Title: A-SSCC 2006 Tokyo Press Conference
1A-SSCC 2006 Tokyo Press Conference - Asian
Solid-State Circuits Conference
- ???????????? http//www.a-sscc.org/
2006?9?5? ?? ???? 2006?9?6? ??
???? 2006?9?7? ?? ???? 2006?9?8? ?? ????
?????? 2006?9?6?_at_???? ????????????????????? http
//www.vdec.u-tokyo.ac.jp/A-SSCC2006/
2??????
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- A-SSCC??????
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- RF
- Wireless/Wireline
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- A-SSCC ?????????//A-SSCC????
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11?30?????
3A-SSCC??
- IEEE Solid-State Circuits Society
(SSCS)???4?????????Asian Solid-State Circuits
Conference (A-SSCC)???????????????????????11??????
????? - ) 2004????2??ISSCC (International Solid-State
Circuit Conference)?6??VLSI?????????9??CICC
(Custom Integrated Circuits Conference) ?3? - ????????
- ????????????
- ????????????????????????
- ??????????????(????????????)
4IEEE Region 10
IEEE?Region 10??????A-SSCC
A-SSCC??? 2005? ?? ????? Genda Hu
(TSMC) 2006? ?? ????? Ke Gong
(????) 2007? ?? ????? Chong-Min Kyung
(KAIST) 2008? ?? ????? ?? ?? (STARC)
http//www.ieee.org/organizations/rab/imagemaps/wo
rld_reg.html
5A-SSCC???????
IEEE SSCS AdCom Meetings Committee
Steering Committee Ck Wang, G. Hu, W. Sansen, A.
Chandrakasan, T. Sakurai, etc
Liaison W. Sansen, (Belgium) A. Chandrakasan,
(USA)
Technical Program Committee Sung Bae Park, (Korea)
Conference Chair Ke Gong, (China)
Organizing Committee Shaojun Wei, (China)
International
Professional Management Team ICS Convention
Design, Inc.
Local One-year term
6????????
Industry Program is unique to cover Industry
Trend. Application, demo, evaluation results are
more important than originality.
7A-SSCC 2006
- ?????????? Challenges for THE e-life
??????????11?1315???? ???????????????Hangzhou???
???? - ??????????????????????
- ????????????????????????
- ????????????????
- ????????4??????
- ?????????????????
- ISSCC?IEEE Journal of Solid-State Circuit??????
8????
?? ??? Hyatt Regency Hangzhou
28 Hu Bin Road, Hangzhou 310006, Zhejiang
ProvincePeople's Republic of China Tel 86
571 8779 1234http//hangzhou.regency.hyatt.com/
http//www.maps-of-china.com/china-country.shtml
9??(??)???
1011/16 ???
11/4?? ???????????????????????????????
11??????
????332?????107????32
12???????
????
13???????
14???????????
15???????
16???????
- Richard Ru-Gin Chang??, SMIC CEO, ??
Semiconductor Advanced Technology Development
and Challenges in China ?? 11?14? (?),
915-1000 - See-Young Oh??, ETRI ???, ??Component
Technologies needed by the Ubiquitous IT Society
?? 11?14? (?), 1000-1045 - ?? ? ??, ??, ?? Deep Sub-100 nm Design
Challenges ?? 11?15? (?), 900-945 - Ming-Kai Tsai?, MediaTek CEO, ?? From PC
Multimedia Chipsets to Wireless and Digital
Consumer SoC Evolution and Challenges ??
11?15? (?), 940-1030
17???????(1) Richard Chang??
Semiconductor Advanced Technology Development
and Challenges in China
18???????(2)Soo-Young Oh??
Component Technologies needed by the
Ubiquitous IT Society
Abstract Korea has developed the world best IT
infra structures and is leading the internet and
mobile phone industry. Last two years, it has set
up the IT development strategy, IT839 and leading
the world IT industry by the simultaneous
development of the IT services, IT infra
structures, and IT systems. As a result, Korea
has developed and commercialized Terrestrial DMB
technology for the mobile TV services. It has
also developed the Wibro technology which can
provide the 2 10 Mbps mobile internet service
at the speed of 60 120 Km/h and the cost of 20
30 per month. Both technologies have been
selected as IEEE standard and ETSI standard
respectively. This year, Korea is trying to
commercialize the developed technologies and
develop the components and softwares needed by
these IT services and systems in order to lead
the future ubiquitous IT society. This
presentation covers the Korea IT development
strategy, its results, and the components
technologies needed by the future ubiquitous IT
society.
