Project Status Review

1
ConnectCore 9C Embedded Module Overview
2
Job-to-be-Done

• Modules providing cost-effective, core processor
  functionality and network connectivity
• Provide common hardware and software platform for
  a variety of connectivity options (Ethernet,
  802.1x, Cellular)

3
What is a Core Module?

• Core Module
• A highly integrated module containing CPU,
  memory, and (occasionally) core peripherals
• Sometimes called a System on Module (SoM)
• All I/O is brought down to the carrier board
  through connectors
• Market drivers
• Accelerates time to market
• Enables OEM to focus on prime hardware (carrier
  board) and software competencies
• Enables module migration

4
Module Market Segments
5
Current Situation

• Digi offers ARM7-based Connect modules which
  primarily provide co-processor integration to
  connect serial devices to IP networks (segment
  3,4)
• These embedded modules provide our customers
  faster time to market and ease of use than
  NETARM processors
• Digi lacks core-processor platforms which can
  address the embedded x86-based board and Core
  module market moving to ARM (segment 1)
• Our customer base is requesting ARM9-based
  modules (segment 1)

6
Synergy

• Strategically, ARM9-based Modules
• Are a natural extension of both our NETARM
  processor business and our Connect module
  business
• Leverage our NETWorks development tools and
  networking software platform
• Hard- and software options allow customers to
  standardize on common module platform across
  multiple product lines
• Captures previously not addressable core module
  customers and provides step-up option for
  existing co-processor module customers
• And are consistent with Digis business strategy
• Making Device Networking Easy
• Seamless Migration
• Operationally, ARM9-based Modules
• Provide higher revenue/margin dollars and faster
  time to money.
• Improve our customer intimacy
• Improve our ability to get vertical
• Improve our ability to respond to customization
  requests
• Create an on-ramp to processors, should
  customers require it

7

 
ConnectCore9C Overview

• Embedded ARM9 Core Module
• 155 MHz NS9360 processor
• Based on 32-Bit ARM926EJ-S
  DSP/Jazelle-enhanced RISC CPU
• 4MB Flash, 16MB RAM
• Low power consumption
• 3.3V _at_ 750mA (estimate)
• Industrial Operating Temperature
• -40C to 85C
• Emissions / Immunity
• FCC Class B, CE Mark
• Product Reliability Tests
• HALT (Highly Accelerated Life Test)
• Power Management
• Sleep Mode
• Integrated Real-Time Clock

3.5
2.1
8

 
ConnectCore9C Overview

• Customization flexibility through population
  options
• Processor speed grades
• 103, 155, 177 MHz
• Memory
• 4-64 MB Flash, 16-128 MB SDRAM
• On-Board Connectors
• Ethernet, USB Host

• Inexpensive and widely available main signal
  connector for customer
• SO DIMM 144-position socket
• AMP 114-01114 or equivalent
• Suitable for manual and machine placement
• Soft Tray
• Hard Tray
• Tape-and-Reel

9

 
ConnectCore9C Overview
A
B
C
10

 
ConnectCore9C Overview

• 10/100 Mbit Ethernet Interface
• On-board RJ-45 connector w/integrated LEDs
• Population option w/o on-board RJ-45 connector
  possible
• 802.3af Power Pass-Thru
• Mid-span and end-span
• Available on dedicated 4-pin header
• JTAG Header
• Up to four high-speed TTL serial ports
• Asynchronous data rates up to 921 kbps

• USB 2.0 compliant Host/Device
• Full speed (12 Mbps) and low speed (1.5 Mbps)
• Population of USB Host connector on module
  possible, if required
• Up to four SPI Interfaces
• Master and Slave mode
• Master data rate up to 8.33 Mbps, Slave up to
  6.25 Mbps
• I2C Bus
• Fast (400 kHz) and normal (100 kHz) mode

11

 
ConnectCore9C Overview

• LCD Controller
• Support for 18-bit active matrix TFT
• Up to 18 bpp (256k colors)
• Max 18-bit color depth in SGA mode _at_ 80 Hz
• Max 8-bit color depth in XGA mode _at_ 80 Hz
• Single/dual panel STN displays
  (color/monochrome)
• Up to 16 bpp 444 RGB (3375 colors)
• 1, 2, 4 bpp palletized grayscale
• Up to 55 GPIO
• Depending on interface configuration
• Final number TBD
• Compact Form Factor
• DIMM design
• 2.1 x 3.5 for Ethernet version
• Clear zone specs for future versions
• WLAN
• Cellular

12

 
ConnectCore9C Overview
13

 
Development Board
Feature Summary

• MMC/SD Socket
• Logic Analyzer / Application Kit Connector
• Provides all signals available on module
  connector
• Hard- and Soft-Reset Buttons
• LCD Interface
• 31-pin TTL DF9-31
• Standard 4-pin Touch Screen Header
• DVI Circuit and connector
• Test Points
• Prototyping area
• Power Supply
• 5-12VDC
• 802.3af w/full support for end- and mid-span
• Provides power to LCD backlight

• 4 DB-9 Serial Ports
• 3 x RS232-only
• 1 x switch-selectable MEI
• SPI Header
• I2C Interface
• SDL Connector with 5V power
• Three 16-Bit GPIO Expanders w/LEDS and
  push-buttons
• GPIO Test Bed
• Header providing serial port GPIOs
• DIP Switch Toggle for Inputs
• Header and Screw Terminal Connectors
• USB 2.0 Interface
• Device w/single standard type B connector
• Host one-to-four w/double connector

14

 
Planned Future Versions

• Initial release provides support for NETWorks
  (6.3) development platform
• Introduction at ESC in San Francisco (early
  March 2005)
• Limited form factor sample availability at time
  of ESC
• General availability expected in early June
  2005
• Development Kits with software/hardware debug
  options
• gdbstub
• Raven
• Additional module versions expected to follow in
  FY05/06
• WLAN (802.11g)
• Cellular (GSM/GPRS)
• Digi plug-and-play firmware version TBD
• Future support for other development
  environments
• Microsoft Windows CE
• Linux
• Java

15

 
Preliminary Roadmap
Q2 2005 Q3 2005
Q4 2005 Q1 2006
802.11g WLAN Plus Wired Ethernet Modules
Digi plug-and-play Firmware w/VNC Extensions?
Windows CE and Linux Platform Support
Wired Ethernet 10/100 Mbit Modules
NETWorks Platform Support
GSM/GPRS Plus Wired Ethernet Modules
16
Positioning

• Provide a family of Core Processor networked
  modules that
• Are NETARM-based
• Are multi-OS compatible
• Are easy to use and modify
• Cover both wired and wireless (802.11X and
  cellular) IP topologies
• Have a common form factor to enable
  interchangeability and industry recognized
• Are sellable though our existing channels
• Have a low support requirement
• Are supplemented with fee for services offerings
  to enable customization
• Are profitable (gt50 margin)
• Positioned as
• Easy to use
• Good price/performance capabilities
• Easy migration path to chips

17
Competitors

• Kontron
• FS Forth
• Rabbit
• Netburner
• SSV
• Others including Ampro, Arcturus Networks,
  Intrynsic, InHand, Logic, SNMC, Advantech

18
Notable Competitors
19

 
Launch Plan

• Initial release and introduction at ESC in San
  Francisco on March 8, 2005
• Pre-show eNewsletter
• Day of show eNewsletter
• Follow-up eNewsletter
• EDN on-line advertising to support ESC show
  launch
• Press Release and PR interviews at ESC
• Channel and Sales training in March
• Sales team samples in May
• General Product availability beginning June