Factory Integration Technology Working Group Update

1
Factory IntegrationTechnology Working Group
Update

• Seiya Nakagawa, Sony
• Jeff Pettinato, Intel
• 06 December 2000

2
Objective of this presentation

• Inform the International Community on the Factory
  Integration Chapter of the ITRS 2000 update and
  tentative items for the 2001 edition of the
  roadmap
• Highlight new areas of interest and focus
• Provide a perspective of international
  participation
• Outline schedule/deliverables for 2001 Roadmap
  and possible team members for FI
• Request your Company participation for developing
  and delivering the 2001 Factory Integration
  chapter
• Lots of opportunities for team leaders and WG
  participants!

3
Factory needs have not changed

• Cost productivity expectations drive the need
  to
• Reduce factory capital and operating costs per
  function
• Optimize the factory for different business
  models including high-volume/high-product mix and
  high-volume/low-product mix
• Increase factory life via extendibility,
  flexibility, and scalability
• Increase equipment reliability and availability
• Reduce ramp time for both new and retrofit
  factories
• Manage complexity by ensuring factory needs are
  met with efficient, low cost solutions

4
No Fundamental Changes for 2000 to FI Difficult
Challenges Technology Thrusts
Factory Information Control Systems
Factory
Operations
Assembly / Test
5
Agile Manufacturing
6
Extension of FITWG technical requirements for
Agile Manufacturing

• Wafer level control to achieve
• Precision process control, cycle time reduction,
  equipment productivity with small lot sizes.
• Direct transportation system to achieve
• Cycle time reduction, WIP reduction, material
  handling cost reduction

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Wafer Level Control (Multiple Lots in a Carrier)
Tool X, Lot A
Lot A,B,C
Current (Split Type)
Tool X, Lot B
Large Loss in preparation
Tool X, Lot C
Lot A,B,C
Tool X, Lot A,B,C
Proposed (Mixed Type)
Wafer Identification
Wafer Level Control
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Direct Transportation Vision
Central Stocker System
Direct Transport System
Tool
Tool
9
Direct Transportation First Step
Real Time Monitoring
Multi Link
Tool
Short Cycle Time
Carrier
Active Vehicle OHS
Central Stocker
RGV
Mini Buffer
Short Cycle Time
Control Fluctuated WIP
Save Space Using Under-floor
Less Cost and Ramp-up Time by standardization
10
Direct Transportation and Wafer Level Control
Single Wafer Tool
Module
OHS
Wafer Level Transport
Carrier Level Transport
Mini Buffer
11
e-Manufacturing and Equipment Productivity
12
Need to Improve Production Equipment2000 ITRS
Excerpt

• Equipment productivity (availability and overall
  effectiveness) are not meeting roadmap targets.
  This is driving the need to seek improvements
  beyond simple design for reliability.
• 300mm software interface standards are defined,
  but industry implementation is not meeting
  expectations

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e-Diagnostics
Why e-Diagnostics?

• Internet
• Mainstream Computing Technologies
• Open Architectures

• Significant reduction in Repair Time higher
  Availability Increased Output.
• Goal is 66 reduction in equipment support
  dollars
• Anticipate problems before they occur.
• Provide data to support continuous improvement
  and new product development

Protocol Options

• Serial line IP
• Remote Cntl
• Telnet
• Ethernet IP
• VPN

• Firewall
• Authentication
• Data Security
• Safety Infrastructure

Factory floor
E-diagnostic enabled Controllers
Equipment A
Equipment B
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Assembly / Test Standardization
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Standardization to reduce the complexity of
Assembly and Test equipment
16
Roadmap for Semiconductor Equipment Interface
Standards in Assembly/Test Manufacturing
Current State
Immediate Need
Roadmap

• Characteristics
• Intelligent control
• Remote Diagnostics / Monitoring
• Mainstream computing standards

• Characteristics
• Some recipe management
• Some Equipment Performance Metrics
• Low or no standardization

• Characteristics
• Full recipe management
• Equipment Performance Metrics
• Anomaly Management
• SEMI standards

