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Factory Info

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Title: ITRS 2001 Main template for Prod Equipment Subject: International Technology Roadmap for Semiconductors Author: Jeff Pettinato (Intel) Last modified by – PowerPoint PPT presentation

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Title: Factory Info


1
Factory Info Control Systems (FICS)
  • July f2f 2005 report out

2
Contents
  • 2005 FICS Participants
  • Activities Status
  • Equipment Security Discussions Summary
  • Automation Ratios Discussions Summary
  • Next Steps
  • Finalize inputs to 2005 ITRS FI roadmap (Aug
    2005)
  • Discussion topics today
  • Automation Ratios
  • Requirements Table

3
2005 FICS Participants
  • Ya-Shian Li - NIST
  • Lisa Pivin Intel
  • Anant Raman Intel
  • Brad Van Eck ISMI
  • JB Ragothaman Intel
  • Richard Oechsner IIS
  • Les Marshall AMD
  • Harvey Wohlwend ISMI
  • Jonathan Chang TSMC
  • Bob Wiggins IBM
  • Mike Buffano Brooks
  • Arieh Greenberg Infineon

4
2005 SubTeams / Status Summary
  • Supply Chain (Mask Throughput )
  • Thomas Chen TSMC
  • Ton Govaarts Philips
  • Richard Oechsner - IIS
  • Joe Gordon - DuPont
  • Ya Shian NIST
  • Barbara Goldstein NIST
  • Visual Manufacturing
  • Homna-san (JB to follow-up)
  • Mike Bufano - Brooks
  • Equipment Security
  • Anant Raman - Intel
  • Harvey Wohlwend - ISMI
  • Richard Oechsner IIS
  • Automation Ratios
  • Jonathan Chang (TSMC)
  • Visual Manufacturing -- Status
  • Decided to roll-up into the focus areas section
    for 2005
  • Equipment Security Status
  • Requirements, challenges and potential solutions
    discussed and agreed upon. See next slides
  • Automation Ratios Status
  • Discussed in face-to-face. Dropped for this year.
    See next slides
  • Supply Chain Status
  • Dropped since the sub-team concluded that no
    additional changes required for 2005
  • Revisions to Technology Requirements Table
    Status
  • No changes to 2004 so far

5
Equipment Security
  • Key Requirement
  • Factory level and equipment level downtime due to
    security incident must be zero
  • Key Challenge has been
  • Protecting Equipment from cyber security threats
  • Solutions developed to-date have been documented
    as Equipment Security Guidelines under
    ISMI/Sematech
  • IC Maker Responsibilities
  • Establish Factory network capabilities to control
    access
  • Institute Business processes to control direct
    access to equipment
  • OEM Responsibilities
  • Harden computer configurations (password, no
    public shares, audit procedures etc)
  • Institute business processes and training to
    field service engineers
  • For new equipment, provide OS that is in
    currently supported life cycle
  • No wireless network within equipment
  • Security Upgrades to equipment provided as
    optional service
  • Network level security at the equipment level as
    an optional capability
  • Next Steps
  • Must adopt the Security Guidelines described
    above
  • In addition, equipment system integrity and IP
    protection related issues must be addressed
  • See next page for details

6
Equipment System Weaknesses
  • Exiting the User Interface terminates the
    application
  • Terminating the application brings down equipment
  • Terminating the application brings down the User
    Interface also
  • Application User Interface have to running all
    the tie in the foreground
  • Only one effective user on the equipment to keep
    equipment running
  • One user for multiple roles tool owner, field
    service engineer, factory technician, etc
  • The user is granted the union (set operation) of
    all users of privileges with one password for all
    users
  • Remote User access to equipment via remote access
    or remote control software
  • Remote User gets same privileges as the local
    user for Windows based computers

Security Problem System Integrity Intellectual
Property based on current design
7
Solving System Integrity IP Issues
  • First step Convert the equipment software to
    modular architecture decouple UI application
  • Second Step Make the application a service or a
    background application continuously running
  • Third step Make the application functionality
    sensitive to the different users role based
    security (fundamental to IP Security)

