue)

• 3 dedicated channels for power and ground
• 2 dedicated I/O channels for communication with
  the master
• 2 dedicated channels for future expansion
  (hardware id sequence)

47
Communication Controls

• Addressing (FC, FD, FE, FF)
• Allows for routing of information from master to
  appropriate slave unit
• Sends data serially at 2400 baud
• Allows handshaking while slave constantly pings
  for incoming data

• Checks to see which modules are plugged in
  routing data and adjusting program accordingly
• Flow Sequence
• Master -gt Slave gt FT chip -gt Slave -gt Master

Address
Position
Servo
Address
Completion
48
Problems Encountered
Manufacturing
Mechanically
Problem Inability to align parts consistently on
the CNC machine. Result Not using the bearings
for the wheel shaft
Problem Gear Specifications and slippage Result
Utilized two set screws and drilled into shafts
but reduced torque
Problem Inability to produce high quality and
tolerant parts through fusion deposition modeling
(FDM). . Result Loss tolerances upon inserting
screws with high accuracy.
Problem Turning Mechanism for the wheel module
unit Result Moment still exists but is greatly
reduced with spacer
49
Problems Encountered
Electrically
Problem Data loss and Collisions Result
Consolidated send and receive lines on individual
bus systems and utilized improved power supply
Problem Faulty Connectors/ connections Result
Reconnecting slave unit several times until
communication link established. Investigate
better quality connectors.
Problem Data transmission Speeds Result
Utilized a 2400 baud transfer rates due to
limitations imposed by the FT639 chip even though
optimal transfer rate between Basic Stamps was
found to be 9600 baud.
Problem Sending data from master to slaves
several times before communication sequence
established Result Integrated system works at
times. Problem currently under further
investigation.
50
The Next Generation Model

• Solutions to Gear Slippage
• use of metal gears to prevent stripping from
  screws
• the use of larger gears to provide a better
  contact for the set screws
• modifications to servo motor housing to
  incorporate a larger diameter size shaft

Speed control with the use of encoders

• Hardware ID tags
• determine location of module that is plugged in
  relative to the body
• Use of a multiplexer to control data flow
• Allows for more uniform integration with the
  software tagging

• Implementation of a Feedback System
• Implementing proximity and various other sensors
  to create a smart system creating a feedback
  loop

51
Problems

• 1. Think how to design a system of Lego-like
  mechanical and electrical modules from which many
  different animals could be build. First analyze
  carefully Lynxmotion, Lego and Robix systems.
  This system may be the extension of the 2002
  Robot Soccer Kit.
• 2. Next analyze Erector, Capsela and Knex.
• 3. How to design a system of blocks from which
  any type of human-like beasts (with different
  proportions but with the same kinematics) can be
  build. Each block must be self-contained,
  including software. The system should be
  self-configurable in software after connecting
  blocks mechanically.

52
Sources

• Curtis Bahn, RPI
• J.E. Wampler
• Michael Rodemer, University of Michigan, School
  of Art and Design
• Physics and Media Group, MIT
• Josh R. Fairley
• Dr. Raymond S. Winton
• Mike Haney, University of Illinois
• Steve Benkovic, Cal State University ,
  Northridgehttp//homepage.mac.com/SBenkovic
• s.benkovic_at_ieee.org
• Kenneth Chin and Prang Chim
• Dr. Jim OstrowskiBob Miller, Wally Szczesniak,
  Terry Kientz,
• Brett Balogh , Siddharth Deliwala, John Bowen,
• Darnel Degand, Kapil Kedia,
• Adrian Fox, Christopher Li