Endcap Muons

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Endcap Muons

• John Layter
• US CMS Collaboration Meeting
• May 19, 2001

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Outline

• Muon System Overview
• CSC Production
• FAST Sites
• Electronics Progress
• Integration and Installation
• CPA, ETC
• Plans for the next six months
• Summary

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CMS Endcap Muon System

• 360 CSCs, not counting ME1/1 and ME4
• 144 Large CSCs (3.4x1.5 m2)
• 72 ME2/2 chambers
• 72 ME3/2 chambers
• Small CSCs (1.8x1.1 m2)
• 72 ME1/2 chambers
• 72 ME1/3 chambers
• 20o CSCs (1.9x1.5 m2)
• 36 ME2/1 chambers
• 36 ME3/1 chambers
• Frontend Electronics
• 170K Cathode channels
• 140K Anode channels
• TriggerDAQ
• (on-chamber part)
• AlignmentServices

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Endcap Muon System
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EMU - Yearly BCWS

• FY01 is the second largest year of EMU funding
• Production of chambers at Fermilab at nominal
  rate
• Purchasing of significant part of FE electronics
• Finalization of integration and installation
  design

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EMU Chamber Status

• Fermilab Site (Panels for 410 CSCs Assembly of
  148 Large CSCs)
• Panel production since 5/99 52 of chambers
  done on schedule
• CSC assembly since 6/00 32/148 large CSCs done
  2 wks late
• UF and UC Sites (Final Assembly and System
  Tests of Large CSCs)
• First 5 CSCs arrived at UC and UF long term HV
  test will start
• Begin mounting and testing electronics 9/01, 3
  mo. late
• Delivery of on-chamber electronics is on critical
  path
• PNPI Site (114 smaller CSCs)
• Critical tooling commissioned 2 chambers
  assembled
• PRRJune 7-8 start production in August
• IHEP Site (148 smaller CSCs)
• Critical tooling arrived, being commissioned,
  begin assembly
• PRRJuly 30-31 start production in September

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FNAL Factory Status - Chamber assembly at
MP9

• 32 large CSCs assembled by May 2001
• gt 20 complete
• Production at nominal rate
• On schedule

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Chamber Assembly
Gluing Station (anode bars, gap bars are glued to
panels)
Winding Station (wires are wound directly on
panels)
Soldering Station (automated soldering of wires)
Wire Tension/Spacing Station (tension and spacing
of wires are checked)
Ionized Air Knife Station (dust is removed from
wires and panels)
Assembly Station (panels are stacked to make
chamber)
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CSCs at UC FAST Site
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CSCs at UC FAST Site
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CSC Production at PNPI
Preproduction Prototype (P3) assembled at PNPI
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CSC production at IHEP

• Critical tooling received

Wire Tension measurement machine
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Functions of Electronics

• Acquire precise muon data for offline analysis
• Cathode strips precise azimuthal position (in
  bending plane) in each layer by interpolation of
  induced strip charges.
• Anode wires precise timing and coarse radial
  position.
• Generate primitives for Level 1 trigger
• Identify Local Charged Track (LCT) segments using
  cathode and anode signals.

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Electronics System Layout
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Radiation Tolerance Tests

• Measure Single Event Upset (SEU) and Total
  Ionization Dosage (TID) effects with 63 MeV
  proton beam at UC Davis.
• Measure effects due to Displacement damage of
  bipolar and biCMOS with 1MeV neutrons at OSU.
• Results
• Negligible degradation of analog performance due
  to TID (gt10kRad) or displacement (2x1012 cm-2
  neutrons).
• No latch-ups observed up to p fluence of 2x1012
  cm-2.
• SEUs in FPGAs observed and cross sections
  measured. All SEUs recoverable by reloading
  FPGAs. SEU rate at peak LHC luminosity
  manageable for CFEB, but higher for ALCT.

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On-chamber Electronics I

• Three out of four on-chamber boards designed and
  tested
• Cathode Front End Board (CFEB)
• Anode Front End Board (AFEB)
• Low Voltage Distribution Board (LVDB)
• Most of the components for these boards
  (excluding rad hard LV-regulators) procured in
  quantities sufficient to start production
• Production costs at or below estimates

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On-chamber Electronics II

• LV-regulators (CERN design, standard for LHC
  experiments) are not available. Will define the
  schedule of production of CFEB and LVDB. On
  critical path
• ALCT being redesigned using Xilinx FPGA (faster
  reloading) to deal with SEU problem.
  Preproduction boards to be delivered by September
  2001. On critical path

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Status of On-chamber Boards
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Off-chamber Electronics

• Progress made on next round of prototype boards
  and on VME custom backplane.
• Updated versions of the prototype boards will be
  delivered to the FAST sites during this summer.
• These will be used for tests of mass-produced
  on-chamber electronics assembled with chambers.

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Integration Installation

• Infrastructure
• Walkways
• Piping, cooling, cabling
• Chamber mounting
• Installation
• Fixture
• Strategy
• Schedule

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Mounting Detail
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Chamber Mounts
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Mounting Precision
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Integration and installation design

• EMU integration design advanced (mechanical, gas,
  cooling, power)
• Installation procedures
• being defined
• Installation fixture
• fully designed and built

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CSC installation fixture
Counterweight movement keeps balance w/ or w/o
chamber Chamber can rotate at any angle

Counterweight
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Chamber Production and Installation Schedule (V31)

• CMS Schedule V31 Installation of all CSCs on the
  surface at SX5, beginning in 2002.
• Very tight, advanced by 1 year compared to V30.
  Pressure on production and installation rate.

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EMU Critical Path Analysis - I

• FY01 Delivery of on-chamber electronics is on
  the critical path
• ALCT Board redesign and start of production
• Rad Hard Voltage regulators ? CFEB, LVDB
  production
• FY02 CSC assembly at FAST sites and installation
  at CERN is on the critical path

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EMU Critical Path Analysis - II

• FY03 CSC Installation (station ME3) is on the
  critical path
• short installation window (two shifts necessary)
• FY04 CSC Installation (station ME1) is on the
  critical path
• RPCs must be installed before CSCs
• HE, EE, SE, ME1/1 cables should be installed
  before CSCs
• Short installation windows (two shifts)
• Available Slack analysis
• 25-30 working days in 2002. Very tight in 2003
  2004.
• Need two shifts for production at IHEP and
  ME1/2,3 installation

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EMU Estimate to Complete
EMU Estimate to Complete 18.9 Actual Year M
Dominated by MS (mostly electronics)
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Plans for the Next 6 Months

• Continue CSC production at Fermilab.
• Start production at PNPI and IHEP.
• Continue FE electronics production.
• Start electronics assembly and begin chamber
  tests at FAST sites.
• Complete integration drawings for all chamber
  types.
• Begin preparations for receiving and installing
  chambers at CERN.

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Summary

• Nominal rate of chamber production at FNAL
  achieved. Chamber production on schedule.
• FE electronics production started first cost
  experience positive.
• LV-regulators and trigger boards on the critical
  path defines beginning of assembly at FAST
  sites.
• Endcap infrastructure designed installation
  fixture exists.
• Adequate base program support is critical to
  maintain the schedule.