RMS Partnership Meeting

1
RMS Partnership Meeting 24 June
2003 Implementation of Commercial Electronics in
an Open Architecture to Meet DOD Reliability and
Supportability
2
ACI Business Areas
Programs
Customers
Engineering
Applied Research
Training
Product Support
U.S. Army Sustainment Center
Commercial Industry Defense Industry
Manufacturing and Production Support
Instruments
REPTILE
3
Supporting DOD Weapon Systems
Integrated Power System Technology

• On-shore source
• Reduced cost by 12000/tube

PAC-3
Reduce Future Risk
PRC-112

• Repair non-repairable modules
• Reduce sustainment risk
• Reduce battery cost
• CECOM Savings 8M over 10 years

Risk Reduction
Supply Risk Reduction
Sustainment Support
National Electronics Manufacturing Center of
Excellence
F-18
Cost Reduction
IMUTS
Standard Missile
C-6533 Intercom

• Reduced cost critical component by 50
• Replaced unavailable part
• Removed 53 pounds of hazardous mercury

• Manufacturing Risk Reduction
• Manufacturing Cost Management

• Auto-pilot Electronics
• Reduced Cost 60
• Reduced Size 83

• Reduce Sustainment Risk
• Reduce Cost 80

4
U.S. Army Sustainment Center
Direct Integration of Army Navy Hardware
Field Commands
Interactions to prioritize and assign resources
Alliances with other Services Mantech
Industrial Programs
U.S. Army Sustainment Center

Depots
Adds Strategic Capability and Financial
Leveraging to Navy COE
Rapid Response Funded Projects Sustainment Rep
Expert Advice
5
AN/ARS-6 Existing Fielded Legacy System

• Outdated 8086-Based Microprocessor in Legacy
  Systems
• Depot is Unable to ID Failures Repair Current
  Unit
• No/Little Self-Diagnostic Capability in all
  Systems that Allows Sub-Module Failure
  Identification
• Dominate Failures on Display Unit, RF Modules,
  and Power Components
• Obsolete Components - There is a Need to Upgrade
  Design
• AFFORDABILITY IS THE DRIVER
• Cost Goal of lt25K

Industrial Team Members EPS Boeing.
6
ARS-6 Upgrade ProgramKey Attributes for the
AN/ARS-6 Replacement

• Improved Affordability Target is lt 25K
• Open Architecture for Future Upgrades
• Use Existing CSAR Radios (112 CSEL)
• Use of COTS RF Linear Amplifier
• Use of COTS Digital Signal Processing Products
  for Computational Capability
• Full Documentation for Repair / Maintenance at
  Depot
• Common Firmware Software Baseline
• Software Configuration Control at Tobyhanna
  (Army)
• Provide 1553 Bus Capability when Available
• Leverage Existing Platform Capability -Providing
  Increased Mission Capability through System
  Redundancy
• Minimize the Logistics Costs Due to Common
  Systems and COTS Integration

7
ARS-6 Upgrade ProgramOperational Capability
Overview
SARSAT
UHF Base Station
UHF SATCOM
JSRC
DME/GPS Information
UHF STACOM/SARSAT UHF LOS Protected DME Ping/Alt
Technology DME
Survivor
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ARS-6 System Block Diagram
T/R Unit
Antenna Set
Pre Amplifier
GPS Module
Antenna Switching Interface Unit
Power Amplifier Module (COTS)
Receiver Model
Transmitter Module
Aircraft Interface I/O
Modified CSEL PRC-112 Radio
Modified CSEL PRC-112 Radio
Control Display Unit (COTS) Microcomputer
Motherboard Central Logic
1553 BUS
DSB Module (COTS)
Power Supply DC-DC Converter Module
Remote Display Unit (COTS)
Note Use existing ARS-6 Mechanical Hardware
Package outlines/cases to ensure compatibility of
new redesigned system with existing aircraft
mounting kits.
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Benefits of Approach

• Improved Reliability Through
• Redundancy in Transmit Receive Functions
• New Capabilities for ARS-6 in
• GPS Positioning In Terminal Phase of Mission For
  112 Survivor
• Protected Position Capability For Survivor With
  CSEL
• Future Protected Position Capability for All due
  to On-Board GPS
• Improved Affordability Through
• COTS Implementation Using Stable High Volume
  Markets
• Use Of Existing Military Personnel Recovery
  Radios (CSEL 112)
• Reduces Supportability Cost
• Increases Volume Procurement For CSEL (Reduces
  Cost)
• Improves Functionality of ARS-6 to Benefit the
  Survivor With Either 112D or CSEL

10
The EMMA Program Review
- Agenda

• EMMA Program Description
• Reliability Data Review
• EMMA Program Conclusions
• Future Activities