19???????(3) ?? ???
Deep Sub-100 nm Design Challenges
Abstract Moore's law and the scaling theory
have been guiding principles for the
semiconductor industry to accomplish its progress
and growth. In deep sub-100 nm technologies, we
are able to enjoy only higher density from the
scaling, but neither higher performance nor lower
power any longer. In addition, a single LSI chip
can accommodate more number of gates than the
engineers can properly design and integrate.
This gap causes a serious design complexity vs.
productivity problem. The deep sub-100 nm design
challenges and several approaches to counteract
these problems will be described in this
presentation, such as various low power
technologies and high-level language and platform
based design flow.
20???????(4) Ming-Kai Tsai?
From PC Multimedia Chipsets to Wireless
andDigital Consumer SoC Evolution and
Challenges
Abstract This presentation starts with
evolution of the optical-storage chipsets for PC
multimedia towards full-blown, next-generation
SoC for wireless and digital consumer
applications. Design challenges are reviewed and
explored from submicron to nanometer eras in
multiple levels of technology developments such
as market-driven software/applications, advanced
system architecture and engineering to address
computation and connectivity requirements,
performance-demanding but power-efficient circuit
and functional blocks and the growing complexity
being faced by increasingly large-scale chip
integration. SoC companies will need to
effectively cope with all incurred engineering
issues to successfully achieve their competitive
and leading positions.
21????? (1)
Future Digital Link Abstract Data rate of
CMOS serial link was raised twofold every year
until 2000. Although a 10Gbps transceiver was
reported in 2000, a 40Gbps one has not been
developed yet. It becomes more and more difficult
to follow the pace from both technical and
business reasons. How high in data rate can
electrical interface reach? Is there a large
market that justifies ever increasing research
investment? What is the next generation
technology for high-speed memory links? When and
where will optical interface be used? Will
wireless link be used more widely for short-rage
communications? This panel will present audience
with a colorful picture of future digital link.
22????? (1)
- Organizer Tadahiro Kuroda, Keio Univ., Japan
- Moderator C.K. Ken Yang, UCLA, USA
- Panelists Muneo Fukaishi, NEC, JapanJri Lee,
National Taiwan University, TaiwanSung Min Park,
Ewha Womans University, KoreaHirotaka Tamura,
Fujitsu Lab., Japan
23????? (2)
Software Defined Radio How to realize soft and
flexible RF and baseband circuits? Abstract
Software Defined Radio (SDR) system is the strong
technology trend to realize the future
multi-band, multi-standard wireless systems with
unified mixed signal processing circuits. It
requires high degree of flexibility and
reconfigurability in RF and base band circuits.
An idea of Digital RF that uses the digital or
digitizing technology as much as possible for
reducing the use of conventional analog circuits
has been proposed to address this issue. We still
have many questions, however, such as
performance, power consumption, usefulness, cost,
and adaptability for low voltage scaled CMOS.
This panel will discuss how to realize soft and
flexible RF and baseband circuits for the SDR
systems.
24????? (2)
- Organizer Tadahiro Kuroda, Keio Univ., Japan
- Moderator Akira matsuzawa, Tokyo Institute of
Technology, Japan - Panelists
- Mototsugu Hamada, Toshiba, JapanHoward C.
Luong, Hong Kong University, HKKathleen Philips,
Philips, NetherlandsHyun-Kyu Yu, ETRI, Korea
2511/13 ???????
- 100nm???SoC??????????????????4???????????????
- ????????SRAM??Hiroyuki Yamauchi, Fukuoka
Institute of Technology - ??PLL??Haward C. Luong, Hong Kong University
- ?????????ADC??Yun Chiu, University of Illinois
- ?????????ADC??Kathleen Philips, Philips
Research Laboratories
26????????????????
27????????
- ????????????????(?????????????????)
- ???????????????(15)??????????????(25)?????
????(10)?????????????????????????????(30)
???????(15) ??(5)
28????????
11?13? Session I Session II
1100 1125 65nm, 95W Xeon Processor Intel (USA) ADC for Video Signal Digitizer THine (Japan)
1125 1150 PAC DSP for Multimedia ITRI (Taiwan) Programmable Logic Nonvolatile Device e-Memory (Taiwan)
1150 1215 Low Power SRAM Compiler IPLC (Taiwan) 1.5V, 3.2Gb/s GDDR4 SDRAM Hynix (Korea)
1215 1240 Niagara Processor and Applications Sun Micro (USA) 10mA 2.8V FM Radio Receiver MediaTek (Taiwan)
29???????????
