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Progress in Noise Figure Studies of GaN HEMTs

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Title: Progress in Noise Figure Studies of GaN HEMTs


1
Progress in Noise Figure Studies of GaN HEMTs
CANE Center for Advanced Nitride Electronics
  • University of California, Santa Barbara
  • Chris Sanabria Hongtao Xu Tomás Palacios Likun
    Shen Arpan Chakraborty Sten Heikman Val
    Zomorrodian Umesh K. Mishra Robert A. York

UCSB VIRGINIA TECH WRIGHT STATE UNIVERSITY
UNIVERSITY OF MISSOURI-ST. LOUIS CALTECH THE
UNIVERSITY OF MICHIGAN THE OHIO STATE UNIVERSITY
2
From Last Review
  • Two Differential Oscillator Designs
  • First GaN differential oscillator
  • Accepted IEEE Microw. Comp. Lett.
  • Excellent harmonic performance
  • Comparable power to other GaN results
  • Phase Noise Measurements
  • High 1/f3 corner (this and others work)
  • Similar noise performance at off-sets past 1/f3
    corner

3
New Improved
  • Redo of previous design
  • Larger tank C
  • Smaller tank L
  • Still NO FIELD-PLATE
  • SiN capacitors (No BST)
  • Biased lower than previously
  • Had thought highest power best phase noise
  • Biasing lower ? 4 dBc/Hz phase noise improvement
  • Similar power and efficiency to previous work

4
New Improved
  • Taking into account measurements being at
    different biasings, is a 16 dB improvement
  • Just the tank caused improvement?
  • Better material?
  • Still working towards oscillator prediction
  • But this presentation will be about

5
Outline
  • Modeling
  • NF with gate leakage
  • Some insight on field plate NF
  • NF modeling with Zgd
  • Small-Signal Parameters vs. Bias
  • Noise Measurements
  • NF and gate leakage part 2
  • AlN interlayer with Sap. SiC substrates study
  • Noise of Other Devices
  • High frequency (Tomás Palacios)
  • Thick GaN cap (Likun Shen)

6
Systems
  • Focus Load (Source)-Pull
  • Learning system for noise
  • NF to 26 GHz, to 40 GHz later
  • Cryogenic Source-Pull NF Measurements
  • Tuner stands completed
  • RF lines replaced, will be back soon
  • Maury Load-Pull
  • Wider frequency range (3 to 16 GHz)
  • New configuration
  • No load tuner
  • Better repeatability (days instead of weeks)

7
Predicting Noise Figure
  • Had Previously Used
  • Pucel Model
  • Pospieszalski Model
  • Concerns
  • Can model in a circuit simulator
  • -Might be hard to make bias-dependent
  • -Both require NF measurements prior to modeling
  • -Not easy to explain device noise (ex. Why FP
    better?)
  • Different approach ? van der Ziel

8
How To Predict Noise Parameters?
  • Usually in very simple form
  • Math is easy
  • Insightful
  • Will derive with gate leakage
  • Assumptions
  • Rd is negligible ? on output
  • Cpgd, Cpgs, Cpds, Cds, Lg, Ls, Ld are negligible
    ? only change matching
  • No feedback (for the moment)
  • Zgd Rgd 1/(jwCgd) open
  • Emitter degeneration
  • No correlation between sources
  • G 2/3

9
Predicting Noise Parameters
  • Even with Igs, equations are manageable
  • Insights
  • F a Ig
  • The drain noise term and input parasitics term
    are comparable in contributing to NFmin at best
    noise biasing
  • Need Rs, Rg, Ri, gm, Cgs, Igs, and G to predict
    noise

10
Modeling with Gate Leakage (but Not Zgd)
  • G 2/3. Other values not as accurate.
  • Works on all previous samples.

11
How Does Gate Leakage Affect the Noise Parameters?
  • GaN HEMTs have enough gate leakage to be a
    problem for noise
  • Matching may be a little less dependent on gate
    leakage because parasitics were ignored in
    modeling
  • Next Get working in ADS

12
How Does Gate Leakage Affect the Noise Parameters?
  • A 0.1 0.3 dB degradation for these devices

13
Field Plate Noise Parameters
  • Measurements _at_ 5 GHz, from H. Xu
  • Field plate changes the noise parameters in a
    complicated way, but for an improvement.
  • H. Xu has also seen a similar trend in phase
    noise performance of oscillators with FP
  • Is this improvement from improved Rg?

