Title: Bridging Theory in Practice
1Bridging Theory in Practice
- Transferring Technical Knowledge
- to Practical Applications
2Protected High Side Drivers
3Protected High Side Drivers
4Protected High Side Drivers
- Intended Audience
- Electrical engineers with a knowledge of simple
electrical circuits - An understanding of MOSFETs and high side drivers
is assumed - Topics Covered
- What is a PROFET?
- What type of protection does a PROFET have?
- What type of diagnostics does a PROFET have?
- How does a PROFET impact system EMI?
- How is a PROFET circuit implemented?
- PROFET Selection Questions
- Expected Time
- Approximately 90 Minutes
5Protected High Side Drivers
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
6MOSFET Review
MOSFET ? Metal Oxide Semiconductor Field Effect
Transistor
D
G
VGS
S
VSG
S
G
P-Channel MOSFET (Enhancement)
D
7MOSFETRegions of Operation
- A positive (for N-Channel) or negative (for
P-Channel) VGS produces a conducting channel
between the Drain and Source - The MOSFET is then able to operate in two
regions - 1) Linear region The MOSFET behaves like a
resistance. - 2) Saturation region The MOSFET behaves like a
current source.
VDS VGS-VT
VGS gt 0V N-Channel MOSFET (NMOS)
IDS
VDS
8High Side Drive (HSD) Configuration
The switch is on the HIGH side of the load
14V
MOSFET Switch
Load
9High Side Drive (HSD)Configuration
The switch is on the HIGH side of the load
14V
MOSFET Switch
If the MOSFET gate is pulled to a higher voltage
Load
10PROFETs PROtected FETs
MOSFET
PROFET
11Voltage Controlled PROFET Block Diagram
Voltage Controlled
IN
12Current Controlled
Current Controlled
Current Controlled PROFET Block Diagram
Current Controlled PROFET Block Diagram
IN
IIN
13Introduction to PROFETs
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
14Rugged vs. Protected
- Protected
- PROFETs
- Achieved through design and utilization of more
advanced integrated circuit technologies - Available CMOS, DMOS and Bipolar devices allow
for the integration of ESD protection, active
clamping, current limit, temperature sensing,
etc. - Protection Built in
- Protected
- PROFETs
- Achieved through design and utilization of more
advanced integrated circuit technologies - Available CMOS, DMOS and Bipolar devices allow
for the integration of ESD protection, active
clamping, current limit, temperature sensing,
etc. - Protection Built in
- Protected
- PROFETs
- Achieved through design and utilization of more
advanced integrated circuit technologies - Available CMOS, DMOS and Bipolar devices allow
for the integration of ESD protection, active
clamping, current limit, temperature sensing,
etc. - Protection Built in
- Rugged
- MOSFETs
- Achieved through process manufacturing
technology - Protection Not Built in
15PROtected FET (PROFET)Protection Features
- Electrostatic Discharge (ESD) Protection
- Overvoltage / Load Dump Protection
- Overvoltage Shutdown Protection and Restart
- Undervoltage Shutdown Protection and Restart
- Reverse Battery Protection
- Reversave Battery Protection
- Inductive and Overvoltage Output Clamp Protection
- Thermal Shutdown Protection
- Current Limit Protection
- Short Circuit Shutdown Protection
- Inversave Inverse Current Protection
- Loss of Ground Protection
- Loss of Supply Voltage Protection
16Block Diagram Including Protection Features
17ESD Protection
18Overvoltage Protection
VAZ
19Overvoltage Shutdown Protection and Restart
20Undervoltage Shutdown Protection and Restart
21Load Dump Protection
- The rated load dump voltage is a function of the
generator impedance (RG) and the load resistance
(RL) - As RG and RL increase, less energy is dissipated
in the PROFET, and the maximum allowable load
dump voltage increases
22Reverse Battery Protection
4) The over temperature protection is not active
during reverse current operation!
The PROFET will requires a 150?
resistor in the GND connection to limit the
reverse supply current.
23Reverse Battery Protection
4) The temperature protection is not active
during reverse current operation!
24Reverse Battery Protection
4) The temperature protection is not active
during reverse current operation!
25ReverSave Reverse Battery Protection
In PROFETs with ReverSaveTM protection, the
MOSFET is turned on by the voltage drop across
the resistor Rbb.
Rbb
With the MOSFET conducting the reverse load
current (instead of the intrinsic diode), the
power dissipation is greatly reduced under
reverse battery conditions.
26Inductive and Overvoltage Output Clamp Protection
27Thermal Shutdown Protection
Input Voltage
Load Current
Junction Temperature
A
B
C
D
E
F
28Current Limit Protection
IL(SCp)
IL(SCr)
29Short CircuitShutdown Protection
VON(SC)
30Short CircuitShutdown Protection
31Inversave Inverse Current Protection
Devices with Inversave can be operated in
inverse current mode. When the device is off,
only the intrinsic diode conducts with high
power dissipation. When device on, MOSFET turns
on for lower power dissipation.
