4.1.1 ????

1
???????

• 4.1.??
• 4.2.??
• 4.3.??
• 4.4.????
• 4.5.?????

2
4.1??

• 4.1.1 ????  
• 4.2.1 ????????
• 4.3 ?????(Copper Sulfate Baths)

3
4.1.1 ????

• ?????? 
• ??8.94 ??1083?  ??2582?
• Brinell??43-103 ??1.673 l W -cm,
•  ????Cu e- ?Cu?0.52V
• Cu 2e-?Cu?0.34V?    
• ????,????,???????????????????????,?????????,??????
  ??????????????????
• ????????????????????????????
• ??????????????????????????????????????????????????
  ??????????????????????????,?????????????

4
4.2.1 ????????

• ??????
• 1.??????  
• ???
• ???????,??????????,?????????????????????,?????
• ???
• ?????????????????????

5
4.2.1 ????????

• 2.????????
• ??? 
• ??????????????????
• ??? 
• ???,??????????????,?????????,???????????,???
• P.S  ??????????,????????????,?         
  ????????,??????????????
•  

6
4.3 ?????(Copper Sulfate Baths)

• ????????(prepare)???(operate)??????
  ???,????????(printed circuits)???(electronics)
  ????(photogravure)???(electroforming)???(decorativ
  e) ?????(plating on plastics)?
• ???????,???????,????????,?????????????????????????
  ??????????????????(strike),???????(replacement
  diposits)????????

7
4.3 ?????(Copper Sulfate Baths)

• ?????????????????,?????????????????
  ?,??????????,????????(0.02?0.08wtP) ,????(copper
  anode nuggets)?????(titanium baskets)??,
  ????????(anode bag),?????????21,????????????100,
  ???????????

8
4.3 ?????(Copper Sulfate Baths)

• ?????(general formulation)  
• Copper sulfate 195-248 g/l 
• Sulfuric acid 30-75 g/l 
• Chloride 50-120 ppm 
• Current density 20-100 ASF 
• ????(bright plating)beaver ?? Copper sulfate
  210 g/l 
• Sulfuric 60 g/l 
• Chloride 50-120 ppm 
• Thiourea 0.1 g/l 
• Dextrin ?? 0.01 g/l    

9
???????????

• ???????????????,???? ?????????????100,?????????
  ??????????????????????????????(polarization)??????
  ??????? (throwing power)?
• ?????????????,????????????????(plating
  range)?????
• ??????????????(solution jet)??????????,??????????
  ?(allowable current density)???

10
???????????

• 1.?????????
•  ???????????????????????
• 2.????  
• ?????????????????????????
• 3.???? 
• ?????????????????????????
•  4.??  
• ???????????????
• 5.????
• ???????????????????????????????
• 6.?????? ???????????????????????? ??????????

11
4.2.??

• 4.2.1????
• 4.2.2????
• 4.2.3?????
• 4.2.4?????(Engineering Nickel Plating)

12
4.2.1????

• (1) ?????,?? (2) ????FCC
• (3) ??1457 C (4) ??2730 C
• (5) ???????? (6) ????????????,?600 C?????? (7)
  ??????
• (8) ???????,???????
• (9) ???????,?????????????
• (10) ??????????????????
• (11) ??????-0.25??,???,??????????????????????????
• (12) ?????????????
• (13) ?????????????

13
4.2.2????

• ?????????????????????,???????????????????
• ????????
• ?????????????????????????,????????
• ?????????????????????,???????????????(record
  stampers),??????????????????????????????

14
4.2.2????

• ??(printing screens)?????Ni2e-Ni,??Ni????????????
  ????????????100 ,????????????? Ni ??? pH???,???
  (drag-out)???Ni???,????????????????????,??????pH??
  ??????????????

15
4.2.3?????

• ???????,?????????(nickel sulfate)????(nickel
  chloride)???(boric acid)?
• ????????Ni???,???????????????,????????????????????
  (anti-pitting)????(wetting agent)???????????????,?
  ???????????????????????????????????,?????????????,
  ??????????(wattsath)?

16
4.2.4?????

• ???????????
• 1.??(tensile strength), 2.???(elongation),3.??(har
  dness), 4.???(internal), 5.????(fatigue life),
  6.???(hydrogen embrittlement) ?
• ??????????????????????????,??????????????

17
???????

• ???(watts bath)
• ??? NiSO4.7H2O 300g/l
• ??? NiCl2.6H2O60g/l
• ?? H3BO3 37.5g/l
• pH? 3 ?? 60C
• ????430A/m2

18
4.3.??

• 4.3.1????
• 4.3.2??????
• 4.3.3?????
• 4.3.4?????

