Title: Si WDM Modulator Array for FWH-OCDMA
1Si WDM Modulator Arrayfor FWH-OCDMA
OCDMA Review April 6th, 2005
- Sagi Mathai, Xin SunProf. Tsu-Jae King, Prof.
Ming C. Wu - EECS DepartmentUniversity of California, Berkeley
2FWH-OCDMA All Si Transmitter
Wavelength Selective Microring Modulator Array
Encoded Output
Multi-Wavelength Source Input
Drop Ports for Feedback Control
3Free-Carrier Plasma Effect
Absorption Coefficient Change
Refractive Index Change
Holes
Holes
?? (cm-1)
-?n
Electrons
Electrons
Carrier Concentration (cm-3)
Carrier Concentration (cm-3)
Ref Irace, et.al., Silicon Photonics, Topics in
Appl Phys, vol 94, pp 361-392, 2004.
4Modulation Mechanism
OPTICAL FREQUENCY RESPONSE
SCHEMATIC (TOP VIEW)
si
st
Modulated Output
st/si2
?n?0
?n0
?
?0
sd
- Index of refraction can be tuned by injecting or
depleting carriers in the microring optical
waveguide - Shifting the index of refraction will shift the
microring resonant frequency and thus its
transfer curve - The resulting modulation in resonant frequency
will cause intensity modulation on the optical
carrier
5Wavelength Channel Distribution
FREE SPECTRAL RANGE
4 WAVELENGTH CHANNELS
100 GHz
FSR (GHz)
FSR 500 GHz
Radius (µm)
FSR 500 GHz corresponds to R 24 µm
6Quality Factor and RC Parasitic Limits
QUALITY FACTOR LIMITED BANDWIDTH
RC LIMITED BANDWIDTH
f3dB (GHz)
f3dB (GHz)
RL50 ?
?01.55 µm
Radius (µm)
Quality Factor
RC Parasitics do not limited the bandwidth 2.5
Gb/s switching speed requires Q 80,000 10 Gh/s
switching speed requires Q 20,000
7Transfer Function at Resonance
POWER TRANSMISSION
si
st
?2 0.063 ? 0.54 cm-1
sd
Carrier Density (cm-3)
Target 10 dB Extinction Ratio
8Carrier Transport Simulation
SWITCHING DYNAMICS
CARRIER CONCENTRATION
9Previous Results on Passive Si Microdisk
Resonators
- Microdisk resonators have been fabricated on Si
- Optical performance characterized
- Optical Q gt 100,000 was demonstrated
10Si Microring Modulator Schematic
P-type Regions
Input Port
Drop Port
Transmit Port
SOI
N-type Region
Add Port
11Cross Section
TOP VIEW
C
D
B
A
A-B CROSS SECTION
C-D CROSS SECTION
N-type Doping
P-type Doping
C
D
BOX
12BPM Waveguide Simulations
STRAIGHT WAVEGUIDE
CURVED WAVEGUIDE
Oxide
Oxide
Si
Si
Oxide
Oxide
Width 0.45 ?m Rib height 0.2 ?m Slab height
0.05 ?m
Radius 24 ?m
13Mask Layout
RF and DC Biasing Pads
Input Port
Transmit Port
Microring Resonator
250 microns
Drop Port
Add Port
14Fabrication Process
(1) Waveguide Dry Etching
(2) Hydrogen Anneal
(3) P Implant
(4) N Implant
(5) Recrystallization/Dopant Activation Anneal
(6) Ni-Silicide
(7) Passivation/Via
(7) Contact Pads/Interconnect
15Berkeley Microlab Capability
- Complete 0.35µm CMOS on 6 wafers
- 0.35µm Deep UV Lithography ASML 5500/90 Stepper
- Device group demonstrated FIN FET with 60 nm gate
length (King, Hu, Bokor)
16Si-Modulator Testbed
RF Source
DC Voltage Source
Bias-T
IR Camera
DUT
ECTL
PC
?/2 Plate
Polarizer
EDFA
VOA
Free-Space Optical Bench
ESA
OSA
RF Amp
BERT
PD
Oscilloscope
Electrical Characterization
17Summary
- Reviewed preliminary study on an all Si based
microring modulator array - Exploit SOI technology and CMOS compatible
fabrication process - Built testbed for device characterization
- 1st generation device target
- 2.5 Gb/s
- Single wavelength channel
- Free spectral range 0.5 THz
- Next generation device
- 10 Gb/s
- Q 20,000
- 4 wavelength channels (100 GHz spacing)
- Low power (µW)