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Interface technieken Van SOC naar AMBA

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Title: Interface technieken Van SOC naar AMBA


1
Interface technieken Van SOC naar AMBA
  • J.F. van der Bent

2
De Systeembus
  • Welke onderdelen bevat een systeembus?
  • De databus
  • De adresbus
  • De besturingsbus

Controle bus
CPU
I/O
Mem
adresbus
databus
3
Introduction
  • Technological Advances
  • todays chip can contains 100M transistors .
  • transistor gate lengths are now in term of nano
    meters .
  • approximately every 18 months the number of
    transistors on a chip doubles Moores law .
  • The Consequences
  • components connected on a Printed Circuit Board
    can now be integrated onto single chip .
  • hence the development of System-On-Chip design .

4
What is SoC ?
  • People A
  • The VLSI manufacturing technology advances has
    made possible to put millions of transistors on a
    single die. It enables designers to put
    systems-on-a-chip that move everything from the
    board onto the chip eventually.
  • People B
  • SoC is a high performance microprocessor,
    since we can program and give instruction to the
    uP to do whatever you want to do.
  • People C
  • SoC is the efforts to integrate heterogeneous
    or different types of silicon IPs on to the same
    chip, like memory, uP, random logics, and analog
    circuitry.
  • All of the above are partially right, but not
    very accurate!!!

5
What is SoC ?
SoC not only chip, but more on system. SoC
Chip Software Integration The SoC chip
includes Embedded processor ASIC
Logics and analog circuitry Embedded
memory The SoC Software includes OS,
compiler, simulator, firmware, driver, protocol
stackIntegrated development environment
(debugger, linker, ICE)Application interface
(C/C, assembly) The SoC Integration includes
The whole system solution Manufacture
consultant Technical Supporting
6
System on Chip architecture
ASIC Typical Design Steps
  • Typical ASIC design can take up to two years to
    complete

Top Level Design
Unit Block Design
Unit Block Verification
Integration and Synthesis
Trial Netlists
Timing Convergence Verification
System Level Verification
Fabrication
DVT Prep
DVT
6
12
12
4
8
14 ??
5
Time in Weeks
48
Time to Mask order
61
7
System on Chip architecture
  • With increasing Complexity of ICs and
    decreasing Geometry, IC Vendor steps of
    Placement, Layout and Fabrication are unlikely to
    be greatly reduced
  • In fact there is a greater risk that Timing
    Convergence steps will involve more iteration.
  • Need to reduce time before Vendor Steps.
  • Need to consider Layout issues up-front.

SoC Typical Design Steps
Top Level Design
Unit Block Design
Unit Block Verification
Integration and Synthesis
Trial Netlists
Timing Convergence Verification
System Level Verification
Fabrication
DVT Prep
DVT
4
4
4
2
14
5
Time in Weeks
24
Time to Mask order
33
8
System on Chip interconnection
  • Design reuse is facilitated if standard
    internal connection buses are used .
  • All cores connect to the bus via a standard
    interface .
  • Any-to-any connections easy but
  • Not all connections are necessary .
  • Global clocking scheme .
  • Power consumption .
  • Standardization is being addressed by the Virtual
    Socket Interface Alliance (VSIA)

9
System on Chip interconnection
  • AMBA (Advanced Microcontroller Bus Architecture)
    is a collection of buses from ARM for satisfying
    a range of different criteria.
  • APB (Advanced Peripheral Bus) simple
    strobed-access bus with minimal interface
    complexity. Suitable for hosting peripherals.
  • ASB (Advanced System Bus) a multimaster
    synchronous system bus.
  • AHB (Advanced High Performance Bus) a high-
    throughput synchronous system backbone. Burst
    transfers and split transactions.

10
System on Chip cores
  • One solution to the design productivity gap is to
    make ASIC designs more standardized by reusing
    segments of previously manufactured chips.
  • These segments are known as blocks, macros,
    cores or cells.
  • The blocks can either be developed in-house or
    licensed from an IP company.
  • Cores are the basic building blocks
  • Voorbeeld de cc2430 zigbee chip.

11
System on Chip cores
  • Soft Macro
  • Reusable synthesizable RTL or netlist of generic
    library elements
  • User of the core is responsible for the
    implementation and layout
  • Firm Macro
  • Structurally and topologically optimized for
    performance and area through floor planning and
    placement
  • Exist as synthesized code or as a netlist of
    generic library elements
  • Hard Macro
  • Reusable blocks optimized for performance, power,
    size and mapped to a specific process technology
  • Exist as fully placed and routed netlist and as a
    fixed layout such as in GDSII format .

