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Electrical Grounds

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Title: Electrical Grounds Author: Administrator Last modified by: arellano Created Date: 9/22/2004 5:12:20 PM Document presentation format: On-screen Show – PowerPoint PPT presentation

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Title: Electrical Grounds


1
Electrical Grounds
  • By Professor Wilmer Arellano

2
Overview
  • Glossary
  • References
  • Definitions
  • Measuring Soil Resistivity
  • Recommendations
  • FPL
  • IEEE 142
  • Humming a Noise Example
  • IEEE 1100
  • Printed Circuits
  • Electrical Noise
  • Special Applications

3
Glossary
  • NEC, National Electric Code
  • FPL, Florida Power Light
  • IEEE, The Institute of Electrical and Electronics
    Engineers

4
References
  • NEC, National Electric Code
  • http//www.fpl.com/
  • http//www.epanorama.net/documents/groundloop/inde
    x.html
  • http//www.leminstruments.com/grounding_tutorial/h
    tml/soilresistivitytest.shtml
  • System Design and Layout Techniques for Noise
    Reduction in MCU-Based Systems. By Mark
    Glenewinkel. CSIC Applications, Austin Texas.
    MOTOROLA AN1259
  • EEL 4010 Senior Design 1 Booklet

5
Definitions. NEC
  • Wiring system ground. This consists of grounding
    one of the wires of the electrical system, such
    as the neutral, to
  • limit the voltage upon the circuit which might
    otherwise occur through exposure to lightning or
    other voltages higher than that for which the
    circuit is designed.
  • Another purpose in grounding one of the wires of
    the system is to limit the maximum voltage to
    ground under normal operating conditions.
  • Also, a system which operates with one of its
    conductors intentionally grounded will provide
    for automatic opening of the circuit if an
    accidental or fault ground occurs on one of its
    ungrounded conductors (Fig. 250-1).

6
Definitions. NEC
7
Definitions. NEC
  • Equipment ground. This is a permanent and
    continuous bonding together (i.e., connecting
    together) of all non current-carrying metal parts
    of equipment enclosuresconduit, boxes, cabinets,
    housings, frames of motors, and lighting
    fixturesand connection of this interconnected
    system of enclosures to the system grounding
    electrode (Fig. 250-2).
  • The interconnection of all metal enclosures must
    be made to provide a low-impedance path for
    fault-current flow along the enclosures to assure
    operation of overcurrent devices which will open
    a circuit in the event of a fault. By opening a
    faulted circuit, the system prevents dangerous
    voltages from being present on equipment
    enclosures which could be touched by personnel,
    with consequent electric shock to such personnel.

8
Definitions. NEC
9
Popular Definitions
  • For facilities engineers, grounds are a return
    for lightning strikes (e.g., may be 100,000 A for
    a few milliseconds).
  • Electricians see grounds as a return path for
    fault currents (up to hundreds of A at 60 Hz).
  • EE see grounds as a way for current to return to
    its source in such a way as to avoid/reduce
    noise, interference, and oscillations.

10
Definitions. FPL
  • The purpose of grounding
  • Electrical grounding prevents shortages from
    passing through electrical equipment.
  • The ground is the primary path through which a
    surge protector dissipates energy from a voltage
    spike.
  • The ability of grounding systems to dissipate
    electricity is measured in ohms. Properly
    installed grounding systems require 25 ohms or
    less

11
Measuring Soil Resistivity
12
Measuring Soil Resistivity
  • The measuring procedure described below uses the
    universally accepted Wenner method developed by
    Dr. Frank Wenner of the US Bureau of Standards in
    1915. (F. Wenner, A Method of Measuring Earth
    Resistivity Bull, National Bureau of Standards,
    Bull 12(4) 258, s 478-496 1915/16.)
  • p 191.5AR Where p the average soil
    resistivity to depth            in ohm - cm
           A the distance between electrodes in
    feet        R the measured resistance value in
    ohms           from the test instrument
  • http//www.leminstruments.com/grounding_tutorial/h
    tml/soilresistivitytest.shtml

13
Measuring Soil Resistivity
  • The basic formula used for the design of a
    grounding system is
  • RG p x f
  • Ground Resistance Soil Resistivity x Function
    based on electrode type, size, and shape
  • Typically, the target resistance is dictated by
    company standards. Less than 5 ohms is a common
    value used in the telecommunication industry.
    Soil resistivity is a given based on site
    conditions and "f" is a function based on the
    shape, size, type and layout of the electrode. A
    good design engineer will ensure that the
    components of the grounding system are configured
    to achieve the desired resistance value
    throughout all the seasons.
  • Some basic formulas that are used to determine
    electrode resistance can be found in the IEEE
    -"Green Book"IEEE Recommended Practice for
    Grounding of Industrial and Commercial Power
    Systems, Chapter 4, Table 13.
  • http//www.electricity-today.com/et/issue0502/i05_
    lightning.htm
  • Notation modified to coincide with previous page