- ?????????
- ????
- RF
- Wireless/Wireline
- ?????
- ???
- ?????
- ???
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30Analog and Data Conversion
- SoC???????????????????????????????????????
- ????????3????
- A 1.5MS/s 6-bit ADC with 0.5V supply (UCB)
- 0.5 V ???????????6???1.5M????/??AD???14mw????????
???? - A 19.7MHz 5th Order Active-RC Chebyshev LPF for
IEEE802.11n with Automatic Quality Factor Tuning
Scheme (??) - ??????????????????????WLAN IEEE802.11n????RC????
- A Full-Digital Multi-Channel CMOS Capacitive
Sensor - ??-??????????????????????
31A 1.5MS/s 6-bit ADC with 0.5V supply0.5V???????1.
5M????/? 6???AD???
?????? ????(1)
- ????1-1 ??????????????????
- ?????????????????????????????(14mW),
??????(0.5V)?AD??? - ???????????????????????????????1??????????????????
? - ?????????????????????????????2?????3??????????????
?????????? - 90nm ???????????????????600??????
- 0.5V???1.5MS/s ????14mW, 1MS/s ????12mW??
- ?????0.3V?????175kS/s ???
32A 19.7 MHz 5th Order Active-RC Cheyshev LPF for
IEEE802.11n with Automatic Quality Factor Tuning
SchemeQ??????????????IEEE802.11n??19.7MHz
5??????????RC????
?????? ????(2)
- ????8-1 ?????
- ?????????????????????(Q)??????????????????????????
???????????????? - ??????????????????????????????????????????????
- ??????????????????????????????????
- OFDM????????????????Gm-C???????RC??????
- 0.13mm???????????????0.20????(??????)
- ????1.5V???????7.5mA
33A Full-Digital Multi-Channel CMOS Capacitive
Sensor???????????????????????
?????? ????(3)
- ????8-5 ATLab Inc (??)??(Hanyang)? (??)???
- ?????????????????TDC(Time to Digital
Converter)????????? - ???ADC????????????
- ??????????????????? ? ???????
- ADPLL???????TDC???????????????
- ??????????????????
- 12??????????????100????????(???30fF)
- ???? 5uA/ch _at_3.3V
- 0.35mm?????????????? 2.75mm x 2.15mm
- ?? ????????????
34???????????
- ?????????
- ????
- RF
- Wireless/Wireline
- ?????
- ???
- ?????
- ???
- ?? ??(????)
- ?? ??(??)
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35RF?????
- Session 6Millimeter Wave
- Session 9RF Amplifiers
- Session 13RF Building Blocks
36RF??????????
- 94GHz SiGe down conversion mixer
- 6GHz CMOS divide-by-three divider with 43uW power
consumption - A new biasing scheme that improves the linearity
of power amplifiers with 25 dBm OP1dB and 40
PAE - Multiple-gated transistor and resistive source
degeneration technique to achieve maximum OIP3 of
28 dBm for driver amplifier - 0.98 to 6.6GHz Tunable Wideband VCO in a 180nm
CMOS Technology for Reconfigurable Radio
Transceiver - Advanced Fs/2 Discrete-Time GSM Receiver in 90nm
CMOS
37RF?? ????(1)
A 94GHz SiGe down conversion mixer
- ????6-3 ??IBM??MIT?????
- Si?????94GHz?????????
- ????????????ECL?????
38RF?? ????(2)
A 6GHz CMOS divide-by-three divider with 43uW
power consumption
- ????6-1 ???????
- 3???????????????3???????
- 43uW??????????
- Wireless LAN?Cordless Phone?ETC????????????
39RF?? ????(3)
A new biasing scheme that improves the linearity
of power amplifiers with 25 dBm OP1dB and 40 PAE
- ????9-1 ?????????????
- CMOS-PA??25dBm???P1dB?40???(PAE)???
- ???????????????
- Wireless LAN???????????????
40RF?? ????(4)
Multiple-gated transistor and resistive source
degeneration technique to achieve maximum OIP3 of
28 dBm for driver amplifier
- ????9-2 ????(??)??????????????
- CMOS-DA??28dBm???IP3???
- MGTR????
- WiMAX?WiBRO?LSI?????
