RICH Electronics status

1
RICH Electronics status
ERPD (QM)
RHV (QM)
JINR (FM)
2
RICH ELECTRONICS DAQ STATUS

• 4 FM 2 FS
• Thermal Stress
• Vibration

RDR model 1

• 2 FM 1 SFS
• Thermal Stress
• Vibration

RDR model 2

• 2 FM 1 SFS
• Thermal Stress
• Vibration

RDR model 3

• 4 FM 2 FS
• Thermal Stress
• Vibration

JINR model 4
3
RICH cabling DAQ summary
4
RHV FM Status

• 6 RHV FM at CIEMAT
• Functional test done
• Thermal cycle test in air (10 cycles), done.
• Covers, ready except HT.
• Interface with LUSS in progress.
• Zirconium washers ordered
• Vibration to be done
• Thermal cycles after vibration to be done
• TVT to be done

RHV FM
Functional test at CIEMAT
10 cycle thermal test in air
RHV Cover
5
RICH cabling HV summary
6
ERPDs FM Status

• All DCDC boards ready at CIEMAT
• Assembling DCDC-gtI-Frames ready.
• Box mechanics, ready.
• Connectors screws and TB already ordered.
• Thermal cycles before vibration to be done
• Vibration
• Thermal cycles after vibration to be done
• TVT to be done

ERPD QM
Thermal filler mounting
DCDC board mounting
7
RICH cabling LV summary
8
RICH cabling DTS HT summary