12
GDSII
A rendering of a small GDSII standard cell with
three metal layers (dielectric has been removed).
The sand-colored structures are metal
interconnect, with the vertical pillars being
contacts, typically plugs of tungsten. The
reddish structures are polysilicon gates, and the
solid at the bottom is the crystalline silicon
bulk.
13
System on Chip cores
Soft core
Reusability portability flexibility
Firm core
Hard core
Predictability, performance, time to market
14
Cypress PSOC core
15
System on Chip cores
  • Locating the required cores and associated
    contract discussions can be a lengthy process
  • Identification of IP vendors
  • Evaluation criteria
  • Comparative evaluation exercise
  • Choice of core
  • Contract negotiations
  • Reuse restrictions
  • Costs license, royalty, tool costs
  • Core integration, simulation and verification

16
The Benefits
  • There are several benefits in integrating a large
    digital system into a single integrated circuit .
  • These include
  • Lower cost per gate .
  • Lower power consumption .
  • Faster circuit operation .
  • More reliable implementation .
  • Smaller physical size .
  • Greater design security .

17
The Drawbacks
  • The principle drawbacks of SoC design are
    associated with the design pressures imposed on
    todays engineers , such as
  • Time-to-market demands .
  • Exponential fabrication cost .
  • Increased verification requirements .
  • Increased system complexity
  • Design Gap

18
Design gap
19
Solution is Design Re-use
  • Overcome complexity and verification issues by
    designing Intellectual Property (IP) to be
    re-usable .
  • Done on such a scale that a new industry has been
    developed.
  • Design activity is split into two groups
  • IP Authors producers .
  • IP Integrators consumers .
  • IP Authors produce fully verified IP libraries
  • Thus making overall verification task more
    manageable
  • IP Integrators select, evaluate, integrate IP
    from multiple vendors
  • IP integrated onto Integration Platform designed
    with specific application in mind

20
Major SoC Applications
  • Speech Signal Processing .
  • Image and Video Signal Processing .
  • Information Technologies
  • PC interface (USB, PCI,PCI-Express, IDE,..etc)
    Computer peripheries (printer control, LCD
    monitor controller, DVD controller,.etc) .
  • Data Communication
  • Wireline Communication 10/100 Based-T, xDSL,
    Gigabit Ethernet,.. Etc
  • Wireless communication BlueTooth, WLAN,
    2G/3G/4G, WiMax, UWB, ,etc
  • Atmel CAP

21
ATMEL Custemizable Atmel Processors
  • The advantages of this design approach are
    six-fold
  • Risk is reduced since the ARM core and
    peripherals (over 70 of the design) are fully
    verified in silicon, the designer does not have
    to worry about any of the ARM design aspects
    that work is already done.
  • Design time is reduced since the SoC portion of
    the design is complete and the designer only has
    to focus on the portion of logic that would
    otherwise be in an FPGA. This logic is captured
    in the Metal Programmable (MP) Block of the CAP
    device.
  • The CAP cycle time for place route and
    prototype fabrication is extremely short. Place
    route is limited to the metal layers of the MP
    block and the ROM personalization layer
    everything else is fixed. Fabrication time for
    prototypes is reduced since wafers are staged at
    the metal layers awaiting the Metal Programmable
    logic and ROM code from the designer. This cuts
    the fab cycle time in half.
  • Design cost savings CAP NRE cost is
    significantly lower than that for standard cell
    ASICs. The total design cost for an ARM-based SoC
    using CAP technology is a fraction of that for a
    standard-cell equivalent, thanks to re-use of
    hardware/software functional blocks, reduced
    place route effort and the smaller number of
    masks.
  • Low unit cost In volume, CAP costs only slightly
    more than an equivalent standard cell ASIC, and
    much less than an MCU FPGA combination for the
    same functionality.
  • The CAP Emulation Board, industry-standard
    software development tools, device drivers,
    operating systems and extensive re-usable
    software modules facilitate software development,
    and enable hardware and software development to
    proceed in parallel.

22
Starterkit zeer aantrekkelijk
  • CPU CoreARM7TDMI
  • Clock Speed (MHz)80
  • On-chip SRAM (Kbytes)160
  • MP Block Usable Gates
  • FPGA InterfaceROM (Kbytes)
  • 256NAND Flash Controller
  • SDRAM Controller
  • Static Memory Controller
  • AHB Masters 2
  • AHB Slaves 4
  • Interrupts 14
  • DPRAM2 Blocks 2Kx16
  • USB Device (Full Speed) 6 endpointsSystem
  • Peripheral DMA ChannelsClock
  • Klantspecifieke logica
  • Prijs 10 dollar bij afname van 10.000 stuks
  • Klantspecifieke IP in silicon rond een standaard
    uC platform
  • Zeer goedkoop start platform Cap-7
  • Arm7 cylone II EP2C8F256C7N voor 399,-

23
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24
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25
AMBA
  • Staat voor Advanced Microcontroller Bus
    Architecture
  • Deze standaard definieert de bus specificaties
    voor de communicatie tussen high speed on-chip
    componenten
  • Drie verschillende bussen zijn gedefinieerd in de
    AMBA specificaties
  • de Advanced High-performance Bus (AHB)
  • de Advanced System Bus (ASB)
  • de Advanced Peripheral Bus (APB).

