ESA/ESTEC

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Overview of a Space Qualification Process
- Radiation characterization and beyond
L. BONORA, ESA/ESTEC-Component Division Xanthi
- Oct 2006
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SUMMARY

• Radiation effects on EEE components
• Radiation tests requirements
• Beyond radiation, overview of the relevant
  requirements for space components/flight models.
• ESCC Evaluation/Qualification Approach
• Minimum Quality Management Requirements

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Radiation effects on EEE components (1)

• Total Ionizing Dose (TID)
• Degradation of µelectronics and optoelectronics
• Cumulative long term effects
• Parameter drifts, threshold shifts, timing
  changes, functional failures
• Non Ionizing Effects Displacements Damage
• Degradation of optoelectronics (GaAs ), CCDs,
  bipolar technologies in very harsh environments
• Cumulative long term effects ( disruptions of
  crystal lattice)
• CMOS technologies less affected ( majority
  carriers)

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Radiation effects on EEE components (2)

• Single Event Effects (SEE)
• Single charged particles (heavy Ions and protons)
  passing through a semiconductor material
• Soft errors data corruption (SEU), system
  shutdown (SEFI), transients (SET)
• Hard errors ( sometimes destructive) Latch-up (
  SEL), Stuck bits (SHE), Gate ruptures ( Power
  MOSFETs and thin capacitors in analog devices)
• New effect types or unknown manifestations of
  known effects always possible especially for new
  technologies

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Radiation Tests and requirements for TID

• Usual particle type ? rays (1.17 1.33 MeV)
  from Co60 sources
• Effects similar to/ representative of space
  radiation
• High penetration (parts irradiated as is on
  test boards)
• European Specification ESCC 22900
• Experimental Set-up
• Sample size (10 1) parts in gal, from a single
  lot
• Static bias ( considered as a worst case) ON and
  OFF
• Total dose 100 krad(Si) max. in several steps
  (0/5/10/20/50/100)
• Dose rate lt 360 rad(Si)/h
• Actual space dose rate very low ( a few
  rad(Si)/h)
• High dose rate not relevant for bipolar/ BiCMOS
  technologies due to ELDRS
• Facilities one source at ESTEC, several in
  Europe (e.g., ONERA Toulouse)

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Radiation Tests and requirements for SEE (1)

• General
• Characterization experimental curve s vs. LET
  (HI) or energy (p)
• s ratio number of events / number of incident
  particles
• Key parameters s sat, LETth and Weibull fit
• For LETth lt 12 MeV.cm2/mg ? proton sensitivity
  possible
• Based on these parameters ? event rate
  calculations
• For SET, pulse energies are also important
• pulse amplitudes and durations have to be
  determined
• For some events (e.g., SEGR), destruction of the
  test samples cant be prevented
• Results may be strongly dependent from test
  patterns or application conditions
• European Specification ESCC 25100

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Radiation Tests and requirements for SEE (2)

• Experimental method
• Fluences gt 106 HI/cm2 or gt 1010 p/cm2
• Sample size ( 31) min.
• Particle range gt 30 µm
• Bias dynamic or static
• The range of LETs (HI)/Energies (p) must be
  sufficient to determine threshold and saturation
• A min. of 5 LET/Energy steps is required
• De-lidded parts for HI Back side irrad.
  possible
• Experimental Set-up
• ESA supported facilities HIF(B), PSI (CH), RADEF
  (F)
• Other facilities in Europe (IPN- Orsay) or in the
  USA (BNL )

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Radiation Tests for Displacement Damage

• Experimental method
• Unit of interest NIEL ( Non Ionizing Energy
  Loss)
• Affected types CCDs / Optocouplers / GaAs (and
  similar material) based components
• Ground test
• protons ( pref. lt 60 MeV), fluences gt 1010 p/cm2
• neutrons ( 1MeV), fluences gt 1010 n/cm2
• Some parts are also TID sensitive ( if a silicon
  chip is included)
• Sensitivity to bias conditions

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Radiation points of contact at ESTEC
facilities availability

• Who to contact ? Radiation Effects Section
  (TEC-QCA)
• TID, DD Ali Mohammadzadeh - ali.mohammazadeh_at_esa.
  int
• SEE Reno Harboe - Sorensen - reno.harboe.sorensen
  _at_esa.int
• Availability of the facilities can be checked on
  line in ESA radiation section of ESCIES
• https//escies.org

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• Radiation characterization of a
  component/technology is a mandatory step BUT
• ? A lot more is required to get a Flight Model
• At this stage, one has to distinguish between
• An approval on a case by case basis which is an
  individual and limited authorisation for a
  specific project
• A full ESCC Qualification ( including an
  Evaluation phase in the ESCC system) which is a
  general and long term authorisation of use in
  space
• Lets first briefly present the relevant
  requirements

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RELEVANT REQUIREMENTS

• ECSS European Coop. for Space Standardisation
• Space Project Management Space Product
  Assurance Space Engineering
• ECSS-Q60A Requirements for supply and use of EEE
  components at equipment level
• ESCC European Space Components Coordination
• ( ESCC is the preferred option)
• The ESCC System is an international system for
  the specification / qualification / procurement
  of EEE components for use in Space programmes. It
  covers
• the technical specification of EEE parts
• methodologies for component evaluation and
  qualification
• testing methods / quality assurance / operational
  provisions

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RELEVANT REQUIREMENTS

• ECSS- Q60A
• Non-qualified components have to be evaluated
• ECSS defines what to do but not how to do
• The evaluation programme shall include
• A constructional analysis
• A manufacturer assessment
• An Evaluation testing
• Electrical stress ( Life test, HTRB )
• Mechanical stress ( shocks, vibrations )
• Environmental stress ( temp. shock and cycling,
  seal tests )
• Assembly capability
• Radiation testing ( TID and SEE)