41RF?? ????(5)
0.98 to 6.6GHz Tunable Wideband VCO in a 180nm
CMOS Technology for Reconfigurable Radio
Transceiver
- ????13-1 ?????????
- VCO???????0.98GHz??6.6GHz????
- ?????????????????????????????????????
- ??????????????????????????????
42RF?? ????(6)
Advanced Fs/2 Discrete-Time GSM Receiver in 90nm
CMOS
- ????13-4 ST????????????????
- ????????????????????????
- ????????IM2?????????????????????
- GSM???????????????????
43???????????
- ?????????
- ????
- RF
- Wireless/Wireline
- ?????
- ???
- ?????
- ???
- ?? ??(????)
- ?? ??(??)
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44???????????
- Session 2Wireless Communication
- Session 14Wireline Communication
45???????????
- A 103 GOPS Signal Processing Platform Chip for
Software Defined Radio - A 1.4Gbps/ch LVDS Receiver for Flat Panel
Displays - A 90nm 1-4.25Gb/s Multi Data Rate Receiver for
High Speed Serial Links
46???????? ????(1)
A 103 GOPS Signal Processing Platform Chip for
Software Defined Radio
- ????2-1 ?????????
- ????????????????HW??????????SDR?????????LSI
- ???????103GOPS
- WLAN(a/b/g)?W-CDMA?WiMAX?????
47???????? ????(2)
A 1.4Gbps/ch LVDS Receiver for Flat Panel Displays
- ????14-1 ??????????
- ?????????????????????????????????????1????HDTV?
???????? - UXGA???????????201mW?????
48???????? ????(3)
A 90nm 1-4.25Gb/s Multi Data Rate Receiver for
High Speed Serial Links
- ????14-3 ????????
- 14.25Gb/s?????????????????????????????
- 30m?????????????10-14???BER?????
49???????????
- ?????????
- ????
- RF
- Wireless/Wireline
- ?????
- ???
- ?????
- ???
- ?? ??(????)
- ?? ??(??)
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50Digital?????
- ??78(??52),??22(??11????4),???28
- ?????????37,??16,??9,??8,??2??
- ????????? 5,?? 8,??6,??3,??0
- Digital???3???????
- Multimedia IC Designs
- IP Design for Communication and Security
- Digital Circuit Techniques on Timing and Noise
Tolerance - ?????3???
- ?An 800-µW H.264 Baseline-Profile Motion
Estimation Processor Core? ???? - ?A Block Scaling FFT/IFFT Processor for WiMAX
Applications? NCTU(??) - ?Improving Multi-Context Execution Speed on
DRFPGAs? - ????
51Digital ????(1)
- ?An 800-µW H.264 Baseline-Profile Motion
Estimation Processor Core? - ????3-2 ???????
- ??????????
- VLSI??????????
- SIMD?Systolic-array??????
- ?????SRAM??
- ????????????(????Pixel?????)
- ??/????????
- 3.3M Trs., 2.8 x 3.3 mm2, 130-nm CMOS
- ???? 800µW (QCIF, 15 fps)
52Digital ????(2)
- ?A Block Scaling FFT/IFFT Processor for WiMAX
Applications? - ????7-1 ???????
- MIMO-OFDM???2048-point FFT/IFFT????????????
- 17.26mW,22.86 MHz?2?????????
- WiMAX????????2K??????
- Block Scaling?Ping-pong Cache??
- ???????????????
- 0.13µm????,1322 x 1590 mm2
- SQNR 48 dB??(QPSK,16/64-QAM??)
53Digital ????(3)
- ?Improving Multi-Context Execution Speed on
DRFPGAs? - ????10-2 ????
- FPGA???????????????
- FPGA?????????????
- ????????????????
- ????????????????????
- ???????????????
- 0.35µm CMOS????(FP3)???
- ????????????????????
54???????????
- ?????????
- ????
- RF
- Wireless/Wireline
- ?????
- ???
- ?????
- ???
- ?? ??(????)
- ?? ??(??)
- ?? ??(??)
- ?? ??(??)
- ?? ??(????)
- ?? ??(????)
55????????
- ????(????)??????????????
- ?TCAM??????
- 100MHz????????????16Mb-MRAM???NEC
- 1Tr-4MTJ??????MRAM??????? ???????
- ????DRAM???????????????????Hynix(?)
- 3Gbps?512Mb/GDDR3-SDRAM ???Hynix(?)
- ECC????????????????????Samsung(?)
- eDRAM??????????????????????
- ??????????SRAM ???KAIST(?)
