X-Ray%20Inspection

1
X-Ray Inspection

• High-resolution X-ray inspection has been used to
  evaluate the quality of the flip-chip assembly of
  dummy and active modules.
• Technique
• High-resolution 2-5 microns
• Real-time imaging.
• Missing bumps or merged bumps easily visible.
• Voids possible to observe
• X-ray of items made by AMS and Sofradir done, so
  far, in U.S. using equipment from
  X-Tek(purchasing inspection time by the hour).
• X-ray of items made at IZM done in-house
• Examples on next pages.

2
Examples of X-Ray Inspection
Sofradir
IZM
AMS
IZM
3
Active Devices - Correlation
Column 0
Column 0 and 1-2
Complete correlation between pairs of dead and
double rate channels with bridged bumps
Column 1-2