Factory Systems
Factory Systems
Factory Systems
Standards SECS I De facto Proprietary
Technology Serial Parallel TCP/IP
Technology Serial TCP/IP
Standards SECS I / II GEM HSMS
Standards Technologies TBD
Producer / Consumer Network
Manual
Tool

• Issues
• Limited extension opportunities
• High integration cost
• Long development

• Issues
• High integration cost
• Long lead time
• Semiconductor specific interfaces

• Strategy Use
• Standard communication protocols
• Lower integration costs
• Leverage computing industry investment
• Standard equipment
• Standard behavior models across tool types

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2001 Plans and Strategy
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2001 Focus areas for Factory Integration

• Packaging Test Manufacturing
• - Functional Test EoL Test Program Complexity
• - Production equipment standards
• - Material Handling Standards
• - Control System and CIM Standards
• - Traceability Requirements

• 300mm Intrabay Operations
• - Send-Ahead processing with AMHS
• - Direct Transport AMHS roadmap
• - Integrated Sorter roadmap
• - Reticle Handling roadmap
• - AMC 157nm Litho implications to Facilities

Integrated

• Process Control
• - 70nm, 100nm node requirements
• - 157nm Litho implications
• - Fault Detection Systems
• -Run to Run Process Control including feed
  forward and feedback systems
• - Potential solutions roadmap
• - Standards roadmap

• Agile Manufacturing
• - Single wafer control roadmap
• - MES Model and functions roadmap
• - e-Diagnostics standards and roadmap
• - TPT reduction and OEE improvement
• - High volume/hi-mix operations understanding
• - Scalable Fab, Risk Mgmt (redundancy, etc.)

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Collaboration planned for 2001 ITRS
20
Factory Integration International Meeting
ScheduleRev 1 05 December 2000

• 16/17 Jan 2001
• Asia/US TC 830-1030am Tokyo
• 17 Jan -gt Europe/US follow-up
• 17/18 Jan Test Sub-WG Video Con
• 13/14 Feb 2001
• Asia/US TC 830-1030am Tokyo
• 15 Feb -gt Asia/Europe follow-up
• 13/14 Mar 2001
• Asia/US TC 830-1030am Tokyo
• 14 Mar -gt Europe/US follow-up
• 25-28 April 2001 (Grenoble, Fr)
• FtF Meeting _at_Grenoble, France
• 1st Draft complete
• 08/09 May 2001
• Asia/US TC 830-1030am Tokyo
• 10 May -gt Asia/Europe follow-up
• 05/06 Jun 2001
• Asia/US TC 830-1030am Tokyo
• 06 Jun -gt Europe/US follow-up

• 15 June 2001
• July Workshop presentations due
• 26/27 Jun 2001
• Asia/US TC 830-1030am Tokyo
• 28 Jun -gt Asia/Europe follow-up
• 15-18 July 2001 (San Francisco USA)
• 15-16 Internal FtF Meeting, 2nd Draft done
• 17-18 Presentation at SEMICON West
• 28/29 Aug 2001
• Asia/US TC 830-1030am Tokyo
• 29 Aug -gt Europe/US follow-up
• 17 Sep 2001 (Final Chapter due)
• 02/03 Oct 2001
• Asia/US TC 830-1030am Tokyo
• 04 Oct -gt Asia/Europe follow-up
• 01 Nov 2001 (Final presentation done)
• TBD Dec 2001 (Seoul, Korea)
• Industry Presentation

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Factory Integration Dec 2000 FtF Attendees
High interest at the Dec FtF meeting with 4/5
regions and 38 participants! 2001 focus is on
consistent participation and more supplier
engagement
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Next Steps

• This is a CALL TO ACTION for members of each
  company to actively participate and create the
  2001 Factory Integration chapter
• Not enough participation from the supplier
  community. We do need their input for Factory
  Integration in particular.
• We need consistent participation from Taiwan
  Korea
• E-mail Jeff Pettinato for information?
  jeffrey.s.pettinato_at_intel.com
• This chapter has broad implications on key
  attributes of current and future factories
• You can participate and drive this effort by
  either leading teams or as WG members-
• You directly influence the Roadmap on what is
  important for your company by participation