14
Recommendations FPL
  • Since the 1980s National Electrical Code has
    required the bonding and grounding of all lines
    (power, phone, cable TV, communications lines)
    together before they enter the building. This is
    typically done at the ground by the electric
    meter where all lines should be bonded to the
    wire leading to the driven ground rod. If you
    have a centralized grounding system and the cable
    or phone lines are not bonded to it,
  • contact the appropriate utility and
  • have them check the system.

15
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17
Recommendations. FPL
  • Ground fault interrupt A special GFI outlet is
    designed to shut off electricity to the entire
    circuit in order to prevent electrical shock. To
    restore electricity to the circuit, the GFI
    outlet must be reset
  • Ground Fault Interrupt (GFI) circuits most often
    provide power to outlets located wherever water
    can be a threat, near
  • sinks
  • tubs
  • garages and
  • on the exterior of your home.

18
Recommendations, NEC
  • The ground fault senses a difference in the flow
    of current from the hot wire through the neutral,
    if that difference is about 5 milliamps or more
    the ground fault will trip the circuit out. It
    actually assumes that if the current is not
    flowing in the neutral it is flowing through
    something else.
  • Some motor windings have sufficient losses to
    cause one to trip out so don't use a gfi circuit
    for a refrigerator or washer outlet. You should
    use (and the NEC requires) the use of gfi
    protected outlets within 6 feet of a sink,
    anywhere in a bathroom, in a garage or outside
    anywhere an outlet can be reached from a water
    source, a wet area, or earth ground, you should
    use gfi protection.

19
Recommendations. IEEE-142
  • When you design a grounding system, use these
    items first and bond them together
  • Metal underground water pipe,
  • Metal frame of the building (where effectively
    grounded),
  • Concrete-encased electrode, and
  • Ground ring. A ground wire of No. 2 size
    encircling or surrounding a building, tower or
    other above-ground structure. Usually the ground
    ring should be installed to a minimum depth of
    2.5 ft. and should consist of at least 20 ft. of
    bare copper conductor.

20
Recommendations. IEEE-142
  • If these items aren't available, Standard 142
    says, "then and only then can you use any of the
    following"
  • Other local metal underground systems or
    structures,
  • Rod and pipe electrodes, and
  • Plate electrodes. Rods or pipes can be driven
    into the ground or a flat plate of copper can be
    installed as an electrode.

21
Recommendations. IEEE-142
22
Humming, a Noise Example
  • Hum and buzz (50Hz/60Hz and it's harmonics) occur
    in unbalanced systems when currents flow in the
    cable shield connections between different pieces
    of equipment. Hum and buzz can also occur
    balanced systems even though they are generally
    much more insensitive to it.
  • The second most common source of hum and buzz is
    the voltage difference between two safety grounds
    separated by a large distance or the voltage
    difference between a safety ground and an "Earth"
    ground (such as a grounded satellite dish or
    cable TV source). This problem is usually called
    "ground loop". This is the most common one in
    severe humming problems.

23
Recommendations. IEEE 1100
  • A recent addition to the Institute of Electrical
    and Electronic Engineers (IEEE) color book
    series, IEEE Standard 1100 (Emerald Book),
    Recommended Practice for Powering and Grounding
    Sensitive Electronic Equipment, seeks to bring
    order to the apparent chaos of power quality
    assurance by doing exactly what its title says

24
Recommendations. IEEE 1100
  1. Strictly following the requirements of the NEC.
  2. Using solidly grounded AC power systems.
  3. Using dedicated circuits for sensitive loads.
  4. Using an insulated grounding conductor to
    supplement the Code-minimum raceway grounding
    path.
  5. Using a separately derived source close to the
    sensitive loads. Separately Derived Sources may
    include shielded isolation transformers, power
    conditioners, voltage regulators, UPS systems,
    rotary power conditioners, and motor generators.

25
Electrical Noise
  • Noise is any electrical signal present in a
    circuit other than the desired signal. This
    definition does not apply to internal distortion,
    which is a by-product of non-linearities. Noise
    is not a problem until it interferes with system
    performance. Noise sources can be grouped into
    three different categories
  • 1) Man-made noise sources digital electronics,
    radio transmitters, motors, switches, relays,
    etc.
  • 2) Natural disturbances sunspots and lightning
  • 3) Intrinsic noise sources related to random
    fluctuations from physical systems such as
    thermal and shot noise. Noise cannot be
    eliminated totally. However, the magnitude and
    impact of noise can be reduced.

