A Quality and Technology Network

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A Quality and Technology Network
ELECTRONICS MANUFACTURING
Supporting European SMEs in Lead-Free
Soldering Implementation for a More Competitive
Green Market Project LEADOUT November 1-2, 2006
INTERNATIONAL WORKSHOP ON POLLUTION PREVENTION
AND SUSTAINABLE DEVELOPMENT Bringing Synergy to
Pollution Prevention
Margarida Pinto
instituto de soldadura e qualidade
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Overview

• Background Motivation
• Objectives
• Project Overview
• Main Results
• Future Work

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LEADOUT Project
Low Cost Lead-Free Soldering Technology to
ImproveCompetitiveness of European SME
Collective Research
Duration 36 months (Sept 2004-Sept 2007)
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Overview

• Background Motivation
• Objectives
• Project Overview
• Main Results
• Future Work

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Project Background Motivation
RECENT EUROPEAN DIRECTIVES Harzardous Products -
RoHS (2002/95/EC) Electronic Equipment End of
Life - WEEE (2002/96/EC)
SME LACK OF KNOWLEDGE AND LOW LEVEL OF LFS
IMPLEMENTATION
LACK OF RESEARCH WORK REGARDING LOW SCALE
PRODUCTION (SMALL SERIES)
EUROPEAN BENCHMARKING OF LFS PROCESS
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Overview

• Background Motivation
• Objectives
• Project Overview
• Main Results
• Future Work

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STRATEGIC OBJECTIVES
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Overview

• Background Motivation
• Objectives
• Project Overview
• Main Results
• Future Work

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CONSORTIUM
Outside SMEs
Industrial Associations
SMEs
RTDS
ISQ (P) TWI (UK) INASMET (E) BME (HU)
30 PARTNERS REPRESENTING AT LEAST 10 EUROPEAN
COUNTRIES
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Workprogramme Structure
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MAIN PROJECT DELIVERABLES

• SME Lead-Free Soldering Technology
  Implementation Recommendation Guide
• Photolibrary Inspection Guide
• Environmental Impact Guide
• Training Lead-Free Course
• Lead-Free Process Benchmarking Programme

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Overview

• Background Motivation
• Objectives
• Project Overview
• Main Results
• Future Work

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Project Results up To date
1) COMMUNICATION - AWARENESS AND
DISSEMINATION 2) SOLDERING RELIABILITY
ASSESSMENT 3) ENVIRONMENTAL EVALUATION 4)
TRAINING 5) PROJECT BENCHMARKING
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Project Results up To date
1) COMMUNICATION - AWARENESS AND
DISSEMINATION 2) SOLDERING RELIABILITY
ASSESSMENT 3) ENVIRONMENTAL EVALUATION 4)
TRAINING 5) PROJECT BENCHMARKING
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COMMUNICATION
Objectives
Information exchange, Awareness Dissemination
Activities Carried Out

• WEB SITE DEVELOPMENT
• PROJECT NEWSLETTERS PERIODIC PUBLICATIONS
• INFORMATION SEMINARS

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INFORMATION EXCHANGE
PROJECT Web Site
WWW.LEADOUTPROJECT.COM
Site Languages English, Spanish, German,
Hungarian, Portuguese, Italian
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INFORMATION EXCHANGE
LFS IMPLEMENTATION SURVEY LOUT/TWI/DEL-14
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PROJECT NEWSLETTERS
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PROJECT PUBLICATIONS

• LEADOUT on the Road

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PROJECT SEMINARS
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Project Results up To date
1) COMMUNICATION - AWARENESS AND
DISSEMINATION 2) SOLDERING RELIABILITY
ASSESSMENT 3) ENVIRNONMENTAL EVALUATION 4)
TRAINING 5) PROJECT BENCHMARKING
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SOLDERING RELIABILITY ASSESSMENT
Objectives
Research on Lead-Free Technology Solutions
Industrial Implementation Guide
Activities Carried Out and/or On-Going

