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VLSI Physical Design Automation

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Title: EE382V Author: David Pan Last modified by: David Pan Created Date: 7/28/2000 8:10:49 PM Document presentation format: On-screen Show (4:3) Other titles – PowerPoint PPT presentation

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Title: VLSI Physical Design Automation


1
VLSI Physical Design Automation
Detailed Routing (III)
  • Prof. David Pan
  • dpan_at_ece.utexas.edu
  • Office ACES 5.434

2
Channel/Switch Box Routing Algorithm
  • Graph theory based algorithm
  • Yoshimura and Kuh
  • Greedy algorithm
  • Rivest and Fiduccia
  • Maze routing and its variations
  • Lee, Robin, Soukup, Ohtsuki
  • Hierarchical wire routing
  • Burstein and Pelavin

Channel routing
Channel / switchbox and general area routing
3
Over-the-Cell Routing
  • Channel width can be reduced if some nets can be
    routed outside the channel.
  • The metal layers available over the cell rows can
    be used for routing. (It is possible due to the
    limited use of the M2 metal layer within the
    cells.)
  • Commonly used in standard-cell design.

4
Two-LayerOver-the-Cell Router
  • Over-the-Cell Channel Routing, J. Cong and C.
    L. Liu, TCAD, pages 408-418, 1990.

5
Boundary Terminal Model (BTM)
Terminal Rows
VDD
GND
6
The Routing Problem
  • Boundary Terminal Model (BTM)
  • Two routing layers in the channel.
  • One routing layer for over-the-cell routing, so
    the routing must be planar.

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Hyper-terminal
  • A Hyper-terminal is a set of terminals connected
    by over-the-cell wires.

Hyper-terminals A,C, B, D,F,K, E, G,I,
H, J
A
B
C
D
E
F
G
H
I
J
K
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M
N
O
P
Q
R
S
T
U
V
L
Hyper-terminals L, M,O, N, P, Q,U,V,
R,T, S
8
Three Steps of the Algorithm
  • Routing over the cells.
  • Select a net segment from each multi-terminal net
    to be connected in the channel.
  • Routing in the channel.

9
Routing Over the Cells
  • Reduced to a Multi-Terminal Single-Layer
    One-Sided Routing Problem (MSOP).
  • Solved by dynamic programming.

10
MSOP
  • The fewer the number of hyper-terminals resulted,
    the simpler the subsequent channel routing
    problem.
  • Routing a row of terminals using a single routing
    layer on one side of the row such that the number
    of hyper-terminals is minimized.

?
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Can you give a solution for this instance?
11
MSOP
  • Can be solved by dynamic programming.
  • Consider the sub-problem from column i to j. Let
    M(i, j) be the maximum reduction in the number of
    hyper-terminals from i to j.

12
MSOP
Putting the two cases together M(i, j) ???
13
MSOP Algorithm
  • Let n be the total number of pins on the row.
  • MSOP algorithm

For i 1 to n M(i, i) 0 For j ?? to ?? For
i ?? to ?? Compute M(i, ij) Return M(1, n)
14
Runtime of MSOP
  • Let n be the total number of columns. For each
    (i, j), M(i, j) can be found in O(?) time. There
    are O(n2) pairs of (i, j). So
  • Total time O(?)

15
Selection of Net Segment
  • Need to determine which terminal within a
    hyper-terminal to be used in the subsequent
    channel routing.
  • Can be transformed to a special spanning forest
    problem.

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Pick one out of four
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16
Connectivity Graph
  • A weighted multi-graph. Each hyper-terminal is
    represented by a vertex and each net is
    re-presented by a connected component.

17
Minimum DensitySpanning Forest Problem (MDSFP)
  • Want to connect hyper-terminals of the same net
    together.
  • That is, finding a spanning tree for each
    connected component, or finding a spanning forest
    for the whole connectivity graph.
  • The goal is to minimize the channel density. This
    problem is NP-Complete.
  • Efficient heuristic is proposed.

18
Heuristic for MDSFP
  • For each edge e, let r(e) d(e)/D, where d(e) is
    the density of the interval associated with edge
    e and D is density of the whole channel. r(e)
    measures the relative degree of congestion over
    the interval associated with e.
  • The heuristics repeatedly removes edges of high
    r() from the connectivity graph until a spanning
    forest is obtained. The value of r(e) for each
    edge e is updated after each removal.

19
Via Minimization
  • In VLSI fabrication, the yield is inversely
    related to the number of vias.
  • Every via has an associated resistance that
    affects the circuit performance.
  • The size of a via is usually larger than the
    width of a wire. As a result, more vias will lead
    to more routing space.