32Loss of Ground Protection
- With Loss of Ground Protection, Vbb, VIN, and VST
are still referenced to ground through the output - This ensures the device will be safely shut off
if the ground pin is opened
33Loss of Supply Voltage Protection
- All PROFETs are protected against a loss of
supply voltage for non-inductive loads - Most PROFETs are also protected against a loss of
supply voltage for inductive loads by handling
the recirculation current through the GND pin
VOUT goes negative
I
34Introduction to PROFETs
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
35PROFET Diagnostic Feedback Digital vs. Analog
STATUS
ISTATUS
GND
36Digital Diagnostic Feedback
- The type of fault is determined by a diagnostic
truth table
14V
Input
Output
Status
Normal Operation
L
L
L
Input
H
H
L
Short Circuit to GND
L
L
L
PROFET
H
L
H
Status
Short Circuit to
Vbb
L
H
H
H
H
L
Output
Overcurrent
L
L
L
H
H
L
Overtemperature
L
L
L
H
L
H
Load
Open Load
L
H
H
H
H
L
37Analog Diagnostic Feedback
- The type of fault is determined by a diagnostic
truth table AND a sense ratio parameter
Normal Operation Overcurrent Short Circuit to
Ground Overtemperature Short Circuit to Vbb Open
Load
Input Current L H L H L H L H L H L H
Output Voltage L H L H L L L L H H Z H
Current IIS IIS(LL) nominal IIS(LL) IIS,FAULT IIS(
LL) IIS,FAULT IIS(LL) IIS,FAULT IIS(LL) lt
nominal IIS(LL) IIS(LH)
14V
Input
PROFET
IIS
Output
RIS
Load
38Analog Load Current FeedbackVia IIS Current
- Under normal operation, IIS is proportional to
the output current - KILIS IL / IIS 10,000
- For example
- IL 25A
- IIS 2.5mA
39IIS Current Sense Ratio
- The accuracy of IIS improves with increasing
output current
KILIS (IL / IIS)
40IIS Current Sense Ratio
- The accuracy of IIS improves with increasing
output current
More Accurate
Less Accurate
41Status Signal Settling Time
- The Status signal is not valid during a settling
time after turn-on, turn-off, or after
change of load current - This is true of PROFETs with analog or digital
diagnostic feedback
42Open Load Detection
- Three Different PROFET strategies
- Open load detection via Sense pin on HiC (High
Current) PROFETs and some PROFETs - Open load detection while PROFET is turned on
(for some PROFETS---mostly
older types) - Open load detection while PROFET is turned off
(for most PROFETs---mainly
newer types)
43Open Load Detection Via Sense Pin
Under an open load condition, the PROFET will
maintain IIS below 1?A (maximum).
Current Sense
44Open Load Detection PROFET On
An open load is detected if the PROFET is on and
the voltage across the MOSFET is VON lt
RdsonIL(OL)
45Open Load Detection - PROFET Off
Using an external resistor, an open load is
identified if the PROFET is turned off and VOUT gt
3.2V (typ.)
46Introduction to PROFETs
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
47MOSFET High Side Drive
- Recall, the gate of the N-Channel MOSFET must be
at a voltage higher than the transistors source
to turn the MOSFET on - With VSUPPLY being the highest voltage in the
system, where does VGATE come from?
48Charge Pump Gate Voltage
- A charge pump is used to raise (pump) the gate
voltage to an acceptable level to turn on the
MOSFET
VSUPPLY
DA
DB
VOUT
Switch B
CB
CA
Switch A
49Charge Pump Gate Voltage
- Initially, Switch A is closed, and CA is charged
to VSUPPLY - VDA
VSUPPLY 14V
DA
DB
VOUT
Switch B
CB
CA
Switch A
13V
50Charge Pump Gate Voltage
- Next, Switch B is closed, and current flows from
CA, through DB to charge CB
VSUPPLY 14V
DA
DB
VOUT
Switch B
CB
CA
Switch A
13V
51Charge Pump Gate Voltage
- But, CA acts like a battery in series with VSUPPLY
26V
VSUPPLY 14V
Reverse Biased
27V
DA
DB
VOUT
Switch B
CB
CA
Switch A
13V
52MOSFET High Side Drive
- Now, the High Side Drive MOSFET can be turned on
- The turning on and off of Switch A and Switch B,
however, leads to a new problem.
53Charge Pump Electromagnetic Interference (EMI)
120
Charge pumps can cause harmonic emissions
100
80
dB?V
60
40
20
0
1.0
10
100
0.1
Frequency (MHz)
54PROFETs Improved Charge Pump Reduces (EMI)
120
Newer, improved design reduces emissions 20 - 30
dB
100
80
dB?V
60
40
20
0
1.0
10
100
0.1
Frequency (MHz)
55Filter solutions may be required for the charge
pump
Filtering - RC 150?/4.7nF
Filtering - C 2µF
Vbb
Vbb
OUT
BTS 736
OUT
BTS 736
IN
IN
CEMI
load
CEMI
GND 150?
load
GND
GND
Continuous charge pump emission
Continuous charge pump emission
56EMI/EMC Emissions due to PWM Operation
- One source of EMI/EMC emissions is the internal
charge pump as shown on previous slides - The other source of emissions can be PWM
operation - During PWM operation the slew rate and shape of
the output voltage and current waveforms cause an
increase in the emission spectra - For slow switching applications (most Profets
used at 100Hz) this results in an increase of the
emission spectra below approximately 1Mhz.