26
ARM7
On die Ram
External Bus Interface
AHB of ASB
Bridge
DMA Controller
APB
UART
  • AMBA Advanced Microcontroller Bus Architectuur
  • 3 belangrijke kenmerken AMBA protocol
  • Timing aspecten van de bus zijn niet vastgelegd
  • Busspanningen zijn niet vastgelegd
  • Chip protocol onafhankelijk

Parallel I/O
Timer
27
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28
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29
De AHB
  • Staat voor Advanced High-performance Bus
  • De AHB is te verdelen in 4 logische elementen
  • AHB master
  • AHB slave
  • AHB arbitter
  • AHB decoder

30
De AHB
  • Staat voor Advanced High-performance Bus
  • De AHB is te verdelen in 4 logische elementen
  • AHB master
  • AHB slave
  • AHB arbitter
  • AHB decoder

31
De AHB
  • Staat voor Advanced High-performance Bus
  • De AHB is te verdelen in 4 logische elementen
  • AHB master
  • AHB slave
  • AHB arbitter
  • AHB decoder

32
De AHB
  • Staat voor Advanced High-performance Bus
  • De AHB is te verdelen in 4 logische elementen
  • AHB master
  • AHB slave
  • AHB arbitter
  • AHB decoder

33
Kenmerken AHB
  • Meerdere busmasters. De basis van het nieuwe
    concept!
  • Gemultiplexte bus. Oplossing voor meerdere
    busmasters
  • Regulering door een arbiter.
  • Pipelined and burst mode transfer
  • Split transactions
  • Een slaafje met een lange response tijd kan
    tijdens het decoderen van de opdracht de bus
    loslaten en een ander proces laten passeren.
    Hierna is het tijd voor het eerste slaafje als
    hij zijn werkje klaar heeft.
  • single clock edge operation
  • Heel handig wanneer je timing analyse aan de gang
    gaat. Hiermee is het mogelijk om je ontwerp te
    controleren en te verifiëren
  • non-tristate implementation
  • Gebruik van een centrale gemultiplexte bus (zie
    plaatje volgende sheet)
  • Variable busbreedte 16-,32-,(standaard in ARM
    ASB) maar ook 64,128 bits

34
Pipelining within a burst
Address and data of consecutive transfers are
transmitted in same clock cycle,
35
Wait cycles
Slave may not be ready to service
request. Inserts Wait cycle(s) by de-asserting
HREADY
36
AHB busstructuur
37
De ASB
  • Staat voor Advanced System Bus
  • De ASB is te verdelen in 4 logische elementen
  • ASB master
  • ASB slave
  • ASB arbiter
  • ASB decoder

38
De ASB
  • Staat voor Advanced System Bus
  • De ASB is te verdelen in 4 logische elementen
  • ASB master
  • ASB slave
  • ASB arbiter
  • ASB decoder

39
De ASB
  • Staat voor Advanced System Bus
  • De ASB is te verdelen in 4 logische elementen
  • ASB master
  • ASB slave
  • ASB arbiter
  • ASB decoder

40
De ASB
  • Staat voor Advanced System Bus
  • De ASB is te verdelen in 4 logische elementen
  • ASB master
  • ASB slave
  • ASB arbiter
  • ASB decoder

41
Kenmerken ASB
  • Meerdere busmasters
  • Regulering door een arbiter
  • Pipelined operation
  • Burst datatransfer
  • Kent 3 typen transfers
  • (sequential, nonsequential en address only)

42
Kenmerken APB
  • Is geoptimaliseerd voor minimale vermogenopname
  • Vereenvoudigde opbouw van het businterface
  • Relatieve lage bandbreedte t.o.v. de AHB of ASB
  • Geen Pipelined operations
  • Nieuwste versie APB relateert alle operaties
    t.o.v. de opgaande flank
  • Lage belasting AHB of ASB door toepassing van een
    APB bridge

43
Bus Conclusie
  • AHB gebruiken we als systeembus wanneer een hoge
    bandbreedte vereist is tussen de macrocellen en
    de ARM processor
  • ASB is de systeembus voor de midrange
    toepassingen of de oudere ARM processors
  • APB is een aparte bus die men gebruikt als
    interface naar peripherals met een lage
    bandbreedte welke geen gebruiken maken van
    pipelining
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