NIST AEPT Public Presentation 13003

1
NIST AEPT Public Presentation 1/30/03

• Joel Peiffer
• 3M St. Paul, MN
• [phone]
• jspeiffer_at_mmm.com

2
Outline

• Overview and Material Properties
• PCB Fabrication/UL Test Results
• Environmental Test Results
• Electrical Performance Testing
• Summary
• Post-Consortium Activities

3
History of Embedded Capacitors at 3M

• 1996 - 1999 DARPA Program
• 1998 - 2000 NCMS Embedded Decoupling
  Capacitance (EDC)
• 1999 - 2003 NIST ATP Embedded Passives

4
Thin-Film Capacitor Technology
Electrode (Cu)
Dielectric (k)
Thickness (t)
Electrode (Cu)

• Capacitance per unit area (C/A) is proportional
  to k and inversely proportional to t
• Vary C/A by varying thickness (t) or dielectric
  constant (k)
• Thinness (low inductance) is much more beneficial
  than high Dk at high frequencies

5
BaTiO3/Epoxy Coating
Preferred construction
Coating methods gravure or die
6
Lamination Process
Cu
Complete Cure, 180C
Cu
Copper
Cu
BaTiO3/epoxy
Cu
Copper
7
Thin Dielectric Material Properties (3M C-Ply)
8
PCB Fabrication

• 3M C-Ply is compatible with all standard PCB
  fabrication including laser ablation
• Material handling is the most significant issue
• If a sequential build up process is utilized,
  there are no design limitations
• Numerous high end fabricators with thin core
  processing equipment have successfully fabricated
  numerous prototype lots

9
UL Testing
10
Environmental Testing Summary
11
Environmental Testing Summary cont
12
TMA Profile for 3M C-Ply
13
TMA 260C Test Results

• Numerous tests run on C-Ply/FR-4 (high and low
  Tg) test vehicles from various fabricators using
  several designs
• In every case, failure occurred within FR-4 at
  resin/glass fiber interface In only one case was
  there also failure within or adjacent to the
  C-Ply material

14
PCB/UL/Environmental Summary

• C-Ply is compatible with PCB processing
• C-Ply has passed UL laminate and board level
  testing
• Extensive reliability testing shows excellent
  results

15
Impedance Comparison (Sun)
16
Impedance on Small BoardTransfer-impedance (2)
17
Power Bus Noise (UMR)

• (Time Domain - 50 MHz)

Volts
Data from NCMS Embedded Decoupling Capacitance
Project Report - 12/00
18
Power Bus Noise on Test Vehicle (UMR)

• Traditional decoupling capacitors are not
  effective at frequencies gt1 GHz
• C-Ply layer has excellent performance to 5 GHz

Data from NCMS Embedded Decoupling Capacitance
Project Report - 12/00
19
Radiated Emissions Comparison (Sun)
20
Electrical Performance Summary

• Surface mounted discrete capacitors are
  ineffective above 1 GHz
• Low impedance and high capacitance are ideal for
  power supply decoupling at high frequencies
• Impedance is more critical than capacitance at
  high frequencies
• Thin dielectric materials dampen noise at high
  frequencies
• Lower power bus noise can result in reduced
  radiated emissions

21
Commercialization

• 3M Microinterconnect Systems Division (MSD)
• Leading supplier of high volume roll-to-roll
  flexible circuitry
• Leader in high performance IC package substrates
• Facilities in Austin, TX, Columbia, MO, Eau
  Claire, WI and Singapore
• C-Ply will be marketed in two formats
• Panels for rigid PWBs
• As an enhancement available only in MSD high
  performance multilayer IC packages

22
MSD Sales/Marketing Plans - 1

• C-Ply panels will be sold direct to fabricators
  and distributors
• C-Ply enhanced packages will be sold direct to IC
  manufacturers and package assemblers
• There are no plans for licensing fees
• C-Ply can be used for distributed capacitance or
  discrete (individual) embedded capacitance

23
MSD Sales/Marketing Plans - 2

• Pilot and production costs have been estimated
• Increased customer sampling volumes in 2003
• Initial sales in late 2003 with expected rapid
  growth in following years

24
MSD Sales/Marketing Plans - 3

• 3M is seeking OEM and fabricator lead users to
  partner with to bring 3M C-Ply into the
  marketplace