Title: ME 350
1ME 350 Lecture 22 Chapter 26
- NONTRADITIONAL MACHINING PROCESSES
- Mechanical Energy Processes (USM, WJC, AJM)
- - high velocity stream of abrasives or fluid (or
both) - Electrochemical Processes (ECM)
- - reverse of electroplating
- Thermal Processes (EDM, Wire EDM, EBM, LBM, PAC)
- - vaporizing of a small area of work surface
- Chemical Processes (CHM, Chemical Blanking, PCM)
- - chemical etching of areas unprotected by
maskant - Nontraditional machining is characterized by
material removal that does not use a sharp
cutting tool
2ME 350 Final Exam Update
Location Loomis Room 151 Date Thursday
December 16th, 2010 Time 130 pm 330 pm
3Nontraditional Processes Used When
- Material is either very hard, brittle or both or
material is very ductile difficult material - Part geometry is complex or geometric
requirements impossible with conventional
methods difficult geometry - Need to avoid surface damage or contamination
that often accompanies conventional machining
surface smooth or clean
41. Mechanical Energy Processes
- Ultrasonic machining (USM)
- Water jet cutting (WJC)
- Abrasive jet machining (AJM)
51a) Ultrasonic Machining (USM UW)
- Abrasives in a slurry are driven at high velocity
against work by a vibrating tool (low amplitude
high frequency) - Tool oscillation is perpendicular to work
surface - Abrasives accomplish material removal
- Tool is fed slowly into work
- Shape of tool is formed into part
6USM Applications
- Used only on hard and brittle work materials
ceramics, glass, carbides, and hard metals. - Shapes include non-round holes, holes along a
curved axis - Coining operations - pattern on tool is
imparted to a flat work surface - Produces virtually stress free shapes
- Holes as small as 0.076 mm have been made
71b) Water Jet Cutting (WJC)
- Uses high pressure, high velocity stream of water
directed at work surface for cutting
5-axes water jet cutting
7 axis for trimming large parts
8WJC Applications
- Usually automated using CNC or industrial robots
- Best used to cut narrow slits in flat stock such
as plastic, textiles, composites, tile, and
cardboard - Not suitable for brittle materials (e.g., glass)
- When used on metals, you need to add to the water
stream abrasive particles - Smallest kerf width about 0.4 mm for metals, and
0.1mm for plastics and non-metals. - More info http//www.waterjets.org/index.html
9WJC Advantages
- No crushing or burning of work surface
- Minimum material loss
- No environmental pollution
- Ease of automation
101c) Abrasive Jet Machining (AJM)
- High velocity gas stream containing abrasive
particles (aka sand blasting or bead blasting) - Normally used as a finishing process rather than
cutting process (e.g. gas sandpaper) - Applications deburring, cleaning, and polishing.
112. Electrochemical Machining Processes
- Electrical energy used in combination with
chemical reactions to remove material - Reverse of electroplating
- Work material must be a conductor
- Feature dimensions down to about 10 µm
Courtesy of AEG-Elotherm-Germany
12Electrochemical Machining (ECM)
- Material removal by anodic dissolution, using
electrode (tool) in close proximity to work but
separated by a rapidly flowing electrolyte
13ECM Operation
- Material is deplated from anode workpiece
(positive pole) and transported to a cathode tool
(negative pole) in an electrolyte bath - Electrolyte flows rapidly between two poles to
carry off deplated material, so it does not
plate onto the tool - Electrode materials Cu, brass, or stainless
steel - Tool shape is the inverse of the part
- Tool size must allow for the gap
14ECM Applications
- Die sinking - irregular shapes and contours for
forging dies, plastic molds, and other tools - Multiple hole drilling - many holes can be
drilled simultaneously with ECM - No burrs created no residual stress
Schuster et al, Science 2000
Trimmer et al, APL 2003
15Material Removal Rate of ECM
- Based on Faraday's First Law rate of metal
dissolved is proportional to the current - MRR Aƒr ?CI
- where I current A frontal area of the
electrode (mm2), ƒr feed rate (mm/s), and ?
efficiency coefficient
specific removal rate with work material
M atomic weight of metal (kg/mol) r density
of metal (kg/m3), F Faraday constant
(Coulomb) n valency of the ion
16 Equations for ECM (Cont)
Gap, g
Area, A
r is the resistivity of the electrolyte fluid
(Ohmm)
17Example ECM through a plate
- Aluminum plate, thickness t 12 mm
- Rectangular hole to be cut
- L 30mm, W 10mm
- Applied current I 1200 amps.
- Efficiency of 95,
- Determine how long it will take to cut the hole?
