Proposed%20Path%20Forward

1
Proposed Path Forward

• Robert Johnson

2
Whats Wrong with Parlex Parts?

• Work more with Parlex to try to understand what
  may have changed to get such dramatic differences
  in flex behavior from one lot to another.
• Analyze the plating and copper substrate on new
  vs. old Parlex pitch adapters.
• Search for more of the pitch adapters rejected
  last year for dimensional reasons. We have since
  then determined that the criterion was much too
  tight, so most of those items could be used to
  get some production going if they were still in
  good shape.
• This seems to be the only hope of getting some
  MCMs produced in the short term.

3
New Dyconex Pitch Adapters

• Analyze by DPA assemblies with Dyconex pitch
  adapters to try to understand why they cracked on
  the right-hand 25.
• Test assembly with Dyconex pitch adapters at
  Teledyne with reduced tension and using PWBs with
  good radius machining.
• Test the GA fixture with Dyconex pitch adapters.
• Procure a production lot of Dyconex pitch
  adapters (in progress).

4
Improved Parlex Pitch Adapters

• Procure pitch adapters from Parlex with the
  copper grain oriented at 90 degrees and with
  various Ni plating thicknesses (in progress).
• Start the procurement process for a production
  lot of pitch adapters with the new grain
  orientation, at least to make sure that Parlex
  gets the material in house.

5
MCM Machining

• Inspect the existing stock of machined PWBs to
  remove any without adequate machining of the
  radius.
• Review the PWB machining with Diamond Tool Die.
• Review and improve the inspection controls on the
  radius machining.

Examples of good and bad machining.
6
New Tooling

• Continue with the development and proving of the
  new pitch-adapter bonding tooling.
• Introduce it into the production if and when it
  can be shown to work better than the existing
  tooling (assuming that we obtain usable pitch
  adapters that work at all).

7
Encapsulation Issue

• Lets not forget that we still have to verify
  whether weve solved the issue of encapsulation
  delamination.
• Several MCMs with non-flight chips were wire
  bonded and encapsulated at Teledyne and were
  delivered to SLAC today.
• Send a subset to GSFC for acoustic microscopy
  inspection.
• Thermal cycle the rest and then send them also to
  GSFC for the acoustic microscopy.