- ???????????????????TCAM???KAIST(?)
- IP??????????TCAM???Natio. Chung Cheng Univ..(?)
56A 16Mb Toggle MRAM with Burst Modes
(16Mb-?????MRAM)
??? ????(1)
- ????11-1 NEC ???
- ?????????????????????????100MHz???????16Mb-MRAM
- 130nm-CMOS????????????1.3µm2??????78mm2?1.8V/1.
2V???????????????????????????????????
57Adaptive Self Refresh Scheme for Battery Operated
High-Density Mobile DRAM Applications
(????DRAM???????????????)
??? ????(2)
- ????11-6 Hynix(?) ???
- ????DRAM???????????????????(ASR)??????????????????
????????????????????????????????? - 2????????????????????????????
- 512Mb-????SDRAM?????Istby150µA_at_85????
58???????????
- ?????????
- ????
- RF
- Wireless/Wireline
- ?????
- ???
- ?????
- ???
- ?? ??(????)
- ?? ??(??)
- ?? ??(??)
- ?? ??(??)
- ?? ??(????)
- ?? ??(????)
59??????????
- ??????????????????,???????????????????
- ?15????,2?????
- S4 Emerging Applications in CMOS
- S15 Emerging Technologies Bio/Sensor
Applications - MEMS????????????4?,????/RF??4?,CMOS???????2?,??
???????,????,???,CNT,???????1? - ??4?,????4?,??3?,??2?,??,???????1?
60????(1)
Stacked-chip Implementation of On-Chip Buck
Converter for Power-Aware Distributed Power
Supply Systems ??????????????,???????????????????
????????
- ????4-1 ???????
- ?????????????????????????DC-DC????????????????????
??????? - Buck Converter????,?????????????LC????????????????
???????,??????????? - ???????????????????????????????????????,??????????
???????????????????????????(?????????????) - 0.35mm???,????62_at_IL70mA, f200MHz
61????(2)
A 6.5-mW 5-Gbps On-Chip Differential Transmission
Line Interconnect with a Low-Latency Asymmetric
Tx in a 180nm CMOS Technology180nmCMOS?????6.5mW,
5Gbps????????????????????????????????????
- ????4-2 ?????????
- ????????????,?????????????????????
- ???????????,?????????????(nMOS/pMOS)???
- 180nmCMOS???,140ps,5Gbps,6.5mW_at_3mm
- 5mm??????????????????(FoM)(4.51mm3/pJ?ps_at_10mm)
62????(3)
A 1/2.5 inch 5.2Mpixel, 96dB Dynamic Range CMOS
Image Sensor with Fixed Pattern Noise Free,
Double Exposure Time Read-Out Operation??????????
???????????????????????96dB?1/2.5???520???CMOS????
???
- ????4-3 ?????
- ????????????????????????
- ?????????????????????,?????????????(?????????)
- ?????????????????????????,????????????????
- 0.13mm 2P3M CMOS???,Pixel2.5x2.5mm2,2.5Tr/pixel,5
0FillFactor
63????????
- CMOS Meets Bio 15-1
- CMOS?????????????????????????????????
????????????????????????????(??????) - Scalability of Carbon Nanotube FET-based Circuits
15-2 - ??????????????????? ???/???FOA(Frequency Over
Area)??????,45nm?????MOS????20???,?????????2.22.2
8?/?????(????) - A 6-b DAC and Analog DRAM for a Maskless
Lithography Interface in 90nm CMOS 15-3 - ?????????????????????????????????????
????6???DAC?????DRAM???(??????????????) - CMOS Low-Power Variable-Gain CMFB-Free Current
Feedback Amplifier for Ultrasound Diagnostic
Applications 15-4 - ????????????????????????,?????(CMFB)??????????????
??????? ???????????????(?????,TI) - A Low-Voltage and Area-Efficient Adaptive SI
SDADC for Bio-Acquisition Microsystems 15-5 - ????????????????????????ADC 0.8V, 180mW, 5kHz-BW,
60dB-DR, 0.05mm2_at_0.18mmCMOS (??????)
64A-SSCC2006
-- Asian Solid-State Circuit Conference 2006 --
- A-SSCC 2006????
- ?? 2006?11?13?15?(16?????)
- ?? ????? Hyatt Regency Hangzhou???
- Webhttp//www.a-sscc.org/
- ?????????????????????
- http//www.vdec.u-tokyo.ac.jp/A-SSCC2006/