26
Electrical Noise Sources
27
Reducing Noise
  • Separate the Components in the circuit according
    to their function, low level analog, high speed
    digital and noisy circuits.
  • High-frequency, low-inductance axial glass or
    multi-layer ceramic capacitors should be used for
    decoupling ICs. Use a 0.1µF capacitor for system
    frequencies up to 15 MHz. If the system frequency
    is above 15 MHz, use 0.01µF capacitors. Place the
    capacitor as close to the IC as possible.
  • After laying down the power and ground system
    traces, signal layout follows. When laying out
    mixed-signal boards, do not mix digital and
    analog signals together. Try to route sensitive
    lines first and be aware of potential coupling
    paths

28
Reducing Noise
  • The IC decoupling caps used for current glitches
    often deplete their charge reservoirs and must be
    recharged. This is done by using a bulk capacitor
    placed as close to the PCB power terminals as
    possible. The bulk capacitor should be able to
    recharge 15 to 20 ICs. If more ICs are on the
    PCB, bulk capacitors can be placed around the
    PCB. The capacitor should have a small series
    inductance. Use tantalum electrolytic or
    metalized polycarbonate capacitors. Do not use
    aluminum electrolytic capacitors.
  • A small 0.1µF capacitor also should be used to
    decouple high frequency noise at the terminals.

29
Reducing Noise
  • The most sensitive signals in an MCU-based system
    are the clock, reset, and interrupt lines. Do not
    run these lines in parallel with high-current
    switching traces.
  • The crystal or ceramic resonator clock is an RF
    circuit. The clock must be layed out to decrease
    its emission levels and susceptibility. Figure 11
    shows an example of a crystal or ceramic
    resonator layout with a DIP package.
  • Always place the circuit as close to the MCU as
    possible. If the crystal or ceramic resonator has
    a long body, lay it down flush with the PCB and
    ground the case. The ground signal of the crystal
    circuit should be connected to the ground pin of
    the part using the shortest trace possible. The
    power and ground pins should be routed directly
    to the power posts of the PCB.

30
Special Applications
31
RULES TO REDUCE NOISE (GROUNDING, ETC.) EEL 4010
BOOKLET
  1. The signal ground for all amplifiers should be a
    flat plane such as a large copper area of a
    printed circuit board.
  2. Connect all system chassis grounds together with
    heavy wire or braid.
  3. Make all grounds large (wire, braid, etc.) or
    wide (pc board runs) as practical.
  4. Connect signal ground of lowest level amplifier
    in system to chassis ground. Make this as close
    as possible to actual op amp input signal ground.
  5. Connect ground return of source voltage (e.g.,
    external input) to the lowest (input) level
    amplifier to the same chassis ground in item 4.
  6. Power ground and power leads may be
    daisy-chained between amplifiers. Make only one
    connection between power ground and signal
    grounds. One connection should be as close as
    possible to the cluster of grounds in items 3 and
    4 above.

32
RULES TO REDUCE NOISE (GROUNDING, ETC.) EEL 4010
BOOKLET
  • Three separate returns to power ground
  • Power line bypass caps (lt1 from IC), protection
    circuits, (all together) should have a separate
    return to ground (rarely done).
  • Signal grounds, separate return to ground.
  • Output load ground, and power leads (power amp)
    separate returns to power supply.
  • Make overall layout compact.
  • Keep all component lead lengths as short as
    possible.
  • Route all inputs and input related components
    away from any outputs.
  • Separate input and output leads by a ground or
    supply trace where possible.
  • Low level high impedance signal carrying wires
    may require shielded cable.

33
RULES TO REDUCE NOISE (GROUNDING, ETC.) EEL 4010
BOOKLET
  1. Bypass caps are required (on each device or 5
    max), within one inch from chip power leads.
  2. At the power input to the board add from and -
    power connections to ground, gt10 µF capacitor,
    used to absorb low frequencies and .1 µF disc
    paralleled across the
  3. gt10 µF caps, to prevent high frequency feedback
    through the power supply lines.
  4. Reduce high impedance positive inputs to the
    minimum allowable value (e.g., replace I Meg
    biasing resistors with 47k ohm, etc.).
  5. Add small (lt1OOpF) capacitors across feedback
    resistors to reduce amplifier gain at

34
Special Applications
35
Special Applications
36
Review
  • Definitions
  • Measuring Soil Resistivity
  • Recommendations
  • FPL
  • IEEE 142
  • Humming a Noise Example
  • IEEE 1100
  • Printed Circuits
  • Electrical Noise
  • Special Applications

37

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