Security Capability System Integrity IP
Protection using modular Software Architecture
8
New Metric Automation Ratios discussion
disposition
  • Full automation (human-free operation) has been
    the vision for semiconductor manufacturing. We
    need to define metrics to drive towards this goal
    while addressing the challenges.
  • It was proposed that we decompose full-automation
    to key components so we can drive the individual
    components and address the problem in a step-wise
    fashion
  • Team was proposing the following 4 key metrics in
    this area
  • Equipment Automation Ratio
  • Transportation Automation Ratio
  • Dispatcher Automation Ratio
  • Scheduler Automation Ratio
  • This item was discussed in face-to-face
  • Disposition
  • See next page

9
Automation Ratios Discussion Summary
  • Ratios considered were equipment auto,
    transportation auto, dispatching auto and
    scheduling auto ratios
  • What are we using automation ratio to drive?
  • Capability or
  • Usage / maturity (quality of implementation)
  • Approaches
  • Goals, challenges to meeting the goals, roadmap
  • To drive capability Roadmap
  • Do benchmarking to understand to understand usage
    / maturity levels
  • To understand usage and learn from each other
  • Summary / Next Steps
  • Equipment Automation Transportation Automation
  • No capability gaps. Benchmarking may help to
    understand any quality/implementation issues
  • Next Step No addition to ITRS table. Engage
    with Sematech for common interest
  • Dispatching Scheduling Automation
  • There may be capability gaps. Subteam to further
    discuss any specific capability gaps that hinder
    the goal of 100 automation in the
    dispatching/scheduling space.
  • Next Step No additions to 2005 tables. Start
    discussions for 2006 changes in this space.

10
Backup
11
2004 Changes
Table 88a Factory Information and Control
Systems Technology RequirementsNear-term
Year of Production 2004 2005 2006 2007 2008 2009 2010
Technology Node hp90 hp65
DRAM ½ Pitch (nm) 90 80 70 65 55 50 50
MPU/ASIC ½ Pitch (nm) (Un-contacted Poly) 90 80 70 65 55 50 50
Wafer Diameter (mm) 300 300 300 300 300 300 300
Availability of mission critical applications ( per year) 99.977 99.980 99.986 99.987 99.990 99.991 99.991
Downtime of mission critical applications (minutes per year) 120 min 105 min 75 min 75 min 68 min 53 min 45 min
Factory down due to unscheduled FICS downtime due to FICS (minutes per year) 180 min 120 min 120 min 90 min 90 min 60 min 60 min
Full factory down due to unscheduled FICS downtime (minutes per year) 180 min 120 min 60 min 60 min 60 min lt15 min lt 15 min
Factory down due to scheduled FICS downtime (minutes per year) 240 min 180 min 180 min 180 min 120 min 120 min 120 min
Full factory down due to scheduled FICS downtime (minutes per year) 240 min 180 min 180 min 180 min 120 min 120 min 120 min
Mean time to recover for mission critical applications (minutes down per year) 45 30 15 lt15 lt15 lt15 lt15
MCS design to support peak number of AMHS transport moves (moves/hr) 12.3K 12.7 14.2 14.7 15K 15K 15K
FICS design to support peak number of AMHS direct transport moves (moves/hr) N/A 1270 1420 1470 1500 1500 1500
Time to send and load tape-out data into mask shop data system (hours) 612 612 612 612 612 612 612
Time for OPC calculations and data preparation for mask writer (days) 48 48 48 48 48 48 48
Time for OPC calculations only (days) 36 36 36 36 36 36 36
Factory information and control systems reusable for next node gt93 gt93 gt93 gt93 gt93 gt93 gt93
Ability to run/adjust different recipes/parameters within a run Partial Partial Partial Yes Yes Yes Yes
Wafer-level recipe/parameter adjustment Partial Partial Partial Yes Yes Yes Yes
Within-wafer recipe/parameter adjustment Partial Partial Partial Partial Yes Yes Yes
WAS
NEW
WAS
NEW
WAS
NEW
NEW
12
2004 Changes
Table 88b Factory Information and Control
Systems Technology RequirementsLong-term
Year of Production 2012 2013 2015 2016 2018 2019 2020
Technology Node hp32 hp22
DRAM ½ Pitch (nm) 35 32 25 22 18
MPU/ASIC ½ Pitch (nm) (Un-contacted Poly) 35 32 25 22 18
Wafer Diameter (mm) 300 300 300 300 450 450 450
Availability of mission critical applications ( per year) 99.994 99.994 99.999 99.999 99.999
Downtime of mission critical applications (minutes per year) 30 min 30 min 8 min 8 min 4 min
Factory down due to unscheduled FICS downtime due to FICS (minutes per year) 60 min 60 min 30 min 15 min 15 min
Full factory down due to unscheduled FICS downtime (minutes per year) lt15 min lt15 min lt15 min lt15 min lt15 min lt15 min lt15 min
Factory down due to scheduled FICS downtime (minutes per year) 60 min 60 min 0 min 0 min 0 min 0 min 0 min
Full factory down due to scheduled FICS downtime (minutes per year) 60 min 60 min 0 min 0 min 0 min 0 min 0 min
Mean time to recover for mission critical applications (minutes down per year) lt15 lt15 5 5 2 2 2
MCS design to support peak number of AMHS transport moves (moves/hr) 12.3K 12.7 14.2 14.7 15K 15K 15K
FICS design to support peak number of AMHS direct transport moves (moves/hr) N/A 1270 1420 1470 1500 1500 1500
Time to send and load tape-out data into mask shop data system (hours) 612 612 612 612 612 612 612
Time for OPC calculations and data preparation for mask writer (days) 48 48 48 48 48 48 48
Time for OPC calculations only (days) 36 36 36 36 36 36 36
Factory information and control systems reusable for next node gt93 gt93 gt93 gt93 gt93 gt93 gt93
Ability to run/adjust different recipes/parameters within a run Yes Yes Yes Yes Yes Yes Yes
Wafer-level recipe/parameter adjustment Yes Yes Yes Yes Yes Yes Yes
Within-wafer recipe/parameter adjustment Yes Yes Yes Yes Yes Yes Yes
WAS
NEW
WAS
NEW
WAS
NEW
NEW
13
Basics Equipment Connectivity Landscape
  • Equipment connectivity from users in the office
    and the Internet
  • Equipment connectivity in the factory to
    automation systems
  • Equipment connections to the factory network is
    fundamental to overall security
  • Connectivity is required for function and
    management
  • Manufacturing seeing growth of wireless network

