HDI Manufacturing Process Flow

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HDI Manufacturing Process Flow
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Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
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Desmear
Cu plating
Hole plugging
Belt Sanding
Cu plating
5
Laser Ablation
Mechanical drilling
Cu plating
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Pattern imaging
Solder Mask
Gold plating
Routing
Electrical test
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Visual inspection
Hole counter
Shipping
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Raw material (Thin Core,Copper,Prepreg...)
Raw Material FR-4 (Difuntional,Tetrafuntional)
Supplier EMC ,Nan-Ya Sheet size
3648 , 4048 ,4248 Core Thickness
0.003,0.004,0.005,0.006
0.008,0.010,0.012,0.015
0.021,0.031,0.039,0.047 Copper Foil 1/3
oz,1/2 oz,1.0 oz,2 oz Prepreg type
1080,2113,2116,1506,7628,7630
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4. ??????(??)(Develop)
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5. ??????(??)(Etch)
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6. ??????(??)(Strip Resist)
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7.??? ( Oxide Coating)
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8. ?? (Lay-up)
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9. ?? (Lamination)
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10. ?? (Drilling)
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11. ??Desmear Copper Deposition
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12. ??(Hole Plugging)
13. ??? (Belt Sanding)
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14. ?? (Copper Reduction) ? Option
15. ??? (Belt Sanding) ? Option
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16. ???? Dry Film Lamination (Outer layer)
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17. ???? Expose
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18. After Exposed
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19. ???? Develop
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20. ?? Etch
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20. ??? Strip Resist
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21.?? (Build-up Layer Lamination)
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21. ????? (??)(Conformal Mask)
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22. ????? (??)(Conformal Mask)
Before Exposure
After Exposure
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23.????? (??)(Conformal Mask)
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24. ????? (??) (Conformal Mask)
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25.?????(??) (Conformal Mask)
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26. ???? (Laser Ablation)?????
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27. ???? (Mechanical Drill)
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28. ??(Desmear Copper Deposition)
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29. ?????? (Pattern imaging)
??(D/F Lamination)
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??(Exposure)
??(D/F Developing)
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?? (Etching)
??(D/F Stripping)
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30. ??(??)?? (Solder Mask)
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31. S/M ?? (S/M Developing)
32. ??? (Legend Printing)
WWEI 94V-0
R105
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33. ??(??)??(Electroless Ni/Au , HAL)
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34. ?? (Profile)
35. ?? (Electrical Testing)
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36. ?? (Final Inspection)
37. O.S.P. (entek plus Cu_106A.) ?Option
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BURIED VIA AND LASER BLIND VIA OPTION (????????)
A THROUGH VIA HOLE (???)
B BURIED VIA HOLE (??)
C One Level Laser Blind Via (???? )
D Two Level Laser Via (???? )
C
D
C
B
B
FR-4 Core
A
A
B-STAGE
RCC
C
C
D
LASER BLIND BURIED VIA LAY-UP
LASER BLIND BURIED VIA LAY-UP
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BLIND AND BURIED VIA OPTION (? ? ? ? ? ? )
A THROUGH VIA HOLE (???)
B BURIED VIA HOLE (??)
E VIA IN PAD (VIP) (????pad??)
C BLIND VIA HOLE (?? )
D BLIND HOLE MLB VIA (????)
E
C
B
A
A
B
C
BLIND VIA LAY-UP
BURIED VIA LAY-UP
D
RESIN
A
B-STAGE
BLIND VIA SEQUENTIAL LAY-UP
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Conventional PCB
Photo-Imageable Dielectric (PID)
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Conventional PCB
Blind Via PCB
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Q A
END