20
Two Different Problems
  • Constrained Via Minimization (CVM)
  • Unconstrained Via Minimization (UVM)

21
Constrained Via Minimization(CVM)
  • Given a detailed routing solution, minimize the
    number of vias by assigning wire segments to
    different layers. Vias occur only at the turning
    points.
  • Also called the Layer Assignment Problem.

22
Unconstrained Via Minimization (UVM)
  • Minimize the number of vias during routing. Vias
    can occur anywhere as needed.
  • Consider an unreserved layer model for routing
    (both vertical and horizontal wires can be routed
    on the same layer in each region).

23
Topological Routing
  • UVM is also known as Topological Routing.

24
CVM and UVM
  • UVM is less popular than CVM since via
    minimization is usually considered secondary.
    Minimization of channel width, completion of
    routing, and minimization of total wirelength are
    considered more important.
  • Note modern routers usually will follow
    preferred layers. So via minimization
    essentially is to minimize the number of bends.
  • We will show CVM just to illustrate some
    algorithmic aspects of via minimization.

25
CVM by Reduction toMaximum Cut Problem
  • Optimal Layer Assignment for Interconnect, R.
    Y. Pinter, IEEE Intl Conf. Circuits and
    Computers, pages 398-401, Sept. 1982.

26
Overview
  • For two routing layers.
  • Partition the routing region into clusters such
    that no junction is of degree more than 3.
  • The problem can be transformed to finding a
    maximum cut in a graph.

27
Cluster Graph Representation
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h7
h3
h4
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Via
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28
Layer Assignment
  • In every cluster, there are only two possible
    ways to assign layers.

Class C1 Horizontal wires on layer 1 Vertical
wires on layer 2
Class C2 Horizontal wires on layer 2 Vertical
wires on layer 1
29
Assign Clusters to C1 and C2
  • If two adjacent clusters are in the same class,
    the via candidates joining them are needed.
  • If two adjacent clusters are in different
    classes, the vias candidates joining them are not
    needed.

Same Class
Different Classes
C2
C2
C2
C1
30
Example of Class Assignment
C1
C1
Cluster Graph
S1
S3
h7
C1
S4
C2
h3
h1
S2
S5
C2
C1
C1
S6
h5
h2
S7
h8
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0
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S3
S4
Original 8 vias This solution 4 vias
h7
S1
h3
h4
h6
S2
S5
h8
h2
h1
h5
S6
S7
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31
Example of Class Assignment
C1
C1
S1
S3
h7
A better solution
C2
S4
C1
h3
h1
S2
S5
C1
C2
C2
S6
h5
h2
S7
h8
32
Class Assignment Problem
  • No. of vias No. of via candidates No. of
    edges connecting a vertex in C1 and a vertex in
    C2

33
Maximum Cut Problem
  • The layer assignment problem is equivalent to the
    Maximum Cut Problem of a graph.
  • The Maximum Cut Problem is
  • NP-Complete for general graphs.
  • Solvable in polynomial time for planar graphs.
  • Hadlock 1975, SIAM Journal on Computing
  • Cluster graphs are planar.

A cut
Maximum cut A cut with the maxi- mum no. of
edges
34
Other Routing Issues
  • Gridless Routing
  • Multi-level routing
  • DSM effects

35
Gridless Detailed Routing
  • Gridless Routing
  • More flexible
  • Longer runtime due to complex data structure
  • Gridless Detailed Routing Algorithms
  • Shape (Tile) based routing Sato, et al., ISCS87,
    Margarino, et al., TCAD87, Dion, et al., WRL
    Research Report 95/3, Liu, et al., ISPD98
  • Graph-based routing Wu, et al., TC87, Ohtsuki,
    ICCAS85, Cong, et al., Zheng, et al., TCAD96,
    ICCAD99
  • Subgrid routing US Patent, 6,507,941 B1, Jan.
    2003

36
Multilevel Routing Framework (MARS TCAD05)
Detailed routing
Fine routing tile generation
  • Implicit graph gridless routing

G0
G0
G1
G1
Gk
Coarsening
Refinement
  • History-based iterative refinement
  • Multicommodity flow based algorithm

Initial routing
Courtesy Prof. Jason Cong
37
DSM Considerations
  • Antenna effects
  • Crosstalk noise
  • Interconnect optimization planning
  • Manufacturability
  • Will be covered in EE382V, Optimization Issues in
    VLSI CAD
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