19
4.3.1????

• (1) ?? ???,????? (2) ?? 1900 ?C
• (3) ?? 80010OOHB?
• (4) ???? ??0.71 ???
• (5) ?????????,????????
• (6) ??,???,????????????
• (7) ???????????
• (8) ?????????????
• (9) ???????,?480"C?????,50O ????????,700"C??????
•       

20
4.3.1????

• (12)?????????????????????
• (13)???????????????
• (14)???????, ?????????????,??????
• (15)???????,????????????,???????,?????????
  ??????????????
• (16)??????????????????????????????,??????.

21
4.3.2??????

• 1.????????
•        2.????????
•        3.?????????
•        5.??????
•        6.????
•        7.?????
•        8.?????
•        9.?????

22
4.3.3?????

• (1)????????????????????
• (2)????,?????????????
• (3)??????,????????
• (4)??????????,????????
• (5)??????????
• (6)????????????,???????(7)?????????,???????
• (8)???????,?????,??????

23
4.3.4?????

• ?????????????,????????????????,??????,?????????,??
  ??????,????????????
• ?????????????,????????????????,????????????????,??
  ?????????
• ????????????????????????,????????????????

24
4.4.????

• 4.4.1???????
• 4.4.2?????????????
• 4.4.3????

25
4.4.1???????

• ??????????????????????????????????
• ???????????,?????? (complexing agents)?????,??????
  ?????????,??????????????????,?????????200mV??????(
  code-posit)?

26
4.4.1???????

• ??????????
• (1) ??????????,?????????
• (2) ??????????
• (3) ??????,????????
• (4) pH??????????
• (5) ????????????

27
4.4.2?????????????

• ???????????????????
• (1) ???????
• (2) ???????,????????(Inert anodes)
• (3) ???????????????????,
• (4) ?????????????????
• (5) ??????????????????
• (6) ???????????

28
4.4.3????

• 1.????(Brass Plating)
• ?????????????,?????????????.
• ?????????
• ??,7080????????
• ??? Copper Cyanide 32g/l
• ??? Zinc Cyanide 10g/l
• ??? Sodium Carbonate 7.5g/l
• ? Ammonia 2.5-5ml/l
• ??? Sodium Cyanide 50g/l
• ?? 25-35C ,pH 10-10.2
• ???? 2.2A/dm2

29
??????(Nickel-Iron Plating)

• ??????????
• ??? Nickel Sulfate 37.5-225g/l
• ??? Nickel Sulfate 75-225g/l
• ?? Boric Acid 45-52.5g/l
• ??? Ferrous Sulfate 7.5-75g/l
• pH 3-4 ,?? 43-71C
• ???? 0.54-10.8A/dm2
• ?? ??
• ??? ???
• ?? ????

30
4.5.?????

• 4.5.1????????
• 4.5.2????(Plastic Plating)
• 4.5.3???????
• 4.5.4?????????

31
4.5.1????????

• ??????????(Electroplating)??????????(vacuum
  metalizing)??????(cathode sputtering)??????(metal
  spraying)?
• ???????????????????,?????????????????(roughening)?
  ?????(interlocking- surface)??????????

32
4.5.1????????

• ?????????
• 1.????(Bronzing)??????,??????????(binder),?????,?
  ??????????
• 2.???(Graphiting)??????(wax),??(rubber)??????(pol
  ymers)?,??????????
• 3.???(Metallic paints)??????(Flux)??????????(fire
  )???????,??????????
• 4.???(Metalizing)????????????(metallic
  coating)???????????????????????(Formaldehyde)???(H
  ydrazine)?????????????????

33
4.5.2????(Plastic Plating)

• ???????
• ??????????????????,??????,????????,
• ???????,???????????????,????????????
• ??????????????????

34
4.5.3???????

• (1)??(cleaning)?????????????????,????????????????
  ??
• (2)????(solvent treatment)????????(wetting)??????
  ?????(conditioner)???
• (3)????(conditioning)????????????????????????,???
  ?????
• (4)???(sensitization)?????????,??(Stannous
  Chloride)???????,??Sn?????????????????
• (5)??(nucleation)?????????????????(???)???,??????
  ????????????(seed)????????????

35
4.5.4?????????

• 1.????(conditioning)???????????
• ???? CrO3 20 g/l
• ? ? H2SO4 ??1.84 600cc/l
• ? ? 60?,?? 1530?
• 2.???(sensitizing)
•      ???? SnCL2 2040 g/l
•      ? ? HCl 1020 cc/l
• 3.??(nucleation) ????(activating)
•      ??? PdCL2 0.10.3g/l
•      ? ? HCl 35 cc/l