Liverpool LHCb Annual Review

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Liverpool LHCb Annual Review

• T. Bowcock

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Agenda of Review

• Themis Bowcock Introduction
• Phil Turner PR-04
• Gianluigi Casse Tests to be done.
• Steve Biagi Simulation
• Girish Patel Database
• Juan Palacios Results from CERN testbeam
• Mark Tobin Numbering
• David Hutchroft Tracking
• Tara Shears Trigger
• Karol UDP/Switch tests
• Jonathan Higgs Search
• Themis Bowcock
• Timescales and Milestone
• Issues

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LHCb
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LHCb Vertex Locator
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LHCb
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2003

• This time last year

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2003 What we said wed do!

• Delivery of final sensors, hybrids
• Production of first modules
• Tracking
• Testbeam analysis
• Analysis of HLT design

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2004 what happened
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Time
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Time Dependent
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Radiation Damage
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Pulse Shapes (DESSIS)
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The real world test beam

• Various issues for VELO group Front end chip
  choice
• Sensor performance
• Meaning sensorchiphybrid combinations
• Alignment in rf geometry

Test module
Main telescope
Telescope far station
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PR-04 Contd
Fiducials
Go-No Go Gauge
PR-04 Sensor
Norel Testing Jig Liverpool Micron.
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Replaced unit
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Pre-cutting data R-sensor almost flawless
?
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Cutting
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Pitch Adaptor Testing
Computer Driven Arms
Pitch Adaptor
Custom Probe Tip
Location Pin
Pitch Adaptor Testing Jig
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Hybrids

• 2 K-04 received week 38
• Commercial lamination of substrate
• Commercial bonding of K-04 to substrate
• Laser Cut Dimensions

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Pitch Adaptors
K-04
Alignment Holes
Pitch Adaptor
Substrate
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K-04
Sacrificial Corner
3mm CFFrame Anti-Deamination
TPG/CF laminate
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Cooling

• Can we keep the Silicon cold?
• Target temperature -7C
• Thermal conductivity of hybrid
• TPG (Due for delivery 1 Oct but delayed)
• Thermal joint

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0.5 W Load on Si (4 times normal)
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Cooling Joint
1.1mm OD SS pipe (NIKHEF now _at_1.5mm)
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Dow Corning DC130
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PR-04 Module
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Test Beam November 2004
A GREAT SUCCESS!
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Test Beam Nov. 2004 with the whole mess!

• Kapton interconnects
• Repeater electronics
• 60 m CAT6 cables

A GREAT SUCCESS!
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Beetle Supply Voltage
CAN NOW MAKE PLOTS LIKE THESE ALMOST
ON-LINE VITAL REAL-TIME FEEDBACK DURING DATA
TAKING!
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Database
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Data Challenges
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Detector description Geant3

• Latest design information used to update/complete
  realistic Geant3 description
• R, f sensors
• Hybrids
• Wakefield cone

f sensor with dog-leg
R sensor with guard ring
Complex accordion structure

• Glass fanouts
• Si chips
• Copper layers
• Kapton layer
• Carbon substrate

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Detector description XML

• LHCb XML detector description framework allows
  geometry and material description de-coupled from
  SW implementation/technology
• LHCb Gauss Geant4 simulation (basically geom.
  dE/dX)
• LHCb Boole digitisation
• Brunel reconstruction (material for Kalman fit,
  position of clusters)
• Panoramix event display
• More freedom in LHCb XML framework so description
  more accurate. Also a much larger pain to
  implement.
• This has been implemented and tested in Gauss,
  Boole, Panoramix

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Detector description XML

• Vacuum tank
• 21 rf measuring stations
• RF/secondary vacuum box foil
• Wakefield guiding cone

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LHCb Tracking

• Work on Core code
• Tracking algorithms
• New detectors descriptions
• Huge amount of work

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Current requirements

• The VELO appears in several pieces of code
• Work on Core code
• Tracking algorithms
• New detectors descriptions
• Huge amount of work

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Trigger
UCD Associates with Liverpool on LHCb Funded by
Royal Society

• Used MAP2 to test LHCb trigger
• Phenomenology on Higgs

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LHCb Trigger

• Readout Network must connect 100-300 frontends
  to 100 PCs

General Design of the LHCb Trigger and DAQ System
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LHCb and Higgs

• H ? ZZ? 4L is known as the gold plated Higgs
  decay channel.
• It divides into two regions,
• 130Gev lt MH lt 2MZ
• Contains one real Z and one off mass shell Z
• Branching ratio is smaller
• Background elimination more difficult
• MH gt 2MZ
• Contains Two real Zs
• Higher branching ratio
• easier to eliminate background
• H ? ZZ? 4µ was investigated

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2004

• First real sensors
• Close to final hybrid
• Cooling feasibility
• Testing
• Thanks to everyone for their dedication and hard
  work!
• Many thanks to workshop
• Staff involved in bonding!
• ATLAS

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2005 Milestones

• Jan 31
• All Lab tests done(!)
• Thickness decision (200 or 300 micron sensors)
• Double sided bonding
• Production of Paddles/Substrates/Bases/Cooling
• Feb
• Tests of irradiated sensors?
• K-05 and tests
• Assembly tests
• March
• Mechanical Modules
• PRR
• April
• EDR
• May
• Production Kaptons and Sensors