Subproject: TOOLS

1
Subproject TOOLS The subproject TOOLS includes
the development of a Step and Stamp
Nanopatterning Tool for Hot Embossing and
UV-Nanoimprint Lithography with an overlay
accuracy of 250nm (WP15), a Stencil Mask
Alignment and Fixation Tool for alignment
accuracy of 1µm at the first and 250nm at the
final stage (WP16) and an alignment system with
an overlay accuracy of less than 20nm at wafer
scale (WP17)
Stencil Mask Alignment and Fixation Tool (SUSS
MicroTec)
NPS300 Nano Patterning Stepper (SUSS MicroTec)
The alignment can be done for the backside or
from the topside with an alignment accuracy down
to 250nm The adapter frame for the stencil
tooling is prepared for 8-inch fixtures. To
achieve a high alignment accuracy the movement
after the alignment is minimimzed the alignment
gap was reduced down to 20µm. Self leveling is
performed by flexure stage
Aligned Hot Cold Embossing Step Repeat
mode Imprinting of sub-20 nm resolution KEY
DESIGN FEATURES Sub-20 nm embossing
capability Overlay Accuracy 250 nm Stamp size
50/65mm (100m) Wafer Size up to
300mm Pre-leveling accuracy 20 µradian Self
leveling by flexure stage
The mode of operation is illustrated below for
both UVNIL and Hot embossing sequence. The
alignment can be performed before each imprinting
step to provide the highest alignment accuracy
Overlay Accuracy in NIL (Obducat)
The method relies on evanescent wave coupling. It
enables subwavelenght precision - purely limited
by nanoscaled alignment pattern
No need for a transparent substrate or stamp
No need for a special stamp or substrate
Accuracy based on nanoscale alignment marks
Smart pattern allow lt 10 nm overlay resolution
Active alignment possible during imprint Two
stage alignment lt1µm ex-situ, lt10nm in-situ
Hot Embossing Sequence
UV - NIL Sequence
For more information, please contact Dr.
Hans-Georg Kapitza or Gilbert Lecarpentier, from
SUSS MicroTec (www.suss.com)