• LEAD LEAD-FREE SOLDERING TRIALS INDUSTRIAL
• 
  LEADOUT TEST BOARD
• BOARDS CHARACTERISATION RELIABILITY TESTING
• PHOTOLIBRARY DEVELOPMENT
• VIRTUAL DESIGN SIMULATIONS Design for
  Reliability

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Soldering and Reliability Overview
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SOLDERING TRIALS
INDUSTRIAL PRODUCTS
LEADOUT TEST BOARD
A range of pcb and component technologies Solders
include Tin Lead (for baseline) Tin-Silver-Copper
for reflow and hand soldering Tin-Copper-Nickel
for wave soldering SAC-X (Wave Soldering)
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Soldering Combinations
INDUSTRIAL SOLDERING
SINGLE SIDE SMT REFLOW
HAND SOLDERING
WAVE SOLDERING SINGLE SIDE BOARDS
MIXED TECHNOLOGY BOARDS
SMT reflow plated through-hole wave hand
soldering
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SOLDERING TRIALS
Materials Variables
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SOLDERING TRIALS Key Results

• Trials covered a range of processing, material
  and component types
• Benefits to photolibrary and reliability testing
• Component plating information limited
• Lead-free soldering difficulties?
• Reflow no major problems reported
• Wave bridging on leaded header component
• Wave - inconsistent hole fill and topside fillet
• Hand inconsistent hole fill and topside fillet

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RoHS Compliance and Lead-Free Compatibility

• Example
• WIMA - RoHS compliant, SMD PET Film Capacitors
• Recommended for wave and reflow soldering with
  SnAgCu
• T(max) on reflow of 220C for 1812 package
• T(max) of 230C for 2220, 2824 packages
• T(max) on hand soldering of 225C for 2 seconds
  for 1812 2220 packages
• No recommendations for wave soldering

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LEADOUT BOARD CHARACTERISATION
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Lead-Free Joint Sections from the LEADOUT Test
Board
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Lead-Free Joint Sections from the LEADOUT Test
Board EDX Evaluation
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Photolibrary

• Images to be located on www.leadoutproject.com
• Searchable inspection guide showing acceptable
  lead-free solder joints with material, geometry
  and process information
• Comparative tin/lead images are also available
  with similar magnification, angle, lighting etc.
• Currently approx. 220 images
• Soldering defects
• Miscellaneous
• Currently approx. 220 images

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Photolibrary

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SnPb-R-chip R-enig-u
SAC-R-chip R-enig-tin
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Soldering Defects
SnPbAg-R-SOT23 poor lead wetting
SnPbAg-H-leaded diode poor lead wetting and
solder debris
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Soldering Defects
SAC-R-Chip C midchip balling
SAC-H-leaded solderballs
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• Photolibrary in development

DEMO
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REABILITY TESTING
Leadout Test Board
Tests performed 1. TH Temperature Humidity
85C 85 1week Inspection no effect 2. TH
Temperature Humidity 85C 85 4week
Inspection no effect 3.a. TH Temperature
Humidity 85C 85 1week 3.b. THB Temperature
Humidity 40C 95 1week 3.c. HAST 130C 100
3bar 3.d. Thermal shock 85C/-40C, 10/10min,
300 cycles 3.e. Reference Inspection TH,
THB, TS no effect HAST all boards damaged
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Industrial Reliability Testing Approach
REABILITY TESTING

• Reliability Testing split into 2 groups
• Joint fail approach 3 products
• Application related testing 5 products
• Application related testing
• 5 products have similar requirements!
• EN 60068 IPC-9701
• Rely on function test and visual inspection for
  analysis

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Testing Plan
REABILITY TESTING

• Visual inspection - IPC-A-610D
• All assemblies
• Reserve
• 1 assembly of each alloy
• Low temperature storage - EN 60068-2-48
• -40C / 72 hours
• High temperature storage - EN 60068-2-48
• 100C / 168 hours 100C / 672 hours

