Science Future Programme Technologies

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Science Future Programme Technologies
Peter Falkner Peter.Falkner_at_esa.int Planetary
Exploration Studies Science Payload Advanced
Concepts Office ESA - ESTEC
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Overview

• Science Missions under development/study/i
  n operation
• Technology Reference Missions under study
• Considerations for Data System
• Highly Integrated Payload Suite
• - Remote Sensing (Orbiter) -
  Centralized Data Processing Unit - example
  BepiColombo MPO - example BepiColombo MMO
• Integrated Avionics and Payload Processor -
  In-situ sampling (e.g. Lander) - example
  BepiColombo MSE
• Technologies

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Science Missions
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Science Missions Under Development
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Science Missions under Study
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Missions in operation
? Source for lessons learned !
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Science Missions Post Operations
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Technology Reference Missions
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Technology Reference Missions under Study
Venus Entry Probe

• Technology Reference Missions (TRMs) allow the
  ESA Science Directorate to plan strategically the
  technology developments required for potential
  future science missions while ensuring a highly
  innovative none-mission specific longer term
  component.
• These TRMs have targeted mission concepts
  which, independent of mission details, focus on a
  strategic and innovative themes e.g. ultra-high
  resolution high energy imaging optics or in-situ
  sampling during planetary exploration missions.

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Technology Reference Missions

• Use of Microsats (100 kg class)
• Smaller launcher, lower cost
• More frequent (phased approaches)
• Based on Highly Integrated Payload Suites
• Use of centralised processing system
• Require resource reduction (Payload and
  S/C-subsystems)

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Considerations for Data Systems
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Data System Considerations

• Different missions with variety of different
  requirements? Number and Size of Instruments
  Small number of larger instruments
  or Collection of several smaller
  instruments
• ? Level of Processing Heavy
  processing requirements (e.g. Image processing)
  or Moderate requirements
  (e.g. Sample and Return mission). ? Complexity
  of the Mission.
• Applications in different Elements ? Orbiter,
  Lander, Aerobots, Rovers, Moles, Instruments,
  Swarms of Microprobes, Completely
  different complexity Completely different
  available resources
• Environmental conditions ? radiation ?
  thermal ? mission lifetime, ? drive
  architectural design, selection of components.
• ? Requirement for very different systems,
  architectures, design solutions.

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Highly Integrated Payload Suite (HIPS)
Physical Front EndsDetectors, Optics,..

• Data Handling
• Data Processing
• Front End Control
• Housekeeping
• FPGA
• multiple DSP
• ?Cs

• S/C interface
• DC/DC converter
• Data I/O
• Commanding

MPO Instrument Suite

• Integration Activity
• Integration of instruments into a suite of
  instruments
• Apply Miniaturization
• Reduction in Harness
• Reduce number of S/C interfaces
• Reduction in resource requirements
• New Detector Technologies to avoid cooling, e.g.
• Sharing of resources
• Use of ASIC front-end-electronics
• Use of FPGAs, 3D-stack technology, etc.

Collection of Instruments
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Highly Integrated Payload Suite
RAM

• Instrument Controller- FPGA based
• hardware control
• data flow control
• serial interface

• Front End Electronic- A /D mixed signal
• A/D conversion

Program Memory DM- Software- Tables -
Configurations- PROM, EEPROM, RAM
Det
Requirements Thermal MechanicalPointingStability

RAM
High Performance Instrument DPU- Data Processing
and compression- Data Handling- Data Storage
Management - Command Interpretation Execution -
Timestamping- Instrument Master controllerDSP
100 MIPS

• Instrument Controller- FPGA based
• hardware control
• data flow control
• serial interface

• Front End Electronic- A /D mixed signal
• A/D conversion

Det
Spacecraft Interface- Command I/O - Data I/O -
redundant (A/B)
RAM

• Instrument Controller- FPGA based
• hardware control
• data flow control
• serial interface

• Front End Electronic- A /D mixed signal
• A/D conversion

Det
Mass Memory- Buffer for Data storage
Central Power Supply 50 70 Watt unregulated
inputoptimized topology

• Housekeeping Controller- FPGA based
• monitoring
• serial interface

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MPO HIPS present model P/L
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Central DPU ExampleRPC-PIU Data Processing and
Interface Unit
Courtesy of Imperial College London, A. Balogh
Rosetta Plasma Consortium (RPC)
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Redundant Design of Central HIPS DPU
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Instrument Controller
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Instrument Controller - Example
Crystal
Stereo SEPT Instrument Controller, P.Falkner 2001
FPGA
DAC
SRAM
Instrument controller FPGA basedStereo / Solar
Electron and Proton Telescope
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BepiColombo MMO
Courtesy of ISAS
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Mercury Surface Element (MSE)

• Highly integrated system
• system view
• integration of instruments and avionics.

• Characteristics
• Central DPU (Shared with lander avionics)
• Central Memory
• Central Housekeeping Unit
• Central Payload Power Supply
• Only one TM/TC interface

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Technologies
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Technologies /1

• Mass memory (Gbits)- COTS based / Radiation
  tolerant- Hi-Rel / radiation hard- small, fast,
  reliable.- volatile and non-volatile Memories
• Serial Interface Technologies - VHDL modules to
  be integrated in FPGAs (Space Wire, CAN, )-
  High speed gt10 Mbps, better 100 Mbps
• - small overhead, tailored for
  application, low power, low resources.
• DPUs and DSPs on a chip/module/stack- no or
  small count of external components- small, low
  power, reliable
• Space qualified Fixed Point DSPs- smaller
  overhead- sufficient for many applications-
  complete systems
• DPU and DSP cores as VHDL code- integration in
  High density FPGAs- flexibility provided by
  FPGA if not already loaded with DPU-core.
• Software Development Tools - maintained and
  widely used (consider duration of space missions
  !).
• - running on different platforms.

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Technologies /2

• Highly Integrated Control and Data Handling
  Systems- standardized only when applicable (try
  not to serve to many different applications)-
  adaptable (speed, data volume, ...)- small !,
  low power !, reliable !
• Error and failure control algorithm
• - self repair and maintenance
  capabilities (interstellar mission, long duration
  missions).
• Smart Sensors- integrated readout- integrated
  data I/O- independent- simple interface
• Integrated housekeeping unit
• - Temperatures, voltages, currents,
• - Integrated Multiplexer and ADC (gt10
  bit).
• - Serial Data Interface.

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Technologies Trends Problems

• Hardware
• Begin radiation use of qualified COTs,
  radiation tolerant FPGAs and ASICS?
  considerable improving technologies. ? use of
  spot shielding
• Hostile environmentuse of Hi-Rel radiation hard
  components (decreasing market !), use of
  radiation hard ASICs (cost!) and FPGAs
• Long mission duration self repair mechanism,
  multiple redundancy (e.g chips with redundant
  seas of gates with reconfiguration
  capabilities).
• Software
• Growing distance from Earth growing onboard
  autonomy.
• Mission Operation cost ? may also drive onboard
  autonomy.
• Increasing software size ? problem of
  testability.
• Tools
• Fast development in Technology, Computing and IT
  ? Challenge to archive tools (HW SW)
  (e.g. Cassini/Huygens , dev. 1991, launch 1997,
  arrival 2004/2005)
• - End -