Wired Wireless
Security Problem 1 Vulnerable to Cyber Attacks
from the Network
14
Automation Levels Concepts
Full Automation (FA) Equipment Automation
(EA) Transport Automation (TA)
Dispatching Automation (DA)
Scheduling Automation (SA)
15
Was/Is/Why for approval
  • Sub-team FICS
  • Was NEW
  • Is New Proposed Metric (example below)
  • Why Brief reason for change (example below)

16
Automation Ratio Metrics
  • Full Automation means human-free operation which
    includes key components of equipment,
    transportation and dispatching automation and
    integration
  • Dispatching Automation (DA) definition
    (human-free dispatching with AMHS operation)
  • Daily move handled by dispatch-automation
    operation / all FAB moves.
  • DA Scope All move in FAB, including
  • production wafers
  • non-production wafers
  • production process
  • and non-production process (tool monitoring,
    non-production wafer preparation..)
  • Transport Automation (TA) definition (human-free
    transportation with AMHS operation)
  • Daily move handled by AMHS operation to put in
    load-port / all FAB moves.
  • TA Scope All move in FAB, including
  • production wafers

17
Automation Ratios Metrics
  • Challenge
  • Equipment Automation support
  • AMHS coverage
  • AMHS performance
  • Dispatching Performance
  • Dispatching Rules Quality
  • Potential Solution
  • Tools compliance for SEMI standard -- Quality
  • New AMHS technology -- not clear what
    capabilities -- work with AMHS sub-team on
    delivery targets, anything lacking from controls?
  • Dispatching system architecture -- what issues,
    how will it help
  • Dispatching rule quality assessment -- how do
    we do this, coverage against scenarios,
  • Dynamic Dispatching Adjustment
  • Embedded Dispatching Rule in CIM system and tool
    S/W -- ?
  • How doe we model real factory scenarios
  • Implementing the prioritized decision

18
Explanation
19
Potential Solution
  • Enhanced dispatching system to integrate MES and
    EES system for optimized dispatching algorithm to
    cover all FAB operation scenarios including
    production wafer, tool monitoring, exception
    handling, super-hot run management and so on.
  • Research Required 2001-2004
  • Development Underway 2004 2006
  • Qualification / Production 2007
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