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ESCC Eval. / Qualif. Approach The ESCC system in
brief
An international system for the specification /
qualification / procurement of EEE components for
use in Space programmes

• For users, 3 levels of specifications
• Basic test methods, qualification methodology
  and general requirements applicable to all ESCC
  components
• Generic requirements for screening, periodic or
  lot acceptance testing and qualification testing
  for individual families of components
• Detail performance requirements for individual
  or ranges of particular components

ESCC 20000 Using the ESCC Specification System
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ESCC QUALIFICATION

• ESCC qualification approval is a status given to
  electronic components which are manufactured
  under controlled conditions and which have been
  shown to meet all the requirements of the
  relevant ESCC specifications.
• Unlike the US MIL System, ESCC is based on a 2
  step qualification approach Evaluation
  Qualification
• During the Evaluation phase, components/technologi
  es can be more extensively characterised and
  margins determined
• 3 main phases
• Manufacturer Evaluation ( ESCC 20200) -gt AUDIT
• Component Evaluation ( ESCC 22600 and
  ancillaries)
• Preparation and realization of an agreed
  Evaluation Test Program ( ETP) including
• Constructional analysis and technology evaluation
  
• Step-Stress testing
• Preparation of a Process Identification Document
  (PID) Detail Specification
• Component Qualification testing
• On components produced strictly as defined in the
  final PID and from a given lot
• According to ESCC Generic Spec. requirements

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COMPONENT EVALUATION
ESCC QUALIFICATION
ESCC 22600 Stand. Comp. Eval

• Constructional Analysis
• On random samples taken from the current
  production
• Performed by the Evaluation Authority (ESCC
  Executive)
• Evaluation Test Programme
• Established in conjunction Manufacturer / ESCC
  Executive
• On a sample ( 100 parts) representative of the
  component family
• In order to determine failure modes and margins,
  it includes
• Endurance tests ( HTRB, Extended Burn-in, Life
  Test )
• Destructive tests ( Step-stress, radiation,
  Environmental/Mechanical/Assembly)
• Includes a CA on representative components
• Ancillary specifications 226xxxx describe the
  procedure and requirements to create and perform
  an ETP

xxxx generic spec. number
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COMPONENT EVALUATION
ESCC QUALIFICATION
ESCC 22600 Stand. Comp. Eval

• Process Identification Document ( PID)
• Shall be prepared by the Manufacturer
• Establishes a precise reference for an electronic
  component qualified in accordance with the ESCC
  System
• Components design configuration
• Materials used in manufacture
• Manufacturing processes and controls
• Inspections and tests to be carried-out during
  and after manufacture
• PID shall be in accordance with the requirements
  of ESCC 22700
• Detail Specification
• Necessary if not already described by an existing
  Detail Specification
• Or if the existing specification requires
  updating
• Described in ESCC 20800.

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QUALIFICATION TESTING PHASE
ESCC QUALIFICATION

• Prerequisites
• Successful completion of the Evaluation Phase
  (EPPL listing)
• The PID reviewed and approved by ESCC Executive
• A production and test schedule for major
  processing operations
• A Production Flow Chart, Process Schedules and
  Inspection Procedures

• Components required for qualification testing
  must be produced strictly in accordance with the
  PID
• Qualification testing of the component must be in
  accordance with the requirements of the relevant
  ESCC Generic Specification
• On successful completion of the testing phase gt
  ESCC QPL
• A Qualification, once established, is valid for 2
  years

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ESCC Gen. Spec. 9000 Integrated Circuits,
Monolithic, hermetically Sealed CHART F1

• ESCC 9000
• describes the general requirements for
• Qualification
• Qualification maintenance
• Procurement
• Delivery
• of hermetically sealed, hermetic ICs.

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ESCC 9000 CHART F3
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ESCC 9000 CHART F4
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QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the
requirements of ESCC 24600

• As a minimum, the Manufacturer quality management
  plan must address the ESCC 24600 requirements (
  prescriptions to ISO 9001).
• The resulting Manufacturer quality management
  system has to include and demonstrate the
  application of all the applicable ESCC 24600
  requirements.

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QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the
requirements of ESCC 24600

• An appointed CHIEF INSPECTOR with clearly
  defined authority and responsibility ( including
  CoC)
• CONTROL of NON-CONFORMING PRODUCTS invoking the
  requirements of ESCC 22800
• QUALITY and CONTROL DOCUMENTATION including
• Quality manual ( indicating as a objective the
  conformance to ESCC 24600)
• Document control procedures for all documents
  related to the ESCC components manufacture (
  incl. subs./suppliers management)
• A maintained PID
• Change Control Programme establishing the
  requirement for documentation of ALL changes,
  their reasons and the associated data including
  reliability and re-qualification results

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QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the
requirements of ESCC 24600

• TRACEABILITY has to be maintained at all stages
  of production and tests for all lots
• Quality records have to be maintained for 5 years
  ( possibly 10 in a near future)
• Record of all components found to be defective
• A Conversion of CUSTOMER REQUIREMENTS (specific
  tests or test vehicles, marking, rework,
  screening )
• A CONTROL/INSPECTION prog. Including
• On-receipt / incoming tests / inspections
• Applicable ESCC in-process monitoring/control and
  back-end tests
• Procedures shall detail the frequency, methods
  and criteria for evaluating test results
• Data shall be maintained

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QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the
requirements of ESCC 24600

• A training and certification programme with
  periodic recertification ( for operators involved
  in ESCC components manufacture)
• An appropriate failure analysis capability has to
  be established with documented procedures for the
  application of the techniques and the generation
  of reports. This capability may include the use
  of appropriate external facilities.
• A Calibration programme to meet ESCC 21500