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Testing Plan
REABILITY TESTING

• Thermal cycling mechanical shock - IPC-9701
  EN 60068-2-32
• 0-100C, 20 min. ramp, 15 min. dwell
• 3000 6000 cycles
• Followed by 1m vertical drop, 2 falls
• Thermal shock - EN 60068-2-14
• -40C to 100C, 3 hour dwell, 25s change
• 5 cycles
• Component shear testing - EN 60068-2-21
• 10N for 10s, destructive at 0.2mm/s

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REABILITY TESTING
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Solder Alloy Testing SN100C Solder Alloy
Mechanical Testing

• Work conducted by IMMG
• Method - Isothermal shear fatigue testing at 20C
  and 75C
• Patented equipment high accuracy measurement
• 8 alloy samples at each temperature (not joints)
• Shear deformation /-0.1 at 1Hz
• Observations
• Microstructure evolved through deformation and
  coarsening
• Fatigue cracks and voids form along tin/tin grain
  boundaries, reducing alloy strength

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Equipment and Samples
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Microstructure Degradation
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Virtual Qualification
DESIGN STUDIES Reliability Behaviour

• Objective
• To conduct a reliability assessment on a PCB
  offered by the consortium
• To compare the expected time to failure for both
  tin/lead and tin/silver/copper assembled PCBs
• Approach
• Gather PCB build data from the designer
• Use CALCE virtual qualification software

(Centre for Advanced Life Cycle Engineering)
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Design Capture

• Processor Test board
• BOM and layout
• gt300 components, gt40different part types
• SMT and through-hole
• 8 layer FR4 PCB
• Part Datasheets
• material and geometry information
• dimensions, weight, IO, standoff, bond area,
  package material, etc
• Solder alloy data, 63Sn37Pb SAC387
• Elastic modulus, density, Poissons ratio, CTE, etc

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Board Layout
Topside
PCB designed to test the functionality of a
processor (test component - 208 lead QFP
Bottomside
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Thermal Model70C Ambient, Power Cycling
Component Case Temperatures
C7, C13
Note chilling effect of the connectors, due to
the thermal conductivity of the wires attached
C11,C15, F1, F2
75C
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Shock Test Model
Case displacement
0.12mm
PCB displacement map

• The stiffening effect of the edge connectors
  dominates
• Therefore, the bottom edge sees the highest
  displacement

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Solder Comparison Results Summary
SAC387
63Sn37Pb
Test
122400 cycles (gt 30 years)
8582 cycles (23 years)
Thermal Cycling Standby Use
(20º-70ºC)
10188 cycles (424 days)
3899 cycles (162 days)
Thermal Cycling Accelerated Ageing
(0º-100ºC)
gt30years
gt30years
Power Cycling ()
No failure
Mechanical Shock ()
No failure
() 70ºC Standby 70ºC Full power
() 10G 0.10ms
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Conclusion

• For the cycling regimes considered
• SAC387 outlasts 63Sn37Pb in all tests (due to
  lower fatigue damage exponent)
• A power off to standby thermal cycle each day is
  more likely to cause failure than the active use
  power cycling regime
• For the shock test considered
• Software predicts that an accidental drop will
  not result in a component interconnection failure
• No performance difference was recorded for the
  two solder types analysed
• Test board used in a benign environment
• Failures are not expected!

