SISSI: Simulator for Integrated Structures by Simultaneous Iteration

1
Introduction

• SISSI Simulator for Integrated Structures by
  Simultaneous Iteration
• Experimental software package on top of a
  particular design kit within Cadence Opus
• Tools of our own development THERMODEL,
  TRANS-TRAN, THERMAN
• Glued by scripts in the SKILL language of Cadence
  Opus
• Schematic entry, layout extraction, results
  visualization - system services of Opus
• Benchmark problems simulated with success
• Results reported at THERMINIC and in different
  papers
• The package became obsolete since the design kit
  was abandoned

2
The complete thermal model

• Each element of the matrix of thermal couplings
  can be described as presented
• If the electronic circuit contains N thermally
  coupled (dissipative and/or temperature
  sensitive) components, N2 ladders are needed. For
  N2

3
Electro-thermal device models

• A basic set of electro-thermal device model has
  been implemented
• Need for advanced models - we are working on
  implementation of an electro-thermal EKV MOS model

4
The general flowchart
5
Design flows

• Schematic entry draft layout
• Simultaneous editing of schematics and layout
  (for components relevant from thermal point of
  view)

6
Design flows

• Schematic entry draft layout

7
Design flows

• Layout-based electro-thermal simulation

8
Design flows

• Layout-based electro-thermal simulation layout
  extractor

9
Layout extractor

• Techno file editing

10
Layout extractor

• Defining the include mask
• SIAL layer for extracting Si-Al contacts to
  consider the Seebeck-effect if needed

11
Layout extractor

• Result layout of dissipating temperature
  sensitive elements (THERMAN CIF formats)

12
Presentation of the results

• Nodal voltages, device temperatures,
• Device dissipations,
• Function plots
• transient,
• transfer
• Bode
• Temperature maps
• 2D or axonometric
• profile cross-sections

13
Presentation of the results
14
Experiences CMOS OpAmp
DC simulation good agreement between simulation
and measurement
15
Experiences micro-thermostat
Tight thermal coupling, effect of the
encapsulation. Good agreement between simulation
and measurement
16
Experiences thermal delay line
Transient electro-thermal simulation good
agreement between simulation and measurement