57Benefits of Edge Shaping
- Edge shaping allows to reduce emission levels
while maintaining a slew rate which still allows
for permissible power loss levels
Slew control only
Theoretical ideal
Turn off edge shaping
58Hi-Current Profet---EMC improvements
- BTS650-Original Hi-current design with slew rate
control only. - BTS6510-Same as BTS650 with longer switching
times - BTS443P-Second generation with edge shaping for
current turn off - BTS6143/44-Third generation with edge shaping for
current turn on and off
59Introduction to PROFETs
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
60Overvoltage Protection of Logic Functional Block
- RGND required to limit current through DAZ
- RST required to protect microcontroller input pin
- RIN may be required to protect microcontroller
output pin
VAZ
RIN
RST
RGND
61Reverse Battery Protection
- RGND required to limit current through logic
zener diode - RST required to protect microcontroller input pin
- RIN may be required to protect microcontroller
output pin - RL must limit current through power inverse diode
RIN
RST
RL
RGND
62Reverse batteryPower Dissipation
- Power dissipation during reverse battery can be
higher than normal operation due to conduction of
load current through the FET body diode - For example
- 3A load with 100mohm Fet in normal mode gives
0.9W - 3A load thru body diode in reverse battery gives
2.1W (3A0.7V) - The discrepancy between normal mode dissipation
and reverse battery dissipation becomes worse as
load current becomes higher - Care must be take to control this dissipation to
safe levels since over temperature protection is
not active during reverse battery. - This leads us to a feature where the MOSFET
channel can be turned on during reverse battery
operation---ReverSave
63ReverSave Reverse Battery Protection Circuitry
- About 100mA of current must flow through the Rbb
(from the IN or STATUS pins) to turn on the
MOSFET in inverse mode - Currents above 100mA in Rbb may
create excessive
power dissipation. Add RIN to
limit current below
100mA
64IS Pin Overvoltage Protection
- Overvoltage conditions greater than 67V (typ) can
cause the IS pin to exceed 5V - damaging a
microcontroller input pin - The IS pin can be clamped by an external diode if
necessary
65Introduction to PROFETs
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
66PROFET Selection Customer Questions
- How many channels?
- What is the load current?
- Is the load capacitive and what is the inrush
current? - Is the load inductive and the inductance and/or
energy during turn-off? - Will load be on/off or PWM? What is PWM
frequency? - What is ambient temperature?
- What type of package - surface mount or
through-hole? - If surface mount, how much copper area for Vbb /
tab connection? - If through-hole, what type of heatsink will be
provided for package? - What diagnostics are needed?
- What application extremes will the device /
system be subjected to (reverse battery, load
dump, overvoltage etc.)?
67What Is the Load Current?
- What is the maximum load current?
- When does the maximum occur?
- What is the typical load current?
- Alternative Question What is the load
resistance? - Alternative Question If the load is a lamp,
what is its wattage? - Recall, the load current is fundamental in
determining an appropriate PROFET Rdson value
68Is the Load Capacitive?What Is the In-rush
Current?
- Recall, the in rush current for lamps and RC
networks may be an order of magnitude higher than
the steady state current
69What Is Load Inductance or Energy During Turn-Off?
- FETs are rated for the max absorbable energy when
turning off inductive loads
70Will the Load Be On/Off or PWM? What is PWM
frequency?
- PROFETs are often used in applications where the
load is pulse width modulated especially
lighting applications
71PWM Definitions
- Frequency-(frequency domain) What is the rate of
repetition of a waveform? - Duty cycle-(Time domain) What is the amount of
time spent on with respect to the amount of time
spent off?
72What Is the Ambient Temperature?
- Minimum ambient temperatures is usually -40C
- Maximum ambient temperature ranges from 85C to
125C for most applications -
- 85C for most non-powertrain applications
- 105C for some in-dashboard applications
- 125C for most powertrain applications
73What Type of Package?Surface Mount or
Through-hole?
- Many applications require all surface mount
components - Surface mount components typically only have
excess copper board space heatsinks - Through-hole components can have large heatsinks
for improved power dissipation
74If Surface Mount - How Much Board Area Is
Available for Heatsinks?
- Engineers must trade-off the cost and size of the
heatsink vs. the Rdson (and hence, the cost) of
the PROFET
75Introduction to PROFETs
- Introduction to PROFETs
- PROFET Protection Features
- PROFET Diagnostic Features
- EMI/EMC Considerations
- System Implementation
- Frequently Asked Questions
76Introduction to PROFETs
77Thank You!