Office of the Secretary of Defense

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Office of the Secretary of Defense
Defense Microelectronics Activity (DMEA)
Doug Casanova Defense Microelectronics
Activity (DMEA)
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DMEA Mission

• DoD Mission - Provide microelectronics technology
  solutions
• Leverage advanced microelectronics technologies
• Improve reliability and maintainability
• Enhance capability and performance
• Address effects of rapid obsolescence
• Assigned as DoD Executive Agent for
  microelectronics DMS
• Coordinate DOD activities
• Develop OSD policy and strategy
• Serve as joint resource for DoD / government /
  industry / foreign allies
• Established by Secretary of Defense
• Defined DMEAs joint mission explicit
  organizational structure
• Report directly to the Deputy Under Secretary of
  Defense for Logistics Materiel Readiness

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The Challenge

• Increased DoD use / reliance on microelectronics
  (Smart weapon systems)
• Essential technology for all military missions
• Strategic, tactical, C4I, special ops
• Critical DoD technology
• Enabling technology for transformational
  opportunities
• Extended system life cycles (20 40 years)
• Increased reliability and maintainability issues
• Rapidly evolving, expanding missions - new
  capability requirements
• Diminishing Manufacturing Sources (DMS)
• Decreased technology stability
• Dynamic development drives obsolescence cycles of
  18 months or less
• Over 95 of all DoD DMS cases are electronics

Notional Projected Lifetime
Extended Life
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DMEAs Total Solution Approach

• Key Understand ALL the military requirements
• Verify System Problems
• Reliability and maintainability of system/boards
• Adequacy of spares
• Testability and repair issues
• Existing and projected obsolescence
• Develop Solution Options
• Component
• Aftermarket
• Substitution
• Emulation
• Custom
• Board / Box / System
• Technology Compression
• TOC savings over chip for chip
• Increased capability (transformation)
• Opportunity for open architecture

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DMEAs Advanced Reconfigurable Manufacturing for
Semiconductors (ARMS)

• Government / Semiconductor Industry partnership
• New flexible foundry technology
• New business model
• Government-held process licenses
• No commercial conflicts
• Prototype / low volume production by DMEA
• High volume production by industry
• Terminal transfer to DMEA upon OEM business
  decision
• Transfers industry-developed (commercial) IP
  technology
• COTS as a solution, not a problem
• Ensures continued DoD supply as industry flexes
  with market

Save processes, Not parts !
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DoD / Industry PartnershipTogether Supporting
the Warfighter

• Boeing / F-22 Obsolescence Problem
• Custom power management device no longer
  available
• Used throughout the weapon system
• Multi-year production requirement
• 500 parts / year X 10 years
• Part for Part solution determined the best value
• Requested DMEAs ARMS Foundry Support
• Solution - DMEA Boeing Cooperative Research
  And Development Agreement (CRADA)
• DMEA / Boeing worked together on developing new
  IC
• DMEA provided design engineering
• DMEA tested delivered new IC

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DMEA B2 Support

• B-2 Defensive Management System (DMS)
  unsupportable
• DMSMS plus lack of repair procedures, lack of
  tech data, spares, etc
• Prime Contractor wanted 54M to redesign system
• DMEA Proposed 22M to make supportable for next
  10 years
• DMEA performing System-level DMS Supportability
  Improvement Program
• System level assessment
• IC / board / box solution strategies
• Reverse engineering
• Solution design, prototype, and test
• Cost avoidance 32 Million

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DoD / Industry Partnership Evolved Sea Sparrow
Missile (ESSM)

• Raytheon / ESSM Obsolescence and RM Problems
• Obsolete Custom Microprocessor Interface Logic
  Devices
• Impacts future production of Missile Borne
  Computer (MBC) Subsystem
• Requested DMEAs Support to Eliminate
  Obsolescence
• DMEA Provided 3 Options
• Navy and Raytheon decided to improve RM, and
  testability, as well as resolve DMS
• DMEA to redesign 6 boards and 2 ASICs
• Microprocessor Interface Logic redesign
• Technology Compression to replace other
• ICs develop new FFF MBC Subsystem
• DMEA / Raytheon to Integrate Test new MBC
• Cost Avoidance of 20,000,000