Lead-free Roadmap 2002 Roadmap 2002 for Commercialization of Lead-free Solder official version 2.1 September 2002 Lead-Free Soldering Roadmap Committee Technical Standardization Committee on Electronics Assembly Technology JEITA Japan Electronics and

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Lead-free Roadmap 2002Roadmap 2002 for
Commercialization of Lead-free Solderofficial
version 2.1September 2002Lead-Free Soldering
Roadmap CommitteeTechnical Standardization
Committee on Electronics Assembly Technology
JEITAJapan Electronics and Information
Technology Industries Association

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Policy in making the Lead-free Roadmap 2002

• Make the clear definition of lead-free.
• Put the trends of lead-free application on a
  timeline.
• Clearly show the leading makers and the
  followers.
• Make the de facto standard.
• Extract and promote the standardization, without
  picking up every factor.
• Make active proposals towards the rest of the
  world.
• Based on questionnaire survey.
• February 2002, 160 answers

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Roadmap 20021. Definition of Lead-free Lead
content

• Definition of lead-free In the following phases,
  the amount of contained Pb in the prescribed
  parts planned for lead-free adoption should be
  less than 0.1w percent.
• The value must be given if it exceeds that
  amount.
• If there is any exemption, the definition refers
  to the rest parts of the product, with indication
  of the name of the item of the exemption and the
  amount of contained Pb.

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Roadmap 20021. Definition of Lead-free
Lead-free phase
Components
Equipment
Phase 1
Common definition in the equipment for
lead-freeNo leaded solder is used at the stage
of board assembly in board surface finishing,
solder paste and solder bath,
Components withstand heat resistance
Heat resistance against soldering in assembly
with lead-free solder
Phase 1
Phase 1A
Equipment with lead-free solder
A Application of current components or
components withstand heat resistant, Phase1
(Composing components and materials may contain
lead, while the assembly solder is lead-free)
Components with lead-free solder
Module components etc. Correspond to Phase1 in
Equipment.
Phase 2
Phase 2
Lead-free terminal components No lead contained
plating and electrodes of terminal parts of
components assembled to PWB etc. The components
may contain leaded composing components and
materials.
Equipment with lead-free solder
BApplication of lead-free terminal components,
Phase2, or lead-free components, Phase3 (Even if
the assembled components are lead-free, the other
components and materials may contain lead.)
Phase 3
Phase 3
Lead-free components No lead
contained in all the internal bonding and/or
composing components and materials
Lead-free equipment Application
of lead-free components, Phase3, only and non
leaded composing components and materials in
addition to assembled components and bonding
materials
Phase 0
Lead-free component equipment
Application of lead-free terminal components,
Phase2, or lead-free components, Phase3, with
lead-bearing solder in bonding materials
(Excluded from the category of lead-free
equipment)
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Roadmap 20022. EU-regulation and Japanese
reaction

• The lead-free regulation in the EU will be
  accepted with reluctance in Japan, if it is
  crucial for the environment.
• In that case, the same kind of regulation should
  be required also in Japan.
• A global agreement on the definition of lead-free
  and on the standard for judgment is needed as
  early as possible.

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Roadmap 20023. Timeline for lead-free

• Timeline for lead-free Set up the schedule for
  the average makers as follows.
• Components
• Start supplying components withstand heat
  resistance / lead-free terminal components
  ---------------------------------------------2001
• Complete supplying of lead-free terminal
  components --2003
• Complete supplying of lead-free components
  --------------2004
• Equipment
• Start introducing lead-free solder
  ------------------------------2002-2003
• Totally adopt lead-free solder into new products
  -----------2003
• Complete lead-free adoption ---------------------
  ---------------2005
• The leading makers are 1 year ahead of this
  schedule, and the followers are 2 years behind.
  
• There is a need to establish a worldwide
  milestone and a roadmap.

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Roadmap 20024. Phase 0 in Equipment

• Combined packaging of lead solder for PWB and
  lead-free terminal components (Phase 0 in
  Equipment)
• In the stage of shifting to lead-free, packaging
  of lead-free terminal components with lead solder
  (?Phase 0) should be allowed.
• Component and equipment makers should work
  together on shortening the transition period, as
  the components makers have to prepare both
  lead-free terminal components and lead components.

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Roadmap 20025. Purchased/procured products

• Promote lead-free adoption corresponding to
  moving production plants overseas, components
  procurement overseas, and technology overseas.
• Equipment
• Promote technology transfer overseas. Give
  technology to overseas cooperative plants.
• Require that overseas plants cope with lead-free
  adoption 1 year behind at latest.
• Require that they cope with purchased and
  procured products immediately.
• Components
• Require that overseas plants cope with lead-free
  adoption 1 year behind at latest.
• There is a need of giving supports to the
  followers.

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Roadmap 20026. Standardization of lead-free
solder

• The following types of solder are recommended.
• Board assembly(Recommended) Sn-3Ag-0.5Cu
• Reflow Sn-3Ag-0.5Cu gt Sn-Ag gt Sn-Zn-Bi
• Wave Sn-3Ag-0.5Cu gt Sn-Cu
• Hand Sn-3Ag-0.5Cu
• Components
• Solder balls (Recommended) Sn-3Ag-0.5Cu
• Land finish (Recommenced) Plating/Au, Solder
  precoat/Sn-3Ag-0.5Cu
• Currently, more than one type are adopted to
  component electrodes and terminal plating as
  follows.
• Component electrodes and terminal plating
  (Current situation)
• Semiconductor components Sn-Bi plating is
  majority Sn-Bi gt Sn-Cu gt Sn gt Sn-Ag gt Au-Pd
• Passive components Sn plating is the main Sn gt
  Sn-Cu gt Sn-Bi
• Terminal finishes Sn-Cu plating and Sn plating
  are the majorities Sn-Cu gt Sn gt Au

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Roadmap 20027. Assessment standard for heat
resistance of components wave soldering

• For the time being, the heat resistance standard
  for wave soldering is
• 260?C, 10 seconds.

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Roadmap 20027. Assessment standard for heat
resistance of components reflow soldering

• As for the temperature profile for heat
  resistance assessment in reflow, the equipment
  makers are likely to assume the Hat type and
  the component makers are likely to assume the
  Angle type. The Hat type is a recommendation.

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Roadmap 20028. Facilities, processes, and design
change

• Promote lead-free adoption and energy saving by
  improving facilities and processes without large
  changes in design.

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Roadmap 20029. Labeling

• Promote industrial standardization of lead-free
  labeling.