• Life predictions can be shortened if
  manufacturing defects are introduced

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Project Results up To date
1) COMMUNICATION - AWARENESS AND
DISSEMINATION 2) SOLDERING RELIABILITY
ASSESSMENT 3) ENVIRONMENTAL EVALUATION 4)
TRAINING 5) PROJECT BENCHMARKING
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Objectives
Environmental Assessment of Lead-Free Process and
Solders
Activities Carried Out and/or On-Going

• LABORATORY ENVIRONMENTAL IMPACT STUDIES
• INDUSTRIAL PLANNING AND METHODOLOGY
• LCA OF WAVE REFLOW SOLDERING PROCESS
• ENVIRONMENTAL INDUSTRIAL MEASUREMENTS
• (Occupational Health,Fumes assessment and
  Leaching tests)

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Environmental Assessment
Hand solder rework
Health safety
Life cycle analysis
Wave reflow
Environmental impact
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ENVIRONMENTAL PLANNING

• Methodologies for
• Lab analysis of main pollutants from solders
• Identification of the main sources of pollution
  in terms of occupational exposure and external
  environment
• To collect and analysis fumes in SMEs
• Leaching tests of Dross and PCB solder

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Lab Analysis

• Fume has been generated from 4 LFS and 3 SnPb
  solders at
• 315C, 370C, 410C
• Time to block a Millipore Swinnex Filter (mixed
  cellulose ester) with 5µm pore size was measured

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Approach

• What is solder fume?
• Organic compounds, volatiles, resin acids etc
• Is it harmful?
• Some are highly damaging to the respiratory
  system
• Is there a change with LFS?
• No, fume composition does not change

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Materials tested

• Cookson Fluitin 1532/LF Flux content (3.3)
• Multicore 96SC Crystal 400/LF (1.5)
• Warton Future 96S/LF (2)
• Kester 275/LF (2.2)
• Cookson Fluitin 1532/TL (1.1)
• Multicore X39/TL (1)
• DKL EQ-STD/TL (2)

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Conclusions

• Increased solder temperature increases the volume
  of fume produced for a given solder wire
  Better Extraction System
• Significant variation exists between solder wire
  types and nominal flux content on time to block a
  filter
• A ten-fold difference between the maximum and
  minimum blocking conditions was identified

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Life-Cycle Assessment
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Established Conditions Boundaries for solders
Dash lines () excluded of system
boundaries.
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Solders Selected for Evaluation
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Application of Solder LC Stage
Data Collection

• Data collected from Spanish and Portuguese
  assemblers
• Wave and reflow process (3 SMEs/process)
• 1 alloy for Lead and 1 alloy for Lead-Free
  Solders.
• LC Data Collected by INASMET ISQ
• Existing data is being assessed for quality and
  accuracy

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End-of-Life LC Stage

• Potential environmental impacts of electronics at
  end-of-life depend on disposal and location
• Landfill? Leaching tests data
• Incineration
• Recycle or reclaim
• Impacts for each method will be determined,
  weighted for actual disposal based on assumptions
  of MSW distribution for incineration and
  landfilling.
• Sensitivity analysis will be used to show
  spectrum of possible impacts

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Conclusions of Leaching tests Wave reflow
processes

• The high values of TOC and low values of DOC ?
  PCBs disposal at landfill, is not advisable due
  to their plastic matrix ? they can be valorizable
  waste. Not for soldered.
• For SnPb scenario
• No metals and sulphate are found in eluates,
  apart from Lead
• Two situations should be considered due to Lead
  content
• PCB soldered as non-hazardous waste
• PCB soldered considered as Hazardous Waste
  acceptable only at landfills for Hazardous waste.
• For Lead-Free scenario
• Pb content in the eluate of soldered PCB by IDK
  is due to Hand-soldering process using SnPb. Pb
  content ? as Hazardous Waste acceptable only at
  landfills for Hazardous waste.
• Cu content ? as Hazardous Waste, but acceptable
  at non-Hazardous landfill
• From leaching results point of view, it can be
  said that Lead-Free processes are cleaner than
  the traditional SnPb soldering processes.

