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5? Dielectrics and Insulators

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Title: 5? Dielectrics and Insulators


1
5? Dielectrics and Insulators
2
Preface
  • Ceramic dielectrics and insulators is a
    wide-ranging and complex topic embracing many
    types of ceramic, physical and chemical processes
    and applications.
  • Part I important ideas relating to their
    performance and the wider application of
    dielectrics and insulators (capacitors).
  • Part II important ceramic types and their
    applications.

3
Capacitative Applications
  • 5.1 Background
  • 5.2 Dielectric strength
  • 5.2.1 Test conditions
  • 5.2.2 Breakdown mechanisms
  • (a) Intrinsic breakdown
  • (b) Thermal breakdown
  • (c) Discharge breakdown
  • (d) Long-term effects

4
Background
  • Dielectrics and insulators can be defined as
    materials with high electrical resistivities.
  • Dielectricss parameters (permittivities)
    and (dissipation factors)
  • Power engineer focus on the loss factor (
    )
  • Electronics engineer focus on the dissipation
    factors ( )
  • -gt Electrical resonance phenomenon
  • Insulators are used principally to hold
    conductive elements in position and to prevent
    them from coming in contact with one another -gt
    substrates on circuits.
  • Ideal insulators 1, 0

5
Background
  • A very large number of types have been developed
    to meet particular demands
  • -gt The increase in line voltages as power
    transmission networks
  • -gt The move towards higher frequencies as
    telecommunications systems
  • The power dissipated in an insulator or a
    dielectric is proportional to frequency
  • Low-loss dielectrics for high-frequency because
    excessive power dissipation can lead to
    unacceptable rises in temperature and the
    resonances in tuned circuits become less sharp so
    that the precise selection of well-defined
    frequency bands is not possible.

6
Dielectric Strength
  • Dielectric strength the electric field
    sufficient to initiate breakdown of the
    dielectric.
  • It depends on material homogeneity, specimen
    geometry, electrode shape and disposition, stress
    mode and ambient conditions at intrinsic
    breakdown
  • Thermal breakdown is the most significant mode of
    failure and is avoided through experience rather
    than by application of theory.
  • Discharge breakdown is important in ceramics
    because it has its origins in porosity.

7
Test Conditions
  • Electric strength data are meaningful only if the
    test conditions are adequately defined.
  • DC loading rate of voltage increase
  • Pulsed voltage rise time
  • AC loading frequency and waveform

8
Test Conditions
  • Importance of sample geometry
  • (a) large volume of the specimen is stressed,
    failure is likely to be initiated from the
    electrode edges where the average electrical
    stress is magnified by a significant
  • (b) failure would probably occur at the centre
    where the stress is a maximum and known

9
1. Intrinsic Breakdown
  • Increasing voltage under well-controlled
    laboratory conditions.
  • -gt Small current begins to flow which increases
    to a saturation value.
  • -gt The voltage is further increased a stage is
    reached when the current suddenly rises steeply
    from the saturation value in a time.
  • When the field is applied the small number of
    electrons in thermal equilibrium in the
    conduction band gain kinetic energy.
  • This energy may be sufficient to ionize
    constituent ions, thus increasing the number of
    electrons participating in the process.
  • The result may be an electron avalanche and
    complete failure.

10
2. Thermal Breakdown
  • Thermal breakdown process can be described in
    terms of the thermal properties of the dielectric
  • The finite DC conductivity of a good dielectric
    results in Joule heating under Ac fields there
    is additional energy dissipation -gt Rising
    temperature leads to an increase in conductivity
    and to dielectric loss.
  • Comprehensive theory of thermal breakdown but
    solution to the governing differential equation
    can be found only for the simplest of geometries.

  • breakdown voltage

  • temperature coefficient of loss factor

  • function of specimen thickness and

  • heat transfer to the environment

11
2. Thermal Breakdown
  • Ambient temperature is reached above which
    thermal breakdown caused by joule heating arising
    from the exponentially increasing ionic
    conduction in the glassy phase is dominant

12
3. Discharge Breakdown
  • A ceramics is rarely homogeneous A common
    inhomogeneity is porosity.
  • Breakdown can be initiated at pores and the
    occurrence of gas discharges within pores is an
    important factor.

13
3. Discharge Breakdown
  • Disk-shaped cavity with its plane normal to the
    applied field E, the field within the cavity
  • Is the relative permittivity of the cavity
    gas and has a value close to unity, is the
    relative permittivity of the dielectric.
  • For a spherical pore,
  • When the voltage applied to a porous dielectric
    is increased a value is reached when a discharge
    occurs in a particular pore.

14
3. Discharge Breakdown
  • The larger the pore is the more likely it is to
    lead to breakdown.
  • Under AC conditions breakdown is more likely than
    in the case of applied DC. -gt AC breakdown
    voltages are lower than those for DC
  • Plot of density against electric breakdown in
    fig. 5.4

15
4. Long-term effects
  • In some materials the prolonged application of
    electric stress at a level well below that
    causing breakdown in the normal rapid tests
    results in an deterioration in resistivity that
    may lead to breakdown.
  • Among the possibilities are the effect of the
    weather and atmospheric pollution on the
    properties to the exposed surfaces of components.
    They will become roughened and will absorb
    increasing amounts of moisture and conductive
    impurities.
  • Local high temperatures and the sputtering of
    metallic impurities from attached conductors -gt
    Surface discharge
  • Dc stress both on the surface and in the bulk of
    materials. It may cause silver to migrate over
    surfaces and along grain boundaries, thus
    lowering resistance.
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