Discussion D2: Gigascale Integration(GSI) Interconnect Limits and N-Tier Multilevel Interconnect Architectural Solutions - PowerPoint PPT Presentation

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Discussion D2: Gigascale Integration(GSI) Interconnect Limits and N-Tier Multilevel Interconnect Architectural Solutions

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Title: Discussion D2: Gigascale Integration(GSI) Interconnect Limits and N-Tier Multilevel Interconnect Architectural Solutions


1
Discussion D2 Gigascale Integration(GSI)
Interconnect Limits and N-Tier Multilevel
Interconnect Architectural Solutions
  • Moderator Jeff A. Davis

Contributors Raguraman Venkatesan, Keith
Bowman, James Meindl
2
How extensively will interconnects limit future
designs and what are the most feasible solutions
to circumvent this problem?
3
The Interconnect Problem
 
Miniaturization does not enhance interconnect
performance!!
4
Reverse-Scaled N-Tier Architectures
Tier N
Tier 2
How will reverse scaling limit the cost per
function??
Tier 2
Tier 1
Transistor Plane
5
How do we explore future limits?
International Technology Roadmap for
Semiconductors (ITRS)
Stochastic Wire-Length Distribution based on
Rents Rule
Compact Interconnect Models for delay, crosstalk,
etc
6
Assumptions for Projections of Limits
Maintain historical trends for
  • Cost per function! (i.e. logic transistor
    density)
  • Performance! (i.e. clock frequency)
  • Technology! (e.g. minimum feature size)
  • System Complexity! (Highly-connected logic
    gates)

Question Can we wire systems with less than 10
metal levels?
7
if history continues
192M
64M
24M
8M
4M
2M
1M
8
Repeater Architectures
9.3M Repeaters
15.6M Repeaters
23.8M Repeaters
1.53M Repeaters
0.755M Repeaters
0.244M Repeaters
0.17M Repeaters
9
Major shift in design strategies?
Interconnect Transistors
Memory Transistors
?
?
?
VLSI Design Cycle???
Logic Transistors
10
Questions to guide discussion
  • Is the repeater solution acceptable?
  • What about via blockage?
  • Can we effectively plan for repeaters in a
    design?
  • Will system complexity increase or saturate?
  • How feasible are other solutions (e.g. 3-D
    integration, optics, etc..)?
  • What are some other major interconnect limits?
    (e.g. on-chip inductance, clock distribution,
    power distribution, etc)
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