10mm
30mm
Ideal CAl 3.4410-2 mm3/amps - other C
values in Table 26.1
18Solution
- Frontal Area, A 30 10 300 mm2
- Applying MRR Aƒr ?CI
- At 95 efficiency,
- Feed rate fr ?CI/A
- fr 0.95(3.44 10-2 mm3/amps)(1200 A)/(300
mm2) - fr 0.131 mm/s
- Find machine Time
- T (12 mm)/(0.131 mm/s) 91.8 s 1.53 min
193. Thermal Energy Processes - Overview
- Very high temperatures, but only locally
- Material is removed by vaporization
- Problems and concerns
- Redeposition of vaporized metal
- Surface damage and metallurgical damage to the
new work surface - In some cases, resulting finish is so poor that
subsequent processing is required
203. Thermal Energy Processes
- Electric discharge machining (EDM)
- Electric discharge wire cutting (Wire EDM)
- Electron beam machining (EBM)
- Laser beam machining (LBM)
- Plasma arc cutting or machining (PAC)
213a) Electric Discharge Machining (EDM)
- One of the most widely used nontraditional
processes - Shape of finished work is inverse of tool shape
- Sparks occur across a small gap between tool and
work - Holes as small as 0.3mm can be made with feature
sizes (radius etc.) down to 2µm
22Work Materials in EDM
- Work materials must be electrically conducting
- Hardness and strength of work material are not
factors - Material removal rate depends primarily on
melting point of work material - Applications
- Molds and dies for injection molding and forging
- Machining of hard or exotic metals
- Sheetmetal stamping dies.
233b) Wire EDM
- EDM uses small diameter wire as electrode to cut
a narrow kerf in work similar to a bandsaw
24Material Removal Rate of EDM
- Weller Equation (Empirical) Maximum rate RMR
- where K 664 (C1.23mm3/amps) I discharge
current Tm melt temp of work material - Actual material removal rate
- MRR vf hwkerf
- where vf feed rate h workpiece thickness
wkerf kerf width
While cutting, wire is continuously advanced
between supply spool and take-up spool to
maintain a constant diameter
25Wire EDM Applications
- Ideal for stamp and die components
- Since kerf is so narrow, it is often possible to
fabricate punch and die in a single cut - Other tools and parts with intricate outline
shapes, such as lathe form tools, extrusion dies,
and flat templates
263c) Electron Beam Machining (EBM)
- Part loaded inside a vacuum chamber
- Beam is focused through electromagnetic lens,
reducing diameter to as small as 0.025 mm - Material is vaporized in a very localized area
27EBM Applications
- Ideal for micromachining
- Drilling small diameter holes - down to 0.05 mm
(0.002 in) - Cutting slots only about 0.025 mm (0.001 in.)
wide - Drilling holes with very high depth-to-diameter
ratios - Ratios greater than 1001
- Disadvantage slow and expensive
283d) Laser Beam Machining (LBM)
- Generally used for drilling, slitting, slotting,
scribing, and marking operations - Holes can be made down to 0.025 mm
- Generally used on thin stock material
293e) Plasma Arc Cutting (PAC)
- Uses plasma stream at very high temperatures to
cut metal 10,000?C to 14,000?C - Plasma arc generated between electrode in torch
and anode workpiece - The plasma flows through water-cooled nozzle that
constricts and directs plasma stream to desired
location
30Applications of PAC
- Most applications of PAC involve cutting of flat
metal sheets and plates - Hole piercing and cutting along a defined path
- Can be operated by hand-held torch or automated
by CNC - Can cut any electrically conductive metal
- Hole sizes generally larger than 2 mm
314. Chemical Machining (CHM)
- CHM Process
- Cleaning - to insure uniform etching
- Masking - a maskant (resist, chemically resistant
to etchant) is applied to portions of work
surface not to be etched - Patterning of maskant
- Etching - part is immersed in etchant which
chemically attacks those portions of work surface
that are not masked - Demasking - maskant is removed
32Maskant - Photographic Resist Method
- Masking materials contain photosensitive
chemicals - Maskant is applied to work surface (dip coated,
spin coated, or roller coated) and exposed to
light through a negative image of areas to be
etched - These areas are then removed using photographic
developing techniques - Remaining areas are vulnerable to etching
- Applications
- Small parts on thin stock produced in high
quantities - Integrated circuits and printed circuit cards
33Material Removal Rate in CHM
- Generally indicated as penetration rates, i.e.
mm/min. - Penetration rate unaffected by exposed surface
area - Etching occurs downward and under the maskant
- In general, d u 2d, Etch Factor Fe
- (see Table 26.2 pg 637)
34Chemical Blanking
- Uses CHM to cut very thin sheetmetal parts - down
to 0.025 mm thick and/or for intricate cutting
patterns - Conventional punch and die does not work because
stamping forces damage the thin sheetmetal, or
tooling cost is prohibitive
Parts made by chemical blanking (photo courtesy
of Buckbee-Mears St. Paul).
35CHM Possible Part Geometry Features
- Very small holes
- Holes that are not round
- Narrow slots in slabs and plates
- Micromachining
- Shallow pockets and surface details in flat parts
- Special contoured shapes for mold and die
applications