14
Other Parasitics and Noise Parameters
  • Table at 5 GHz
  • Rg contributes 0.1 dB to NF
  • Hard to believe FP improvement of noise is just
    from lower Rg
  • Rs contributes 0.2 dB to NF

15
Modeling Including Zgd Current Work
  • Theoretical analysis too complex to gain useful
    insight.
  • Work to date shows
  • Gain decreases ? NF increases
  • Changes noise match
  • Might have to look for another way to explain
    field plates effects on noise.

16
Modeling Summary
  • Reasonably good noise parameter prediction when
    including gate leakage
  • ? can be used to understand where noise in device
    is coming from
  • Gate leakage important for noise performance of
    GaN HEMTs
  • A decrease in gate resistance is not enough to
    explain why field-plating helps the noise
    performance of GaN HEMTs

17
Outline
  • Modeling
  • NF with gate leakage
  • Some insight on field plate NF
  • NF modeling with Zgd
  • Small-Signal Parameters vs. Bias
  • Noise Measurements
  • NF and gate leakage part 2
  • AlN interlayer with Sap. SiC substrates study
  • Noise of Other Devices
  • High frequency (Tomás Palacios)
  • Thick GaN cap (Likun Shen)

18
Small-Signal Parameters
  • 1. For bias-dependent noise modeling, must know
    how the small-signal parameters change with bias
    too
  • Easier to model noise in circuit simulator if
    noise sources dont change vs. bias
  • Not bias-dependent
  • Thermal noise (but the resistance may be
    bias-dep.)
  • Bias-dependent
  • Shot noise
  • Low-frequency noise
  • Drain noise might be (G)
  • 2. When comparing different devices for noise,
    want to see if any differences that may occur in
    noise is from noise sources or from a difference
    in the device small-signal parameters.
  • How are the small-signal parameters different for
  • SiC?
  • Sap?
  • With a AlN interlayer?
  • Field-plated devices?

19
Small-Signal Parameters
  • Extraction (Instead of H. Xus large
    small-signal model)
  • S-parameters taken during noise measurements at
    each bias
  • Small signal circuit constructed for each bias in
    ADS
  • Checked against measured S-parameters
  • Applied to
  • Sapphire no AlN interlayer
  • Sapphire with AlN interlayer
  • SiC no AlN interlayer
  • SiC with AlN interlayer
  • Devices are not field-plated
  • Extrinsic parasitics assumed to be the same
  • Will cause error, but should be the same error
    across the different samples
  • Will only show two samples for clarity

20
Small-Signal Parameters Capacitances gm
  • Versus Samples
  • Only difference is Cds smaller for SiC samples
    (not shown)
  • Versus Bias
  • Ids? Cgd ? (25 fF ? 50 fF)
  • Ids? Cgs ? (0.22 pF ? 0.24 pF)
  • gm as expected for DC I-V
  • t and Cds relatively flat

21
Small-Signal Parameters Resistances
  • Versus Bias
  • Ids? Ri ? (10 W ? 18 W)
  • Ids? Rds ? (1100 to 650 W
    ? 400 to 200 W)
  • Rgd hard to determine, probably changes a little
    as with Cgd
  • Versus Samples
  • SiC samples have better Rds

22
Small-Signal Parameters Summary
  • Parameters not different with AlN layer
  • True when looking at similar ft, fmax devices
  • AlN layer still gives better devices (ft and fmax
    higher)
  • Only Cds and Rds are different between SiC and
    Sapphire samples.
  • Not important for noise measurements and modeling
  • But the SiC samples will have better fmax because
    of better Rds
  • Some of the parameters important for noise (Ri,
    Cgs, extrinsic resistances) might be able to be
    modeled with an average value, or a linear fit
    vs. bias.
  • No bias-dependence for field-plated devices, but
  • From H. Xu LFP vs. Rg
  • With LFP ? , Cgd ? and Rgd ?