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Industrial measurements Fume
emissions Occupational Exposure Leaching
tests
Environmental Assessment of Processes - Analysis
of the environmental parameters and occupational
exposure in lead and lead free soldering
Quantitative Analysis

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Lead Lead-Free Processes
Environmental Measurements
Low limit 2 Kg/h High limit 30 Kg/h
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Occupational Health
Lead Scenario
Lead Free Scenario
The TWA values obtained for Tin Oxide, Copper
Fumes and Silver Metal are below the action
level, which doesnt indicate risk to the
workers health.
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Project Results up To date
1) COMMUNICATION - AWARENESS AND
DISSEMINATION 2) SOLDERING RELIABILITY
ASSESSMENT 3) ENVIRONMENTAL EVALUATION 4)
TRAINING 5) PROJECT BENCHMARKING
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TRAINING
Objectives
Training material and courses for Industrial use
Activities Carried Out and/or On-Going

• Five LFS modules
• Conventional training material
• E-learning course in development and
  implementation

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TRAINING
Training on Lead-free Soldering to help the
transition to lead-free soldering at SMEs
Conventional Training 5 Powerpoint Presentations
E-training course 5 modules
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TRAINING
LEAD-FREE ASSEMBLY Module 1. Solder Paste
Printing and Stencil Handling Module 2. Reflow
and Wave Soldering Temperature Profiling Module
3. Lead-Free Plating Finishes for Boards and
Components Module 4. Hand Soldering and Rework
Module 5. Solder Joint Visual Inspection
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TRAINING
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TRAINING
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Conventional Training
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E-training Training
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Project Results up To date
1) COMMUNICATION - AWARENESS AND
DISSEMINATION 2) SOLDERING RELIABILITY
ASSESSMENT 3) ENVIRONMENTAL EVALUATION 4)
TRAINING 5) PROJECT BENCHMARKING
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PROJECT BENCHMARKING
Objectives
Monitor and evaluation of the project performance
in terms of Technology and Benchmarking (PPM
Programme)
Activities Carried Out and/or On-Going

• PPM GATHERING DATA AND ANALYSIS
• WEB SITE UPDATE AND MONITORING

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Benchmarking Programme

• What is the average defect level in the industry,
• Does anyone know?
• PPM - Part Per Million Opportunities
• Total Defects x 1,000,000 PPM
• Baseline
• 5 X 1,000,000 500 PPM
• 10,000

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Inspection Criteria
IPC-A-610-D

• Printing Number of apertures
• Placement Number of components
• Reflow Number of joints
• Wave Number of joints

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BENCHMARKING
PPM PROGRAMME
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58 oportunities
26-37
20-25
58
18-19
3
1
4
15
5
6
14
7
8
2
9
10
11
13
38-56
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12
16-17
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Faults founded
lifted component
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PCB
Faults founded
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PPM RESULTS
Monthly published at the Web site
Open Participation
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Overview

• Background Motivation
• Objectives
• Project Overview
• Main Results
• Future Work

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FUTURE WORK

• SME LEAD FREE SOLDERING TECHNOLOGY
  IMPLEMENTATION GUIDELINE
• INDUSTRIAL PHOTOLIBRARY
• ENVIRONMENTAL IMPACT RECOMMENDATION GUIDELINE
• COMPLETE IMPLEMENTATION OF LFS ON-LINE COURSES

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LEADOUT will provide
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ACKNOWLEDGMENTS ISQ IS GRATEFUL TO ALL THE
ONES THAT HAD CONTRIBUTED TO THE WORK HEREWITH
PRESENTED, NAMELY Simon Mason, TWI UK Alan
Taylor, TWI-UK Amaya Arteche -
INASMET-Spain Patricio Aguirre,
INASMET-Spain Jose Barredas, INASMET-Spain Zsolt
IIlyefalvi, BME-Hungary Clara Santos,
ISQ-Portugal Marta Freitas, ISQ-Portugal Rolim
Carmo, ISQ-Portugal João Costa, ISQ-Portugal
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Thank You
On behalf of the LEADOUT Consortium
General Assembly CCIAA, Milan, 29 September 2006
www.leadoutproject.com