Semiconductor

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Unit 1 Semiconductor Industry History
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Three Eras in the History of Electronics

• The Vacuum Tube Era
• The Transistor Era
• The Integrated Circuit Era

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The Transistor
1947 - The Bell Labs team of John Bardeen,
Walter Brattain, and William Shockley
invent an odd looking device
consisting of germanium, gold strips,
insulators, and wires called the
transistor.
1951 - Bell Labs scientists Gordon Teal and J.B.
Little grow a large single crystal of
germanium leading to the develop-
ment of the junction transistor.
1951 - Commercial manufacturing of
transistors begins
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Development of the Integrated Circuit

• Jack Kilby - Texas engineer who in 1959 formed a
  complete circuit on a piece of germanium
  semiconductor material.
• Robert Noyce - Mr. Intel - then at Fairchild used
  planar technology to wire individual devices
  together on a silicon wafer surface
• Jean Horni - Fairchild engineer combined a
  diffused junction transistor on a silicon chip to
  produce a solid state transistor with a flat
  profile

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Semiconductors
? The Developmental Decade ? 1951-1960 ?
The Processing Decade ? 1961-1970 ? The
Production Decade ? 1971-1980 ? The
Automation Decade ? 1981-1990 ? The
Production Era ? 1991- ?
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Wafer Sizes and Feature Sizes in Use Today

• 100mm 6 inch gt 1 ?m - .5?m
• 200mm 8 inch 1 ?m - .25?m
• 300mm 12 inch lt 1 ?m - .18?m?
• conversion 2.54 cm 1 inch

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Semiconductor Industry

• Industry Sales for Semiconductor Industry
• 2,000,000,000,000 - 2 Trillion dollars ( as
  of 1999)

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Key Terms Concepts
? Capacitor a two-element discrete device
that stores a charge on two conductors
separated by a non-conductor known as a
dielectric. ? Dielectric a material that
conducts no current when it has voltage
across it. (silicon dioxide, silicon nitride) ?
Diode a two element device that allows current
to flow in one direction between its
cathode and anode, but not in another. ?
Discrete Device a circuit having a single
electrical function. (capacitors,
resistors, transistors, diodes, fuses) ?
Feature Size the minimum width of pattern
openings or spaces in a device.
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Key Term Concepts

• ? Hybrid Circuits a structure consisting of
  an assembly of one
• or more semiconductor devices and a thin-film
  integrated
• circuit on a single ceramic substrate.
• ? Integrated Circuits a circuit in which many
  elements are
• fabricated and interconnected on a single
  chip of
• semiconductor material.
• ? Integration Scale Circuit Density a scale
  used to describe
• the number of components per chip

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Key Terms Concepts
? Junction Transistor the first use of a
process of growing crystals using a
precise doping procedure to create a single
thin layer of material for the base region
embedded in emitter and collector material
of the opposite type. ? Planer Processing
the process of building a flat-surfaced
device structure fabricated by diffusion and
oxide masking, with the junctions
terminating in a single plane. ? Resistor a
current limiting device that opposes the flow of
electrons. ? Semiconductor Material
an element such as silicon or germanium
intermediate in electrical conductivity between
the conductors and the insulators, in which
conduction takes place by means of holes
or electrons.
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Key Terms Concepts

• ? Solid-State Devices devices fabricated
  from solid materials,
• eliminated vacuum tube technology.
• ? Transistor a semiconductor device that
  uses a stream of
• charge carriers to produce active
  electronic effects.
• ? Triode a diode with a grid inserted
  between the diodes
• cathode and anode
• ? Valve a device that regulates the flow of
  electrical current
• ? Wafer a thin, usually round slice of a
  semiconductor
• material, from which chips are made.

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Key Terms Concepts
? Four Stages of Semiconductor
Manufacturing 1) raw semiconductor material
mined and purified 2) crystal growth and wafer
preparation 3) the devices or integrated
circuits are actually formed in and on the
wafer surface. Chip fabrication! 4) packaging