11
The EMMA Program Review
- EMMA Program Description

• EMMA Program
• Electronics Miniaturization for Missile
  Applications
• 3 Year Program
• Industrial and Academic Consortium
• ACI NSWC-Crane
• Raytheon Marquette University
• Rockwell Collins Georgia Tech Research
  Institute
• Program Objectives
• Determine Reliability of COTS Hardware
• Answers Question Can COTS Hardware Survive Harsh
  Environment With High Reliability?
• Demonstration Vehicle Standard Missile
• Prime Contractor Raytheon
• Assembly Electronics Assembly (EA) Unit
• Guidance system to the Standard Missile

12
The EMMA Program Review
13
The EMMA Program Review

• - Standard Missile Application

Area Under Review Autopilot Electronics Assembly
Unit
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The EMMA Program Review
- Program Strategy

• Build Test Vehicle With Advance Packaging
• Wide range of advanced packaging components
• All components daisy chained
• Leaded
• BGA
• Chip Scale Packages
• Flip Chip
• Board materials
• FR4 / Polyimide / Thermount
• Board finishes
• HASL / OSP
• Underfilled applied to specific components
• Test Hardware
• Thermal Cycling
• Temperature Humidity Bias
• Vibration
• Can Advance Electronics Packaging Survive Harsh
  Environments?

15
The EMMA Program Review
- Thermal Cycle Results

• Majority of Area Array Components Lasted 750 -
  1500 Thermal Cycles
• -55C to 125C for over 2000 Thermal Cycles
• Thermount And Underfill Improved Performance
• Underfill Required For Flip Chip Applications
• Device construction assembly methods impacts
  solder joint reliability
• Using warped boards (poor co-planarity) results
  in component solder joints with poor reliability
• Board Material Performance
• Below 1,500 thermal cycles Polyimide performed
  well
• Above 1,500 thermal cycles Thermount performed
  best

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The EMMA Program Review
- Thermal Cycle Reliability Data Review
17
The EMMA Program Review
- Thermal Cycle Reliability Data Review
18
The EMMA Program Review
- Thermal Cycle Reliability Data Review
19
The EMMA Program Review
- Temperature Humidity Bias Life Test
Observations

• 5 / 21 Package Styles Passed 1000 Hours Without
  Failures
• 5 / 6 BGA Packages Had More Than 30 Failures
• Flip Chip DCA And Lead Frame CSP Had High Failure
  Rates

NOTE Failure Mechanisms Have Not Yet Been
Determined
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The EMMA Program Review
- Vibration Test Results

• Underfill materials improved flip chip solder
  joint reliability
• Acrylic conformal coat improved solder joint
  reliability
• Parts with a package size / solder ball diameter
  ratio
• 301 ratio or less performed well
• Components less than 200 I/O survived

21
The EMMA Program Review

• - Vibration Test Results

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The EMMA Program Review
- COTS Tests Performed

• Test Specific COTS Active Components
• Voltage References
• Voltage Regulators
• Power Transistors
• Power Mosfets
• D/A Converter
• Test Components
• Thermal Cycling
• HAST
• HALT
• Salt Atmosphere
• Vibration
• Can COTS Active Components Survive Harsh
  Environments?

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The EMMA Program Review
- COTS Tests Results

• All Components Passed Tests
• Components in operation during tests
• Met component manufacturer specifications
• Can COTS Active Components Survive Harsh
  Environments? - YES
• If proper packaging is considered for specific
  application
• COTS components can survive harsh environments
• Environment Stress Testing only method to assure
  component reliability

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The EMMA Program Review
- Program Metrics

• Program Goal Actual
• Space Reduction 80 83
• Mfg Costs Reduction 52 60
• Increase In MTBF 50
• Overcame Component Obsolescence with COTS
  Demonstrated
• Proved Feasibility Of Using COTS Technology In
  High Reliability Environment

25
The EMMA Program Review
- Standard Missile Implements Technology

• New EA Unit Interchangeable With Current EA
• Reduces 6 boards into 1 board with advanced
  packaging
• Resolves Potential Sustainment / Component
  Obsolescence Issues
• Reduces Implementation Risk Associated With Using
  New Technologies

Old Electronics Assembly Unit
New Electronics Assembly Unit
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The EMMA Program Review
- Program Conclusions

• Advanced Electronic Packages
• Can survive harsh environments
• Can meet high reliability requirements
• COTS Hardware
• Can survive harsh environments
• Can meet high reliability requirements
• Caveats
• Must understand environmental stresses
• Design and manufacturing processes
• effect reliability

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The EMMA Program Review
- Future Activities

• Technical Applications Guidelines Handbook
• Summarizes EMMA Program technical reports
• Available from ACI upon request
• Test New Electronic Packages
• Serve as a follow-on to EMMA Program
• Can future advanced electronic packages survive?
• Lead Free Solders
• Considering performing same program with lead
  free solders