SENS-IT Small Electronic Network Sensor Integrity Tool

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SENS-ITSmall Electronic Network Sensor Integrity
Tool

• Development of a Low-Cost Permanently Installed
  Microelectronic Wireless Monitoring System for
  Process Plant
• 23 February 2005

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Summary Project Details

• Scope
• Development of a Low-Cost Permanently Installed
  Microelectronic Wireless Monitoring System for
  Process Plant
• Benefit
• Improved monitoring techniques leading to lower
  operational costs, improved QHSE, more reliable
  information for increased integrity management,
  and zero loss of containment.
• Duration 34 months
• Total Cost 3.14m
• EC Funding 1.7m
• Balance of Funding Project Partners

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Project Partners
Project Co-ordination Project Co-ordination Project Co-ordination Project Co-ordination Project Co-ordination Project Co-ordination iicorr Ltd
System Sensor Electronic Interface Wireless Software Demo
? ? ? ? ? ? iicorr - UK
? ? ? ? InDec - Norway
? ? ? ? ? ? UNN - UK
? ? ? ? ? Vibtech - UK
? ? Tentaclion - Germany
? ? ? ? ? ? HOIS2000 (End-User)
? WP Leader ? WP Supporter ? Project End User/Supporter ? WP Leader ? WP Supporter ? Project End User/Supporter ? WP Leader ? WP Supporter ? Project End User/Supporter ? WP Leader ? WP Supporter ? Project End User/Supporter ? WP Leader ? WP Supporter ? Project End User/Supporter ? WP Leader ? WP Supporter ? Project End User/Supporter ? WP Leader ? WP Supporter ? Project End User/Supporter
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Progress to date

• Oct 02 - Project Start
• Mar 03 - Development of Functional Specification
• Oct 03 - Detailed Operational and Interface
  Specification
• Dec 03 - Paper design
• Mar 04 - Project interim stage reached
• Partners agree to continue project to conclusion
• Apr 04 - Technology Demonstrator system designed
  and built
• Apr 04 - Technology successfully demonstrated
• Feb 05 - Prototype design on-going
• Issues of intrinsic safety being addressed

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Areas of work

• Sensor development
• Piezo-composite sensors
• Single and array
• Specification, design, characterisation, test and
  evaluation
• Sensor packaging
• Manufacture
• Microelectronic Interface design manufacture
• Design of drive electronics and pre-amp circuitry
• Interface packaging
• Miniaturisation

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Areas of work

• RF interface
• Network topology evaluation
• Network interface specifications
• Choice of communication technologies
• Integration of RF
• Data acquisition
• Software and dataset specification
• Power supply
• Choice of battery technology
• Software Firmware
• Software and dataset specification
• Software utility for presentation of results

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Achievements System

• Demonstrator unit built
• Integrated unit incorporating
• Sensor
• Integrated electronic interfaces
• Battery technology
• Interim software package
• (Main software now available)

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Achievements Sensor

• Twin crystal design to resolve 4mm wall thickness
• Successful integration of probes to driver
  electronics and production of a signal suitable
  for wall thickness calculations Demonstration of
  probe arrays
• Low power to comply with ATEX regulations
• System can resolve wall thickness changes in a
  pit defect to within 0.2mm

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Achievements Microelectronics

• Miniaturized microelectronic unit consists of
• high speed analogue circuit
• digital controller
• 8 channel multiplexer / de-multiplexer
• all have been fully assembled and tested

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Achievements Miniaturisation

• Credit card size micro-electronics interface
  achieved
• and working!
• Could be made smaller
• This considered another development
• Compromise on size and intrinsic safety issues

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Achievements Power

• Various battery solutions evaluated
• Special battery pack
• combination of primary / secondary cells
  implemented
• provides high pulse currents throughout the
  target lifetime of two years
• Probably 6 AA cells equivalent
• (Due to IS requirements
• Power profile reduced by 25 since mid-term
  position
• On-going activity

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Achievements Wireless

• Wireless LAN 802.11b compatible (WiFi compliant)
• Range 500m (approx) range line-of-sight
• Digital interface for connection to sensor unit
• Star-shaped wireless network topologies with the
  use of central access points
• FTP protocol allows communication with the sensor
  network via web gateway
• Dimensions 80x50x10mm (40cm3)
• Temperature range -20 to 85C
• Power consumption 600mA at 3.3V (2W)
• Solar cell (optional)

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Achievements Software

• An intuitive and simple user interface
• A robust and effective interface to the
  communication units
• Export/import solutions that will enable
  effective interface to end-users systems
• Efficient and robust interpretation of the
  ultrasonic signals

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Achievements Software
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Achievements Software
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Achievements Summary

• Integrated design of a demonstrator unit
• Signal output received
• It works!

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Lessons Learnt so far!

• Issues of sensor characteristics and interfacing
  electronics
• Issues of intrinsic safety
• Issues of integration of RF for high speed, low
  power data links
• Low noise, high speed circuit design
• System Integration
• Importance of working closely with partners

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Next Steps

• Refine design for system integration and
  manufacture
• Complete ATEX certification at component level
• On-going ATEX certification for integrated system
• Production and commissioning of prototype
• Evaluation testing on site

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Programme to Completion
Anticipated time for on-site testing
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Thank you for listening

• Any questions?