23
Outline
  • Modeling
  • NF with gate leakage
  • Some insight on field plate NF
  • NF modeling with Zgd
  • Small-Signal Parameters vs. Bias
  • Noise Measurements
  • NF and gate leakage part 2
  • AlN interlayer with Sap. SiC substrates study
  • Noise of Other Devices
  • High frequency (Tomás Palacios)
  • Thick GaN cap (Likun Shen)

24
SiC/Sap., AlN Study Reminder
  • Showed previously that AlN layer helps noise
    performance
  • Now trying to
  • Reconfirm with new samples
  • See if AlN interlayer on SiC gives even better
    performance
  • Was having problems measuring because

25
Why the Difference?
Very similar
  • An example of what we want to see for
    measurements

26
Why the Difference?
Noisier than expected
Almost 1 dB variation
  • Why such a change? ft fmax are similar

27
A Check on Measurement Accuracy
  • At 5GHz, still a 0.5dB Nfmin difference at 100mA
  • Easier to see at 10GHz
  • 0.7 dB _at_ 90 mA
  • 1 dB _at_ 100 mA

28
Answer Gate Leakage
  • Devices biased at Vds 5 V, Ids 10 mA, at 10 GHz
  • A good HEMT with Igs 5mA has a NF 1.9 dB
  • Must monitor ft, fmax, and Ig if comparing NF of
    different devices.
  • If we use van der Ziel model with typical
    small-signal parameters and gate leakage to
    predict these values

29
SiC/Sap., AlN study
  • No field-plates
  • Same trend with new samples
  • Max Igs of 6mA
  • SiC performs better at higher biasing compared to
    Sap.
  • SiC performance probably the same with/without
    AlN layer

30
Outline
  • Modeling
  • NF with gate leakage
  • Some insight on field plate NF
  • NF modeling with Zgd
  • Small-Signal Parameters vs. Bias
  • Noise Measurements
  • NF and gate leakage part 2
  • AlN interlayer with Sap. SiC substrates study
  • Noise of Other Devices
  • High frequency (Tomás Palacios)
  • Thick GaN cap (Likun Shen)

31
High Frequency Devices
  • Tomás Palacioss new standard high-frequency
    devices
  • Newer devices are field-plated
  • Better than a year ago by
  • 0.3 dB
  • NFmin 0.4 dB _at_ 10GHz
  • Believed to be the record for the gate length
  • Will measure with Focus load-pull later

32
Thick GaN Cap Devices
  • Newer devices from Likun Shen
  • High leakage at low bias (68 mA at Ids
  • 10 mA)
  • Lower NF at high Ids than even standard HEMTs on
    SiC
  • Thick cap repressing noise?
  • Measure before passivation for newer standard
    HEMT samples

33
Summary
  • New differential oscillator has good phase-noise
    performance even without FP, high-Q capacitors,
    or optimizing for phase noise.
  • Noise Figure of non-FP devices can be predicted
    without prior measurements.
  • Gate leakage of GaN HEMTs is a problem for noise.
  • Gate resistance alone does not explain why a FP
    device has better noise performance, nor does a
    feedback explanation.
  • A thin AlN interlayer helps the NF performance at
    larger biasings.
  • SiC gives better NF performance than Sapphire
    (even with an AlN interlayer) at large
    drain-source current biasings.
  • UCSB may have the NF record in GaN (more to
    come).
  • Thick GaN cap devices show low noise even at a
    high bias.

34
Looking Forward
  • First
  • Cryogenic NF measurements
  • Try to understand FP
  • NF measurements
  • Look at bias-dependence
  • Try different modeling
  • Correlation?
  • Other?
  • Try to derive G?
  • Comparison with GaAs HEMTs
  • Then
  • Low-frequency noise setup
  • Noise modeling in ADS working with large
    small-signal model to predict phase noise
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